发明授权
- 专利标题： Mounting structure for an integrated circuit
- 专利标题（中）： 集成电路的安装结构
-
申请号： US885902申请日： 1997-06-30
-
公开(公告)号： US5973927A公开(公告)日： 1999-10-26
- 发明人: Shinji Tanaka
- 申请人： Shinji Tanaka
- 申请人地址： JPX Tokyo
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX8-171420 19960701
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/36 ; H01L23/498 ; H01L23/50 ; H05K1/02 ; H05K3/34 ; H05K3/36 ; H05K7/02
摘要：
A mounting structure for an integrated circuit device comprises a first substrate, a second substrate and an insulator. The first substrate contains conductive wiring electrically connected to the integrated circuit device. The first substrate is mounted on the second substrate which have a ground pattern. The insulator is provided between the conductive wiring and the ground pattern.
公开/授权文献
信息查询
IPC分类:
