公开(公告)号：US20060023206A1

公开(公告)日：2006-02-02

申请号：US10974753

申请日：2004-10-28

申请人： Yasushi Iwanaga ,  Kazuhiko Mitobe

发明人： Yasushi Iwanaga ,  Kazuhiko Mitobe

IPC分类号： G01N21/01

CPC分类号： G03F7/70716 ,  B23K26/0876 ,  G02B7/005

摘要： Nine vibration isolating mounts are disposed on a pedestal, and a granite plate is placed thereon. A pair of guide bases are disposed on the granite plate, and disposed thereon are a pair of posts made of CFRP for movements in a Y-direction relative to the granite plate. A beam made of CFRP is extended between the pair of posts. Further, a movement base is disposed for movement in an X-direction relative to the beam, and a laser optical unit is mounted on the movement base.

摘要翻译： 九个防振安装座设置在基座上，花岗岩板放置在其上。 一对导向基座设置在花岗岩板上，并且设置有一对由相对于花岗岩板沿Y方向运动的CFRP制成的柱。 由CFRP制成的梁在两对柱之间延伸。 此外，移动基座设置成相对于光束在X方向上移动，并且激光光学单元安装在移动基座上。

公开(公告)号：US6022759A

公开(公告)日：2000-02-08

申请号：US25327

申请日：1998-02-18

申请人： Masaaki Seki ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Lim Cheang Hai ,  Koki Otake ,  Susumu Abe ,  Junichi Kasai ,  Masao Sakuma ,  Yoshimi Suzuki ,  Yasuhiro Shinma

发明人： Masaaki Seki ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Lim Cheang Hai ,  Koki Otake ,  Susumu Abe ,  Junichi Kasai ,  Masao Sakuma ,  Yoshimi Suzuki ,  Yasuhiro Shinma

IPC分类号： H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H01L21/44 ,  H01L21/58

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49805 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8547 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1094 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107

摘要： A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.

摘要翻译： 半导体器件包括半导体元件，半导体器件基底元件，其具有安装半导体元件的元件安装部分，设置在半导体器件基底元件上并与半导体元件电连接的外部连接端子，以及密封半导体元件的树脂 元件。 半导体器件基底部件包括基部和由基部支撑的引线部。 引线部分电连接到外部连接端子。 半导体器件基体具有弯曲部分，其中引线部分位于半导体器件基底部件的外侧。 弯曲部分位于半导体器件基底部件的边缘部分。

公开(公告)号：US6025258A

公开(公告)日：2000-02-15

申请号：US516284

申请日：1995-08-17

申请人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi

发明人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi

IPC分类号： B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34 ,  H01L21/283

CPC分类号： H01L24/742 ,  B23K3/0623 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H05K3/3484 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/11002 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/087 ,  H05K2203/1105 ,  H05K2203/1157 ,  H05K2203/1476 ,  H05K3/3463 ,  H05K3/3489

摘要： A method for fabricating solder bumps onto a semiconductor chip. A solder ball forming member having a flat surface and a plurality of cavities arranged on the flat surface in a predetermined pattern is prepared. The cavities are then filled with a solder paste, and the solder ball forming member is heated to a temperature higher than the melting point of the solder so that the molten solder powder in the solder paste form solder balls due to surface tension. The semiconductor chip is then moved toward the solder ball forming member to transfer the heated solder balls from the solder ball forming member to the semiconductor chip.

摘要翻译： 一种用于在半导体芯片上制造焊料凸块的方法。 制备具有平坦表面的焊球形成构件和以预定图案布置在平坦表面上的多个空腔。 然后用焊膏填充空腔，并将焊球形成构件加热到高于焊料熔点的温度，使得焊膏中的熔融焊料粉由于表面张力而形成焊球。 然后将半导体芯片移动到焊球形成部件，以将加热的焊球从焊球形成部件转移到半导体芯片。

公开(公告)号：US5747874A

公开(公告)日：1998-05-05

申请号：US529784

申请日：1995-09-18

申请人： Masaaki Seki ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Lim Cheang Hai ,  Koki Otake ,  Susumu Abe ,  Junichi Kasai ,  Masao Sakuma ,  Yoshimi Suzuki ,  Yasuhiro Shinma

发明人： Masaaki Seki ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Lim Cheang Hai ,  Koki Otake ,  Susumu Abe ,  Junichi Kasai ,  Masao Sakuma ,  Yoshimi Suzuki ,  Yasuhiro Shinma

IPC分类号： H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H01L23/02

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49805 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8547 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1094 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107

摘要： A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.

摘要翻译： 半导体器件包括半导体元件，半导体器件基底元件，其具有安装有半导体元件的元件安装部分，设置在半导体器件基底元件上并与半导体元件电连接的外部连接端子，以及密封半导体元件的树脂 元件。 半导体器件基底部件包括基部和由基部支撑的引线部。 引线部分电连接到外部连接端子。 半导体器件基体具有弯曲部分，其中引线部分位于半导体器件基底部件的外侧。 弯曲部分位于半导体器件基底部件的边缘部分。

公开(公告)号：US5643831A

公开(公告)日：1997-07-01

申请号：US547532

申请日：1995-10-24

申请人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi ,  Yutaka Yamada ,  Susumu Abe

发明人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi ,  Yutaka Yamada ,  Susumu Abe

IPC分类号： B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34 ,  H01L21/283

CPC分类号： H05K3/3484 ,  B23K3/0623 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/1476 ,  H05K3/3463 ,  H05K3/3489

摘要： A method for fabricating a semiconductor device using a solder ball forming plate having cavities. The plate is made from a silicon plate having a flat surface in a crystallographic plane, and an orientation flat in a crystallographic plane. The cavities are formed on the flat surface of the plate by etching, using a mask having openings in the shape of rhombus arranged such that one side of the rhombus is generally parallel to the crystallographic plane. As a result, the cavities having wedge-shaped bottom are formed. The cavities are then filled with a solder paste and are heated to form solder balls in the cavities while the plate in an inclined position. The solder balls are then transferred from the plate to a semiconductor chip.

摘要翻译： 一种使用具有空腔的焊球形成板制造半导体器件的方法。 该板由具有<110>结晶平面中的平坦表面的硅板制成，并且在<1-11>晶面中平行取向。 通过蚀刻在板的平坦表面上形成空腔，使用具有菱形形状的开口的掩模，其布置成使得菱形的一侧大致平行于<1-11>晶面。 结果，形成了具有楔形底部的空腔。 然后用焊膏填充空腔，并在板中处于倾斜位置的同时加热以在空腔中形成焊球。 然后将焊球从板转移到半导体芯片。

公开(公告)号：US07239161B2

公开(公告)日：2007-07-03

申请号：US10974753

申请日：2004-10-28

申请人： Yasushi Iwanaga ,  Kazuhiko Mitobe

发明人： Yasushi Iwanaga ,  Kazuhiko Mitobe

IPC分类号： G01R31/02

CPC分类号： G03F7/70716 ,  B23K26/0876 ,  G02B7/005

摘要： Nine vibration isolating mounts are disposed on a pedestal, and a granite plate is placed thereon. A pair of guide bases are disposed on the granite plate, and disposed thereon are a pair of posts made of CFRP for movements in a Y-direction relative to the granite plate. A beam made of CFRP is extended between the pair of posts. Further, a movement base is disposed for movement in an X-direction relative to the beam, and a laser optical unit is mounted on the movement base.

摘要翻译： 九个防振安装座设置在基座上，花岗岩板放置在其上。 一对导向基座设置在花岗岩板上，并且设置有一对由相对于花岗岩板沿Y方向运动的CFRP制成的柱。 由CFRP制成的梁在两对柱之间延伸。 此外，移动基座设置成相对于光束在X方向上移动，并且激光光学单元安装在移动基座上。

公开(公告)号：US06433418B1

公开(公告)日：2002-08-13

申请号：US09301345

申请日：1999-04-29

申请人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Seiichi Orimo ,  Kazuhiko Mitobe ,  Masaaki Seki ,  Masaki Waki ,  Toshio Hamano ,  Katsuhiro Hayashida ,  Yoshitsugu Katoh ,  Hiroshi Inoue

发明人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Seiichi Orimo ,  Kazuhiko Mitobe ,  Masaaki Seki ,  Masaki Waki ,  Toshio Hamano ,  Katsuhiro Hayashida ,  Yoshitsugu Katoh ,  Hiroshi Inoue

IPC分类号： H01L2302

CPC分类号： H01L23/49555 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4951 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor device includes a resin package in which a semiconductor chip is sealed, the resin package having a first surface and a second surface opposite to the first surface; a plurality of leads having inner lead parts connected to the semiconductor chip and outer lead parts extending outside the resin package, the outer lead parts being bent along the shape of the resin package so as to form first terminal parts on the second surface and second terminal parts on the first surface; connection means electrically connecting the semiconductor chip and the leads; and a positioning mechanism provided either on the leads or on the resin package, which positions the outer lead parts by engaging a part of the outer lead parts to the resin package. Further, at least one of the leads and/or connection means is cut so as to electrically disconnect the semiconductor chip and the one of the leads and/or connection elements.

摘要翻译： 半导体器件包括其中半导体芯片被密封的树脂封装，所述树脂封装具有第一表面和与第一表面相对的第二表面; 多个引线，其具有连接到所述半导体芯片的内部引线部分和在所述树脂封装体外部延伸的外部引线部分，所述外部引线部分沿着所述树脂封装件的形状弯曲，以在所述第二表面上形成第一端子部分， 第一表面上的零件; 连接装置电连接半导体芯片和引线; 以及设置在引线上或树脂封装上的定位机构，其通过将外引线部分的一部分接合到树脂封装来定位外引线部分。 此外，切断引线和/或连接装置中的至少一个，以便使半导体芯片和引线和/或连接元件中的一个电气断开。

公开(公告)号：US6094356A

公开(公告)日：2000-07-25

申请号：US8305

申请日：1998-01-16

申请人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Kazuhiko Mitobe ,  Katsuhiro Hayashida ,  Masaaki Seki ,  Seiichi Orimo ,  Toshio Hamano

发明人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Kazuhiko Mitobe ,  Katsuhiro Hayashida ,  Masaaki Seki ,  Seiichi Orimo ,  Toshio Hamano

IPC分类号： H01L21/60 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H05H7/12

CPC分类号： H01L23/49555 ,  H01L23/3107 ,  H01L24/01 ,  H01L2224/16 ,  H01L2924/3011

摘要： A semiconductor device including a semiconductor chip, connection parts arranged along one end of the semiconductor chip, and external connection terminals connected to the connection parts.

摘要翻译： 包括半导体芯片的半导体器件，沿着半导体芯片的一端布置的连接部件和连接到连接部件的外部连接端子。

公开(公告)号：US5984699A

公开(公告)日：1999-11-16

申请号：US790982

申请日：1997-01-29

申请人： Masaki Waki ,  Katsuhiro Hayashida ,  Mitsutaka Sato ,  Tadashi Uno ,  Kazuhiko Mitobe ,  Tetsuya Fujisawa

发明人： Masaki Waki ,  Katsuhiro Hayashida ,  Mitsutaka Sato ,  Tadashi Uno ,  Kazuhiko Mitobe ,  Tetsuya Fujisawa

IPC分类号： H05K1/18 ,  H01L21/60 ,  H01L23/495 ,  H01L23/50 ,  H01L21/44

CPC分类号： H01L24/27 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/32 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/85439 ,  H01L2224/92147 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/181

摘要： A lead frame is formed by subjecting a frame base to a forming process, a semiconductor chip is fixed on leads formed in the lead frame and wires are provided in the semiconductor chip, and then a package which accommodates the semiconductor chip is formed; a non-conductive adhesive being provided, before the forming process, on a position on the frame base in which the leads are formed, and unnecessary portions of the frame base and the non-conductive adhesive being removed in the forming process so that the leads having a predetermined configuration and provided with the non-conductive adhesive are formed.

摘要翻译： 通过对框架基底进行成形工序来形成引线框架，将半导体芯片固定在引线框架中形成的引线上，并且在半导体芯片中设置布线，然后形成容纳半导体芯片的封装; 在成形工艺之前，在形成引线的框架基座上的位置上设置不导电粘合剂，并且在成形过程中除去框架基座和非导电粘合剂的不必要部分，使得引线 形成具有预定构造并且设置有非导电粘合剂的形状。

公开(公告)号：US5305179A

公开(公告)日：1994-04-19

申请号：US899270

申请日：1992-06-16

申请人： Michio Sono ,  Junichi Kasai ,  Kouji Saito ,  Kazuhiko Mitobe ,  Masanori Yoshimoto

发明人： Michio Sono ,  Junichi Kasai ,  Kouji Saito ,  Kazuhiko Mitobe ,  Masanori Yoshimoto

IPC分类号： H01L23/36 ,  H01L23/495 ,  H05K1/02 ,  H05K1/18 ,  H05K7/20

CPC分类号： H05K1/0203 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49582 ,  H05K1/181 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K2201/10166 ,  H05K2201/10454 ,  H05K2201/10469 ,  H05K2201/1053 ,  H05K2201/10659 ,  Y02P70/611

摘要： A semiconductor device includes a semiconductor chip mounted in a resin package body. A plurality of interconnection leads are provided on the resin package body along a lower edge thereof and project outwardly from the lower edge. A heat dissipation lead is connected to the resin package body for dissipating heat generated by the semiconductor chip. The heat dissipation lead includes a plate of a heat conducting material having a stage part and a heat sink part, wherein the stage part is held inside the resin package body and supports the semiconductor chip thereon. The heat sink part projects outwardly from the resin package body and includes a part that extends in a downward direction. The heat sink part has a lower edge that is formed at a level substantially flush with the outer lead part of the interconnection leads such that the semiconductor device is held upright, when placed on a substrate, by the outer lead part of the interconnection leads and by the lower edge of the heat sink part of the heat dissipation lead.

摘要翻译： 半导体器件包括安装在树脂封装主体中的半导体芯片。 多个互连引线沿其下边缘设置在树脂封装主体上并且从下边缘向外突出。 散热引线连接到树脂封装体，用于散发由半导体芯片产生的热量。 散热引线包括具有台部和散热部的导热材料板，其中台部保持在树脂封装主体的内部并且在其上支撑半导体芯片。 散热部从树脂封装主体向外突出并包括向下延伸的部分。 散热部分具有下边缘，该下边缘形成在与互连引线的外部引线部分基本齐平的水平面处，使得半导体器件通过互连引线的外部引线部分放置在基板上时被保持为直立，并且 通过散热片的下缘部分散热引线。