发明授权
US6022759A Method for producing a semiconductor device, base member for
semiconductor device and semiconductor device unit
失效
半导体装置的制造方法，半导体装置用基板和半导体装置装置
- 专利标题： Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit
- 专利标题（中）： 半导体装置的制造方法，半导体装置用基板和半导体装置装置
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申请号： US25327申请日： 1998-02-18
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公开(公告)号： US6022759A公开(公告)日： 2000-02-08
- 发明人: Masaaki Seki , Michio Sono , Ichiro Yamaguchi , Kazuhiko Mitobe , Lim Cheang Hai , Koki Otake , Susumu Abe , Junichi Kasai , Masao Sakuma , Yoshimi Suzuki , Yasuhiro Shinma
- 申请人： Masaaki Seki , Michio Sono , Ichiro Yamaguchi , Kazuhiko Mitobe , Lim Cheang Hai , Koki Otake , Susumu Abe , Junichi Kasai , Masao Sakuma , Yoshimi Suzuki , Yasuhiro Shinma
- 申请人地址： JPX Kawasaki JPX Kawasaki
- 专利权人： Fujitsu Limited,Fujitsu Automation Limited
- 当前专利权人： Fujitsu Limited,Fujitsu Automation Limited
- 当前专利权人地址： JPX Kawasaki JPX Kawasaki
- 优先权： JPX6-225412 19940920; JPX6-225413 19940920
- 主分类号： H01L23/13
- IPC分类号： H01L23/13 ; H01L23/31 ; H01L23/498 ; H01L23/538 ; H01L25/10 ; H01L21/44 ; H01L21/58
摘要：
A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.
公开/授权文献
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