公开(公告)号：US06335210B1

公开(公告)日：2002-01-01

申请号：US09466607

申请日：1999-12-17

申请人： Mukta S. Farooq ,  Raymond A. Jackson ,  Sarah H. Knickerbocker ,  Sudipta K. Ray

发明人： Mukta S. Farooq ,  Raymond A. Jackson ,  Sarah H. Knickerbocker ,  Sudipta K. Ray

IPC分类号： H01L2166

CPC分类号： G01R31/2863 ,  H01L2224/16225 ,  H01L2924/15311

摘要： The present invention relates generally to a new structure and method for chip burn-in and/or testing. More particularly, the invention encompasses a baseplate that is secured to a delicate chip and a method for such an invention is also disclosed. The inventive baseplate provides an added strength to a complex chip while it is being tested and/or burned-in, and then during normal use the baseplate of this invention is an integrated component of the chip.

摘要翻译： 本发明一般涉及用于芯片老化和/或测试的新结构和方法。 更具体地，本发明包括固定到精细芯片上的底板，并且还公开了用于这种发明的方法。 本发明的基板在被测试和/或燃烧时提供了对复合芯片的附加强度，然后在正常使用期间，本发明的底板是芯片的集成部件。

公开(公告)号：US06278184B1

公开(公告)日：2001-08-21

申请号：US09400783

申请日：1999-09-22

申请人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

发明人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

IPC分类号： H01L2348

CPC分类号： H01L24/12 ,  B23K1/0016 ,  B23K2101/42 ,  H01L23/10 ,  H01L23/50 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K2201/1025 ,  H05K2201/10992 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00

摘要： A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

公开(公告)号：US6070321A

公开(公告)日：2000-06-06

申请号：US890458

申请日：1997-07-09

申请人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

发明人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

IPC分类号： B23K1/00 ,  B23K35/14 ,  H01L21/60 ,  H01L23/10 ,  H01L23/50 ,  H05K3/34

CPC分类号： H01L24/12 ,  B23K1/0016 ,  H01L23/10 ,  H01L23/50 ,  H01L24/16 ,  H01L24/81 ,  H05K3/3436 ,  B23K2201/42 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/1025 ,  H05K2201/10992 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49144

摘要： A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

摘要翻译： 提供焊料预成型件，用于在多层陶瓷基片之间形成互连，包括上层和下层焊料，该材料由可由焊料润湿的材料的中间层分开，并且在用于回流焊料的温度下不熔化，形成 连接。 焊料预成型件用于连接基板，并且特别可用于同时电连接基板并且在被接合的基板之间形成气密密封。

公开(公告)号：US5964396A

公开(公告)日：1999-10-12

申请号：US909801

申请日：1997-08-12

申请人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

发明人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

IPC分类号： H01L23/12 ,  B23K3/06 ,  H01L21/60 ,  H05K3/34 ,  B23K31/02 ,  B23K37/04

CPC分类号： B23K3/0638 ,  H05K3/3436 ,  B23K2201/36 ,  H01L2924/00013 ,  H01L2924/0002 ,  H05K2203/0195 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613

摘要： A device is provided for stretching solder interconnection joints between two substrates of an electronic module. The device employs an expandable metal to exert a separating (stretching) force to the two substrates whereby a lifting rod attached to a clamping bridge is cause to move upwards by expansion of the expandable metal raising a first substrate clamped thereto. A lifting bridge in connection with the clamping bridge is caused to move downward to maintain the lifting bridge in contact with the second substrate being interconnected to the first substrate.

摘要翻译： 提供一种用于在电子模块的两个基板之间拉伸焊料互连接头的装置。 该装置使用可膨胀金属对两个基板施加分离（拉伸）力，借此通过膨胀可膨胀金属的方式使附接到夹紧桥的提升杆向上移动，从而提升夹持在其上的第一基板。 引起与夹紧桥连接的升降桥向下运动，以使升降桥与第二基板相互接触而与第一基板互连。

公开(公告)号：US06541305B2

公开(公告)日：2003-04-01

申请号：US09892806

申请日：2001-06-27

申请人： Mukta G. Farooq ,  Raymond A. Jackson

发明人： Mukta G. Farooq ,  Raymond A. Jackson

IPC分类号： H01L2144

CPC分类号： H01L24/11 ,  H01L21/6835 ,  H01L24/81 ,  H01L2224/10135 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/1183 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3511 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/10568 ,  H05K2201/2036 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/00

摘要： A method of joining first and second substrates through a solder element interconnect, the method including the steps of forming solder elements, such as solder balls, in a first array on a first substrate, forming pads of solder paste in a second array on a second substrate wherein the first and second arrays are mirror images of one another, establishing a standoff element on one of the first or second substrates, assembling the first and second substrates such that each of the solder elements on the first substrate are embedded in each of the solder paste pads and the standoff element is interposed between the first and second substrates, heating the first and second substrates at a preferred temperature to cause melting of the solder elements and the solder pads into single solder elements, wherein the standoff controls the separation distance between the first and second substrates.

摘要翻译： 一种通过焊料元件互连连接第一和第二衬底的方法，所述方法包括以下步骤：在第一衬底上以第一阵列形成诸如焊料球的焊料元件，在第二衬底上形成第二阵列中的焊膏焊盘 衬底，其中第一和第二阵列是彼此的镜像，在第一或第二衬底之一上建立支座元件，组装第一和第二衬底，使得第一衬底上的每个焊料元件嵌入每个衬底 焊膏焊盘和支座元件插入在第一和第二基板之间，在优选的温度下加热第一和第二基板，以使焊料元件和焊盘熔化成单个焊料元件，其中支座控制第一和第二基板之间的间隔距离 第一和第二基板。

公开(公告)号：US06458623B1

公开(公告)日：2002-10-01

申请号：US09765030

申请日：2001-01-17

申请人： Lewis S. Goldmann ,  Mario J. Interrante ,  Raymond A. Jackson ,  Amy B. Ostrander ,  Charles H. Perry ,  Brenda L. Peterson

发明人： Lewis S. Goldmann ,  Mario J. Interrante ,  Raymond A. Jackson ,  Amy B. Ostrander ,  Charles H. Perry ,  Brenda L. Peterson

IPC分类号： H01L2144

CPC分类号： H01L24/83 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/30107 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/09472 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A method and apparatus is provided for forming an electronic assembly whereby an insulating polymer matrix having a plurality of conductor holes is attached to a first substrate wherein the conductor holes align with a corresponding contact array on the first substrate. Subsequently, a flexible, electrically conductive adhesive is provided within the plurality of conductor holes and a solid conductive material, preferably having a high melting temperature, is attached to at least one end thereof. The insulating polymer matrix with the electrically conductive adhesive and the solid conductive material is then cured at a temperature sufficient to completely cure the matrix to completely surround the electrically conductive adhesive, as well as permanently attaching the matrix and conductive adhesive to the first substrate and permanently attaching the solid conductive material to the conductive adhesive. A second substrate may then be attached to the conductive matrix structure secured to the first substrate by providing a low melting temperature attachment means to the solid conductive material attached to the matrix and subsequently reflowing the assembly to form an electronic assembly adapted with the capability of reworkability.

摘要翻译： 提供了一种用于形成电子组件的方法和装置，由此具有多个导体孔的绝缘聚合物基体附接到第一基底，其中导体孔与第一基底上的对应的接触阵列对准。 随后，在多个导体孔内提供柔性的导电粘合剂，并且其至少一端连接有优选具有高熔融温度的固体导电材料。 然后将具有导电粘合剂和固体导电材料的绝缘聚合物基质在足以完全固化基质以完全包围导电粘合剂的温度下固化，以及将基质和导电粘合剂永久地附着到第一基材上并永久地 将固体导电材料附着到导电粘合剂上。 然后可以通过向连接到基质的固体导电材料提供低熔点温度的附着装置，随后回流组件以形成适于具有再加工性能的电子组件，然后将第二衬底附接到固定到第一衬底的导电矩阵结构 。

公开(公告)号：US06360938B1

公开(公告)日：2002-03-26

申请号：US09794597

申请日：2001-02-27

申请人： Stephen A. DeLaurentis ,  Mario J. Interrante ,  Raymond A. Jackson ,  John U. Knickerbocker ,  Sudipta K. Ray ,  Kathleen A. Stalter

发明人： Stephen A. DeLaurentis ,  Mario J. Interrante ,  Raymond A. Jackson ,  John U. Knickerbocker ,  Sudipta K. Ray ,  Kathleen A. Stalter

IPC分类号： B23K1018

摘要： A process and apparatus for removing flip chips with C4 joints mounted on a multi-chip module by applying a tensile force to one or more removal member bonded to the back of one or more flip chips during heating of the module to a temperature sufficient to cause the C4 joints to become molten. The tensile force can either be a compressed spring, or a bi-metallic member which is flat at room temperature and becomes curved when heated to such temperature, or a memory alloy whose original shape is curved and which is bent flat at room temperature but returns to its original curved shape when heated to such temperature. An adhesive is used to bond the removal member to the chip to be removed and is a low temperature, fast curing adhesive with high temperature tolerance after curing.

公开(公告)号：US06283359B1

公开(公告)日：2001-09-04

申请号：US09644486

申请日：2000-08-23

申请人： Peter J. Brofman ,  Mark G. Courtney ,  Shaji Farooq ,  Mario J. Interrante ,  Raymond A. Jackson ,  Gregory B. Martin ,  Sudipta K. Ray ,  William E. Sablinski ,  Kathleen A. Stalter

发明人： Peter J. Brofman ,  Mark G. Courtney ,  Shaji Farooq ,  Mario J. Interrante ,  Raymond A. Jackson ,  Gregory B. Martin ,  Sudipta K. Ray ,  William E. Sablinski ,  Kathleen A. Stalter

IPC分类号： B23K3102

CPC分类号： H01L24/12 ,  B23K35/0222 ,  B23K35/0244 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/1184 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0435 ,  Y02P70/613 ,  Y10T428/12687 ,  Y10T428/2991 ,  H01L2224/29099 ,  H01L2924/00

摘要： This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.

摘要翻译： 本发明涉及一种焊料结构，当用于特别是在第二层（例如BGA和CGA互连）的基材上时，其提供增强的疲劳寿命特性。 焊料结构优选是球形或柱状，并且具有可被焊料润湿的金属层，并且该结构用于在电子部件中形成焊接连接​​，例如连接诸如连接到MLC的芯片的电子模块，该模块连接到电路 板。 焊料结构优选地在金属层上具有焊料的外涂层，以向金属层提供钝化涂层以保持其免于氧化和腐蚀，并且还提供用于将焊料结构附着到衬底的焊盘上的焊料的可润湿表面 被绑定。

公开(公告)号：US5446961A

公开(公告)日：1995-09-05

申请号：US137547

申请日：1993-10-15

申请人： James M. Levite ,  Michael Berger ,  Richard L. Chartrand ,  Mary A. Emmett ,  Raymond A. Jackson ,  James J. Petrone ,  Richard F. Shortt ,  Roger A. Stinemire

发明人： James M. Levite ,  Michael Berger ,  Richard L. Chartrand ,  Mary A. Emmett ,  Raymond A. Jackson ,  James J. Petrone ,  Richard F. Shortt ,  Roger A. Stinemire

IPC分类号： H01L21/48 ,  H05K1/00 ,  H05K1/09 ,  H05K3/00 ,  H05K3/10 ,  H05K3/22 ,  H05K3/46 ,  H01K3/10

CPC分类号： H05K3/222 ,  H01L21/485 ,  H05K3/225 ,  H05K1/0298 ,  H05K1/095 ,  H05K2201/10287 ,  H05K2203/0769 ,  H05K2203/107 ,  H05K2203/121 ,  H05K2203/1338 ,  H05K2203/173 ,  H05K3/0017 ,  H05K3/107 ,  H05K3/4685 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49167 ,  Y10T29/49742

摘要： The present invention relates generally to a new structure and a method for repairing semiconductor substrates, and more particularly, the invention encompasses a structure and a method for repairing Printed Circuit Boards or other electronic substrates by providing electrical lines on the defective board. On a substrate that has an open or an electrical discontinuity, after the discontinuity has been established, a portion of the electrical line across from the electrical discontinuity are exposed and one or more trenches or grooves are made between the two or more exposed portions of the electrical line. The two exposed portions of the exposed electrical line is then joined by either an electrical wire that is routed through the trench or using a standard deposition process one or more metals or material are deposited in the open trench to provide or restore electrical continuity and the excess deposition material is removed. This invention also provides means for impedance matching of the net that is repaired.

摘要翻译： 本发明一般涉及用于修复半导体衬底的新结构和方法，更具体地，本发明包括通过在缺陷板上提供电线来修复印刷电路板或其它电子衬底的结构和方法。 在具有开放或电气不连续性的基板上，在不连续性已经建立之后，从电气不连续部分横跨的一部分电线被暴露，并且在两个或多个暴露部分之间形成一个或多个沟槽或凹槽 电线。 暴露的电线的两个暴露部分然后通过通过沟槽穿过的电线或使用标准沉积工艺连接，一个或多个金属或材料沉积在开放沟槽中，以提供或恢复电连续性， 去除沉积材料。 本发明还提供了用于修复网络的阻抗匹配的装置。

公开(公告)号：US6158644A

公开(公告)日：2000-12-12

申请号：US70163

申请日：1998-04-30

申请人： Peter J. Brofman ,  Mark G. Courtney ,  Shaji Farooq ,  Mario J. Interrante ,  Raymond A. Jackson ,  Gregory B. Martin ,  Sudipta K. Ray ,  William E. Sablinski ,  Kathleen A. Stalter

发明人： Peter J. Brofman ,  Mark G. Courtney ,  Shaji Farooq ,  Mario J. Interrante ,  Raymond A. Jackson ,  Gregory B. Martin ,  Sudipta K. Ray ,  William E. Sablinski ,  Kathleen A. Stalter

IPC分类号： H01L23/12 ,  B23K35/02 ,  B23K35/14 ,  H01L21/60 ,  H01L23/498 ,  H05K3/34 ,  B23K35/24 ,  B23K35/26

CPC分类号： H01L24/12 ,  B23K35/0222 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H05K3/3436 ,  B23K35/0244 ,  H01L2224/1184 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0435 ,  Y02P70/613 ,  Y10T428/12687 ,  Y10T428/2991

摘要： This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.

摘要翻译： 本发明涉及一种焊料结构，当用于特别是在第二层（例如BGA和CGA互连）的基材上时，其提供增强的疲劳寿命特性。 焊料结构优选是球形或柱状，并且具有可被焊料润湿的金属层，并且该结构用于在电子部件中形成焊接连接​​，例如连接诸如连接到MLC的芯片的电子模块，该模块连接到电路 板。 焊料结构优选地在金属层上具有焊料的外涂层，以向金属层提供钝化涂层以保持其免于氧化和腐蚀，并且还提供用于将焊料结构附着到衬底的焊盘上的焊料的可润湿表面 被绑定。