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US6009545A System for analyzing a failure in a semiconductor wafer by calculating correlation coefficient between collated data of defects per prescribed unit and failures per prescribed unit 有权
用于通过计算每个规定单位的缺陷的整理数据与每个规定单位的故障之间的相关系数来分析半导体晶片中的故障的系统

System for analyzing a failure in a semiconductor wafer by calculating correlation coefficient between collated data of defects per prescribed unit and failures per prescribed unit
摘要：
Data containing defect position coordinates obtained based on the result of physical inspection of foreign material, a defect or the like at the surface of a semiconductor wafer by a defect inspecting apparatus is stored. Also stored is data of physical coordinates obtained based on fail bit data from a tester. Data indicating an additional failure region is produced by an additional failure region estimating apparatus based on the fail bit data, and is stored. Collation produces data of corrected physical position coordinates by adding the stored data of limitation by failure mode to the stored data of physical position coordinates, and collates the data of corrected physical position coordinates with stored data of defect position coordinates. Accordingly, accuracy in collation is improved, and failure can be analyzed even if caused not by a defect located at an address of the failure obtained by the fail bit data but by a defect relating to the defect located at the address of a failure.
摘要（中）：

存储包含基于异物的物理检查结果，缺陷检查装置在半导体晶片的表面处的缺陷等的缺陷位置坐标的数据。 还存储了基于来自测试器的故障位数据获得的物理坐标的数据。 指示附加故障区域的数据由基于故障位数据的附加故障区域估计装置产生，并被存储。 通过将存储的故障模式的限制数据与所存储的物理位置坐标的数据相加，校正生成校正的物理位置坐标的数据，并且将校正的物理位置坐标的数据与存储的缺陷位置坐标的数据进行比较。 因此，排序的精度提高，即使不是由故障位数据所获得的故障的地址而是由于位于故障地址处的缺陷引起的缺陷引起的故障也可以被分析。

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