发明授权
- 专利标题： Ceramic ball grid array using in-situ solder stretch
- 专利标题（中）： 陶瓷球栅阵列使用原位焊料拉伸
-
申请号： US909865申请日： 1997-08-12
-
公开(公告)号： US5975409A公开(公告)日： 1999-11-02
- 发明人: Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
- 申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H05K3/34 ; B23K31/02 ; B23K37/04
摘要：
A method and apparatus is provided for forming an elongated solder joint between two soldered substrates of an electronic module by applying a controlled separating force between the two soldered substrates during and/or after heating of the module. The solder joints are plasticized, preferably to the molten state above the liquidus temperature, and are thereby stretched and the module is then cooled to solidify the stretched joints. An apparatus and method are provided which preferably uses a vacuum device as the separating force to stretch the existing solder joints to the desired solder height and configuration which is preferably an hour-glass shape.
公开/授权文献
- US5273405A Fluid cushioning apparatus for hydraulic intensifier assembly 公开/授权日：1993-12-28
信息查询
IPC分类:
