发明授权
US6027812A Encapsulant of crystalline epoxy resin and phenolic resin-crystalline
epoxy resin reaction product
失效
结晶环氧树脂和酚醛树脂结晶环氧树脂反应产品的封装剂
- 专利标题： Encapsulant of crystalline epoxy resin and phenolic resin-crystalline epoxy resin reaction product
- 专利标题（中）： 结晶环氧树脂和酚醛树脂结晶环氧树脂反应产品的封装剂
-
申请号： US6868申请日： 1998-01-14
-
公开(公告)号： US6027812A公开(公告)日： 2000-02-22
- 发明人: Toshio Shiobara , Takayuki Aoki , Shigeki Ino , Eiichi Asano , Satoshi Okuse , Kazutoshi Tomiyoshi
- 申请人： Toshio Shiobara , Takayuki Aoki , Shigeki Ino , Eiichi Asano , Satoshi Okuse , Kazutoshi Tomiyoshi
- 申请人地址： JPX Tokyo
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX9-026025 19970124
- 主分类号： C08G59/62
- IPC分类号： C08G59/62 ; C08L63/00 ; H01L23/29 ; H01L23/31 ; B32B27/38 ; C08K3/36 ; C08L63/02
摘要：
An epoxy resin composition comprising a crystalline epoxy resin, a phenolic resin, and an inorganic filler is improved in moldability by previously reacting phenolic hydroxyl groups on the phenolic resin with epoxy groups on the crystalline epoxy resin to form a reaction product and blending the reaction product in the composition. The composition is moldable over semiconductor devices without voids and wire flow. The encapsulated semiconductor devices thus remain reliable.