发明授权
- 专利标题： Tungsten-copper composite powder
- 专利标题（中）： 钨铜复合粉末
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申请号： US784159申请日： 1997-01-15
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公开(公告)号： US5956560A公开(公告)日： 1999-09-21
- 发明人: Leonid P. Dorfman , David L. Houck , Michael J. Scheithauer , Muktesh Paliwal , Gail T. Meyers , Frank J. Venskytis
- 申请人： Leonid P. Dorfman , David L. Houck , Michael J. Scheithauer , Muktesh Paliwal , Gail T. Meyers , Frank J. Venskytis
- 申请人地址： MA Danvers
- 专利权人： Osram Sylvania Inc.
- 当前专利权人： Osram Sylvania Inc.
- 当前专利权人地址： MA Danvers
- 主分类号： B22F1/00
- IPC分类号： B22F1/00 ; B22F1/02 ; B22F9/22 ; C01G41/00 ; C04B41/51 ; C04B41/88 ; C22C1/04 ; H01H1/025 ; H01L23/498 ; H05K1/09
摘要：
A high performance W--Cu composite powder which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungsten-coated copper composite powder may be pressed and sintered into W--Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry.
公开/授权文献
- US5268705A Image printing device 公开/授权日：1993-12-07
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