发明授权
- 专利标题： Microelectronic component with rigid interposer
- 专利标题（中）： 具有刚性插入器的微电子元件
-
申请号： US978082申请日： 1997-11-25
-
公开(公告)号： US6002168A公开(公告)日： 1999-12-14
- 发明人: Pieter H. Bellaar , Thomas H. DiStefano , Joseph Fjelstad , Christopher M. Pickett , John W. Smith
- 申请人： Pieter H. Bellaar , Thomas H. DiStefano , Joseph Fjelstad , Christopher M. Pickett , John W. Smith
- 申请人地址： CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： CA San Jose
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H05K3/28 ; H05K3/34 ; H05K3/40 ; H01L23/48 ; H01L23/06 ; H01L23/52
摘要：
A microelectronic component for mounting a rigid substrate, such as a hybrid circuit to a rigid support substrate, such as a printed circuit board. The microelectronic component includes a rigid interposer which may have a chip mounted on its first surface; a pattern of contacts on the rigid interposer; a flexible interposer overlying the second surface of the rigid interposer; a pattern of terminals on the flexible interposer; flexible leads; and solder coated copper balls mounted on the flexible interposer. The microelectronic component may have a socket assembly mounted on the first surface of the rigid interposer. The microelectronic component may be mounted on a rigid support substrate.
信息查询
IPC分类:
