发明授权
US5887345A Method for applying curable fill compositon to apertures in a substrate
失效
将可固化填充组合物施加到基底中的孔的方法
- 专利标题： Method for applying curable fill compositon to apertures in a substrate
- 专利标题（中）： 将可固化填充组合物施加到基底中的孔的方法
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申请号： US960770申请日： 1997-10-30
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公开(公告)号： US5887345A公开(公告)日： 1999-03-30
- 发明人: Joseph Duane Kulesza , Voya Rista Markovich , Kostas Papathomas , Joseph Gene Sabia
- 申请人： Joseph Duane Kulesza , Voya Rista Markovich , Kostas Papathomas , Joseph Gene Sabia
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： B32B7/04
- IPC分类号： B32B7/04 ; C08G59/40 ; C08G73/00 ; C08L63/00 ; C09D163/00 ; H01B1/20 ; H01B1/22 ; H01B1/24 ; H05K1/09 ; H05K1/11 ; H05K1/16 ; H05K3/00 ; H05K3/40 ; H05K3/12 ; H05K3/34 ; H05K3/42
摘要：
The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.
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