发明授权
- 专利标题： Tacking processes and systems for soldering
- 专利标题（中）： 焊接工艺和系统
-
申请号： US724910申请日： 1996-10-02
-
公开(公告)号： US5992729A公开(公告)日： 1999-11-30
- 发明人: Nicholas G. Koopman , Sundeep Nangalia
- 申请人： Nicholas G. Koopman , Sundeep Nangalia
- 申请人地址： NC Research Triangle Park
- 专利权人： MCNC
- 当前专利权人： MCNC
- 当前专利权人地址： NC Research Triangle Park
- 主分类号： B23K1/06
- IPC分类号： B23K1/06 ; H05K3/34 ; B23K1/20 ; B23K31/02
摘要：
A first component is soldered to a second component by placing the first component on the second component with solder therebetween, then ultrasonically vibrating at least one of the first and second components to thereby tack the solder to at least one of the first and second components, and by reflowing the solder. Ultrasonic vibration of at least one of the first and second components to thereby tack the solder is preferably performed for less than one second. A component placer places the first component on the second component with solder therebetween. An ultrasonic vibrator ultrasonically vibrates at least one of the placed first and second components, to thereby tack the solder to at least one of the placed first and second components. A solder reflower reflows the tacked solder to thereby solder the first component to the second component.
公开/授权文献
信息查询
IPC分类:
