Invention Grant
- Patent Title: Multi-chip heat-sink cap assembly
- Patent Title (中): 多芯片散热帽组件
-
Application No.: US12071Application Date: 1998-01-22
-
Publication No.: US5981310APublication Date: 1999-11-09
- Inventor: Giulio DiGiacomo , Stephen S. Drofitz, Jr. , David L. Edwards , Larry D. Gross , Sushumna Iruvanti , Raed A. Sherif , Subhash L. Shinde , David J. Womac , David B. Goland , Lester W. Herron
- Applicant: Giulio DiGiacomo , Stephen S. Drofitz, Jr. , David L. Edwards , Larry D. Gross , Sushumna Iruvanti , Raed A. Sherif , Subhash L. Shinde , David J. Womac , David B. Goland , Lester W. Herron
- Applicant Address: NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: NY Armonk
- Main IPC: H01L23/433
- IPC: H01L23/433 ; H01L25/065 ; H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.
Public/Granted literature
- USD357721S Cover for a pedestal mounted bowling scorer Public/Granted day:1995-04-25
Information query
IPC分类:
