发明授权
US6002181A Structure of resin molded type semiconductor device with embedded
thermal dissipator
失效
具有嵌入式散热器的树脂模制型半导体器件的结构
- 专利标题： Structure of resin molded type semiconductor device with embedded thermal dissipator
- 专利标题（中）： 具有嵌入式散热器的树脂模制型半导体器件的结构
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申请号： US551917申请日： 1995-10-23
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公开(公告)号： US6002181A公开(公告)日： 1999-12-14
- 发明人: Etsuo Yamada , Yasushi Shiraishi , Hiroshi Kawano , Shinji Ohuchi , Hidekazu Nasu
- 申请人： Etsuo Yamada , Yasushi Shiraishi , Hiroshi Kawano , Shinji Ohuchi , Hidekazu Nasu
- 申请人地址： JPX Tokyo
- 专利权人： Oki Electric Industry Co., Ltd.
- 当前专利权人： Oki Electric Industry Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX6-273262 19941108
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/433 ; H01L23/495 ; H01L23/28
摘要：
A resin molded type semiconductor device has an inner portion sandwiched between two outer surfaces. The device includes a chip support with a first, inwardly facing surface and a second, outwardly facing surface. The device also includes a semiconductor element with a first, inwardly facing surface and a second, outwardly facing surface. The respective first surfaces of the chip support and semiconductor element are fixed to each other. A mold resin is provided to seal the entire semiconductor device except for the respective second surfaces of the chip support and semiconductor element which remain exposed as part of the two outer surfaces of the device, in order to keep the semiconductor device thin.
公开/授权文献
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