发明授权
- 专利标题: Wafer cassette load station
- 专利标题(中): 晶圆盒装载站
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申请号: US12323申请日: 1998-01-23
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公开(公告)号: US6082951A公开(公告)日: 2000-07-04
- 发明人: Eric A. Nering , Ilya Perlov , Eugene Gantvarg , Victor Belitsky
- 申请人: Eric A. Nering , Ilya Perlov , Eugene Gantvarg , Victor Belitsky
- 申请人地址: CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: CA Santa Clara
- 主分类号: B65G49/07
- IPC分类号: B65G49/07 ; H01L21/67 ; H01L21/677
摘要:
A pod loading station and method of operation are provided for enabling the transfer and introduction of wafers into a processing system from a wafer pod. The pod loading station generally includes a movable receiving platform for supporting a wafer pod and a movable pod door receiver having a pod door latch actuating mechanism disposed thereon. The movable platform supports a wafer pod, moves the wafer pod into engagement with the pod door receiver, and then retracts to enable the door supported by the door receiver to be removed from the opening of the pod. The pod door receiver then lowers the pod door below the pod to enable access to the pod opening.
公开/授权文献
- USD355153S Tire tread 公开/授权日:1995-02-07
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