公开(公告)号：US5876819A

公开(公告)日：1999-03-02

申请号：US554509

申请日：1995-11-07

申请人： Yasuhiro Kimura ,  Keiji Yamauchi ,  Hidekazu Yamamoto ,  Shigehisa Yamamoto ,  Masafumi Katsumata ,  Yasukazu Mukogawa ,  Hajime Watanabe

发明人： Yasuhiro Kimura ,  Keiji Yamauchi ,  Hidekazu Yamamoto ,  Shigehisa Yamamoto ,  Masafumi Katsumata ,  Yasukazu Mukogawa ,  Hajime Watanabe

IPC分类号： C30B33/00 ,  G03F9/00 ,  H01L23/544 ,  B32B3/02

CPC分类号： C30B29/06 ,  C30B33/00 ,  G03F9/7003 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54493 ,  H01L2924/0002 ,  Y10S438/975 ,  Y10T428/21 ,  Y10T428/216 ,  Y10T428/219

摘要： A semiconductor substrate with no reduction in the effective usage area and mechanical strength, and non-uniformity of the resist film thickness, and method of manufacturing and using the same are obtained. A detection mark for detecting the crystal orientation of a silicon wafer having an outer perimeter entirely of a circular contour is formed at a predetermined region of the silicon wafer. The crystal orientation of the semiconductor wafer can easily be detected with the outer perimeter still taking a circular contour. Therefore, various problems encountered in a conventional semiconductor substrate having an orientation flat or notch such as reduction in mechanical strength and effective usage area, and non-uniformity of the resist film can be circumvented.

摘要翻译： 获得了不降低有效使用面积和机械强度以及抗蚀剂膜厚度的不均匀性的半导体衬底及其制造和使用方法。 在硅晶片的预定区域处形成用于检测具有整个圆形轮廓的外周的硅晶片的晶体取向的检测标记。 半导体晶片的晶体取向可以容易地被检测到外周仍然采取圆形轮廓。 因此，可以避免在具有取向平面或缺口的常规半导体衬底中遇到的各种问题，例如机械强度降低和有效使用面积，以及抗蚀剂膜的不均匀性。

公开(公告)号：US4374895A

公开(公告)日：1983-02-22

申请号：US277210

申请日：1981-06-25

申请人： Tokuro Yasuda ,  Keiji Yamauchi

发明人： Tokuro Yasuda ,  Keiji Yamauchi

IPC分类号： G03G5/02 ,  G03G5/10 ,  B32B5/16 ,  G01D15/34

CPC分类号： G03G5/107 ,  G03G5/0202 ,  G03G5/104 ,  G03G5/108 ,  Y10T428/24893 ,  Y10T428/24901 ,  Y10T428/24934 ,  Y10T428/256 ,  Y10T428/273 ,  Y10T428/277 ,  Y10T428/31895 ,  Y10T428/31906 ,  Y10T428/31993

摘要： An electrostatic recording element which is capable of forming clear images thereon independently from the temperature and humidity of the ambient atmosphere, and of being stored for a long period of time without deterioration thereof, which comprises:(a) a substrate comprising paper or a synthetic polymer film;(b) a conductive layer located on a surface of said substrate and comprising (1) powdered electroconductive zinc oxide which has been doped with a member selected from the group consisting of aluminium, copper and tin, and which has a specific resistivity of from 1.times.10.sup.-1 to 1.times.10.sup.2 ohm-cm, under a pressure of 150 kg/m.sup.2, (2) an organic fluorescent brightening agent in an amount of from 0.1 to 2.0%, based on the weight of said electroconductive zinc oxide, and (3) a binding material uniformly mixed with the electroconductive zinc oxide and the organic fluorescent brightening agent; and(c) a dielectric layer located on the conductive layer and having an electrostatic recording surface.

摘要翻译： 一种静电记录元件，其能够独立于环境大气的温度和湿度形成清晰的图像，并且被长期储存而不劣化，其包括：（a）包含纸或合成的基材 聚合物膜; （b）位于所述衬底的表面上的导电层，并且包括（1）掺杂有选自铝，铜和锡的成员的粉末状导电氧化锌，并且其电阻率为1×10 -1至1×102ohm-cm，在150kg / m 2的压力下，（2）基于所述导电氧化锌的重量，0.1至2.0％的有机荧光增白剂，和（3） 与导电性氧化锌和有机荧光增白剂均匀混合的粘合材料; 和（c）位于导电层上并具有静电记录表面的电介质层。

公开(公告)号：US4964969A

公开(公告)日：1990-10-23

申请号：US405432

申请日：1989-09-11

申请人： Kenji Kusakabe ,  Keiji Yamauchi

发明人： Kenji Kusakabe ,  Keiji Yamauchi

IPC分类号： B23K35/26 ,  C23C14/34 ,  H01L21/285 ,  H01L21/31

CPC分类号： C23C14/3407 ,  B23K35/266

摘要： A semiconductor production apparatus employs a target prepared by using a solder alloy which has a limited Sn content. The solder alloy can form an alloy layer having large elongation between a metal target and a backing plate to prevent undesirable cracking and separation of target, whereby a semiconductor device can be produced with a high degree of reliability.

摘要翻译： 半导体制造装置采用通过使用Sn含量有限的焊料合金制备的靶。 焊料合金可以形成在金属靶和背板之间具有大的伸长率的合金层，以防止不期望的目标物的开裂和分离，从而可以高度可靠地制造半导体器件。

公开(公告)号：US5513428A

公开(公告)日：1996-05-07

申请号：US256863

申请日：1994-08-04

申请人： Kosuke Shiramizu ,  Atsushi Niimi ,  Hidemi Chiba ,  Tadakazu Inamori ,  Keiji Yamauchi ,  Kiyokazu Uruno ,  Takashi Ito

发明人： Kosuke Shiramizu ,  Atsushi Niimi ,  Hidemi Chiba ,  Tadakazu Inamori ,  Keiji Yamauchi ,  Kiyokazu Uruno ,  Takashi Ito

IPC分类号： B23P21/00 ,  B62D65/10 ,  B23Q15/00

CPC分类号： B23P21/008 ,  B23P21/004 ,  B62D65/10 ,  B23P2700/50 ,  Y10T29/53052 ,  Y10T29/53061 ,  Y10T29/53365 ,  Y10T29/53378 ,  Y10T29/53383 ,  Y10T29/53409 ,  Y10T29/53417

摘要： An automatic assembling apparatus automatically assembles such parts as an engine and a suspension to each work such as a car body conveyed by a conveyor. The system includes a parts truck and a screwing truck. The parts truck can be moved parallel to the conveying path of the conveyor and includes a coupling mechanism for coupling it to the conveyor and an approach truck for approaching the work while carrying the parts. The system further includes a screwing truck which can be moved parallel to the conveying path of the conveyor and includes a coupling mechanism for coupling it to the conveyor and a screwing mechanism for effecting screwing by approaching the work. The parts truck and the screwing truck are coupled to the conveyor and are moved in synchronism with the work. The parts are positioned as the approach truck approaches, and the screwing is effected as the screwing mechanism approaches. The parts are assembled without stop of the work.

摘要翻译： PCT No.PCT / JP93 / 01768 Sec。 371日期：1994年8月4日 102（e）日期1994年8月4日PCT提交1993年12月3日PCT公布。 第WO94 / 13430BC号公报 日期：1994年6月23日。自动装配装置将诸如发动机和悬架的部件自动组装到每个工件，例如由输送机输送的车身。 该系统包括零件卡车和螺丝车。 零件卡车可以平行于输送机的运输路径移动，并且包括用于将其连接到输送机的联接机构和用于在承载部件的同时接近工作的进近卡车。 该系统还包括可以平行于输送机的输送路径移动的螺丝车，并且包括用于将其连接到输送机的联接机构和用于通过接近工作来实现螺丝拧紧的机构。 零件卡车和螺丝车与输送机相连，并与工件同步移动。 随着接近的卡车接近，这些部件被定位，并且随着螺丝机构的接近而进行螺丝拧紧。 零件组装而不用停止工作。