发明授权
US6063896A Copolymer for photoresist 失效
光刻胶共聚物

Copolymer for photoresist
摘要:
A copolymer of maleimide derivative and acrylic acid, represented by Formula I, is of high etch resistance and thermal resistance and can be used for photoresist in submicrolithography. ##STR1##
信息查询
0/0