发明授权
US6006426A Method of producing a multichip package module in which rough-pitch and
fine-pitch chips are mounted on a board
失效
一种多芯片封装模块的制造方法，其中将粗间距和细间距芯片安装在板上
- 专利标题： Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board
- 专利标题（中）： 一种多芯片封装模块的制造方法，其中将粗间距和细间距芯片安装在板上
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申请号： US26490申请日： 1998-02-19
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公开(公告)号： US6006426A公开(公告)日： 1999-12-28
- 发明人: Hidehiko Kira , Kenji Kobae , Norio Kainuma , Naoki Ishikawa , Satoshi Emoto
- 申请人： Hidehiko Kira , Kenji Kobae , Norio Kainuma , Naoki Ishikawa , Satoshi Emoto
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX9-248988 19970912
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/58 ; H01L21/60 ; H01L21/603 ; H01L25/04 ; H01L25/18 ; H05K3/30
摘要：
In a method of production of a multichip package module, rough-pitch bare chips are positioned at first locations on a printed-circuit board, and the rough-pitch bare chips are temporarily attached to the board at the first locations. The rough-pitch bare chips are mounted on the board at the same time by applying heat and pressure to the rough-pitch bare chips simultaneously. A respective one of fine-pitch bare chips is positioned at a respective one of second locations on the board other than the first locations, and the respective one of the fine-pitch bare chips is mounted on the board by applying heat and pressure to the fine-pitch bare chips individually, in order to produce the multichip package module.
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