公开(公告)号：US06819788B2

公开(公告)日：2004-11-16

申请号：US10288519

申请日：2002-11-06

申请人： Fumihito Ohta

发明人： Fumihito Ohta

IPC分类号： G06K900

CPC分类号： G01R31/31935 ,  G11C29/56 ,  G11C2029/5604 ,  G11C2029/5606

摘要： A failure analysis method is provided that allows high-precision failure mode classification. Based on the result of a predetermined test using an LSI tester (2), an original FBM (27a) is generated. The FBM (27a) is compressed with 8×8 bits per pixel to generate an FBM (27b). Based on the FBM (27b), an area where a failure bit exists in the FBM (27a) is determined. Then, by compressing a portion of the FBM (27a) which corresponds to the above area with 2×2 bits per pixel, FBMs (27c, 27d) are generated. Based on the FBMs (27c, 27d), failure bits are determined.

摘要翻译： 提供了允许高精度故障模式分类的故障分析方法。 基于使用LSI测试器（2）的预定测试的结果，生成原始FBM（27a）。 FBM（27a）以每像素8×8位被压缩以产生FBM（27b）。 基于FBM（27b），确定在FBM（27a）中存在故障位的区域。 然后，通过以与每个像素2x2位相对应的上述区域的FBM（27a）的一部分压缩，生成FBM（27c，27d）。 基于FBM（27c，27d），确定故障位。

公开(公告)号：US6108253A

公开(公告)日：2000-08-22

申请号：US401848

申请日：1999-09-22

申请人： Fumihito Ohta

发明人： Fumihito Ohta

IPC分类号： G11C29/44 ,  G06F11/25 ,  G11C29/00

CPC分类号： G06F11/2257

摘要： An EWS for data analysis automatically performs automatic fatal failure extract processing on the basis of FBM information accumulated in a computer for a tester. In the automatic fatal failure extract processing, X-line repair judgment processing and Y-line repair judgment processing are continuously performed so that the X-line repair processing is performed in consideration of failures in a Y-line direction, and the Y-line repair judgment processing is performed in consideration of failures in an X-line direction. Further, the failures in the Y-line and X-line directions are taken into consideration from maximum ability decided by Y-line substitutability and X-line substitutability to zero. Thus provided is a failure analysis system capable of automatically investigating the cause for fatal failures.

摘要翻译： 用于数据分析的EWS基于在测试仪的计算机中累积的FBM信息自动执行自动致命故障提取处理。 在自动致命故障提取处理中，连续执行X线修复判断处理和Y线修复判断处理，以便考虑Y线方向的故障进行X线修复处理，Y线 考虑X线方向的故障进行修理判断处理。 此外，由Y线替代性和X线替代性决定为零的最大能力考虑Y线和X线方向的故障。 因此提供了能够自动调查致命故障原因的故障分析系统。

公开(公告)号：US5844850A

公开(公告)日：1998-12-01

申请号：US619396

申请日：1996-03-21

申请人： Toshikazu Tsutsui ,  Tohru Koyama ,  Fumihito Ohta ,  Yasukazu Mukogawa ,  Masaaki Furuta ,  Yohji Mashiko

发明人： Toshikazu Tsutsui ,  Tohru Koyama ,  Fumihito Ohta ,  Yasukazu Mukogawa ,  Masaaki Furuta ,  Yohji Mashiko

IPC分类号： G01R31/26 ,  G01N21/88 ,  G01N21/94 ,  G01N21/956 ,  G01R31/28 ,  G06F11/22 ,  H01L21/02 ,  H01L21/66

CPC分类号： H01L22/20 ,  G01R31/2831 ,  G06F11/2205 ,  H01L2924/0002

摘要： Data containing defect position coordinates obtained based on the result of physical inspection of a foreign material, a defect and the like at a surface of a semiconductor wafer by a defect inspecting apparatus is stored in storage means. Data of physical position coordinates obtained based on fail bit data from a tester is stored in storage means. Data indicating an additional failure region is produced by additional failure region estimating means based on the fail bit data, and is stored in storage means. Collating means produces data of corrected physical position coordinates by adding the data of limitation by failure mode stored in storage means to the data of physical position coordinates stored in storage means, and collates the data of corrected physical position coordinates with data of defect position coordinates stored in storage means. Accordingly, accuracy in collation is improved, and therefore, a failure can be analyzed even if the failure is not caused by a defect located at an address of the failure obtained by the fail bit data but by a defect relating to the defect located at the address of a failure. As a result, accuracy in estimation is improved.

摘要翻译： 通过缺陷检查装置将基于异物的物理检查结果，缺陷等的缺陷位置坐标数据存储在半导体晶片的表面。 基于来自测试器的故障位数据获得的物理位置坐标的数据被存储在存储装置中。 指示附加故障区域的数据由附加故障区域估计装置基于故障位数据产生，并存储在存储装置中。 整理装置通过将存储在存储装置中的故障模式的限制数据与存储在存储装置中的物理位置坐标的数据相加来产生经校正的物理位置坐标的数据，并将校正的物理位置坐标的数据与存储的缺陷位置坐标数据进行比较 在存储装置中。 因此，排序规则的精度提高，因此，即使故障不是由故障位数据所获得的故障的地址的缺陷引起的，也是由位于 失败的地址 结果，提高了估计精度。

公开(公告)号：US6009545A

公开(公告)日：1999-12-28

申请号：US182526

申请日：1998-10-30

申请人： Toshikazu Tsutsui ,  Tohru Koyama ,  Fumihito Ohta ,  Yasukazu Mukogawa ,  Masaaki Furuta ,  Yohji Mashiko

发明人： Toshikazu Tsutsui ,  Tohru Koyama ,  Fumihito Ohta ,  Yasukazu Mukogawa ,  Masaaki Furuta ,  Yohji Mashiko

IPC分类号： G01R31/28 ,  G06F11/22 ,  H01L21/66 ,  G06F11/00

CPC分类号： H01L22/20 ,  G01R31/2831 ,  G06F11/2205

摘要： Data containing defect position coordinates obtained based on the result of physical inspection of foreign material, a defect or the like at the surface of a semiconductor wafer by a defect inspecting apparatus is stored. Also stored is data of physical coordinates obtained based on fail bit data from a tester. Data indicating an additional failure region is produced by an additional failure region estimating apparatus based on the fail bit data, and is stored. Collation produces data of corrected physical position coordinates by adding the stored data of limitation by failure mode to the stored data of physical position coordinates, and collates the data of corrected physical position coordinates with stored data of defect position coordinates. Accordingly, accuracy in collation is improved, and failure can be analyzed even if caused not by a defect located at an address of the failure obtained by the fail bit data but by a defect relating to the defect located at the address of a failure.

摘要翻译： 存储包含基于异物的物理检查结果，缺陷检查装置在半导体晶片的表面处的缺陷等的缺陷位置坐标的数据。 还存储了基于来自测试器的故障位数据获得的物理坐标的数据。 指示附加故障区域的数据由基于故障位数据的附加故障区域估计装置产生，并被存储。 通过将存储的故障模式的限制数据与所存储的物理位置坐标的数据相加，校正生成校正的物理位置坐标的数据，并且将校正的物理位置坐标的数据与存储的缺陷位置坐标的数据进行比较。 因此，排序的精度提高，即使不是由故障位数据所获得的故障的地址而是由于位于故障地址处的缺陷引起的缺陷引起的故障也可以被分析。