发明授权
- 专利标题: Copolymer for photoresist
- 专利标题(中): 光刻胶共聚物
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申请号: US881122申请日: 1997-06-24
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公开(公告)号: US6063896A公开(公告)日: 2000-05-16
- 发明人: Jae Chang Jung , Cheol Kyu Bok
- 申请人: Jae Chang Jung , Cheol Kyu Bok
- 申请人地址: KRX Ichon-shi
- 专利权人: Hyundai Electronics Industries Co., Ltd.
- 当前专利权人: Hyundai Electronics Industries Co., Ltd.
- 当前专利权人地址: KRX Ichon-shi
- 优先权: KRX96-23281 19960624
- 主分类号: G03F7/033
- IPC分类号: G03F7/033 ; C08F220/12 ; C08F222/40 ; G03F7/004 ; G03F7/039 ; H01L21/027 ; C08G73/10 ; G03C1/495
摘要:
A copolymer of maleimide derivative and acrylic acid, represented by Formula I, is of high etch resistance and thermal resistance and can be used for photoresist in submicrolithography. ##STR1##
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