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34 条记录 (耗时 0.202 秒)

    Wafer cassette load station
    1.
    发明授权
    Wafer cassette load station 失效
    晶圆盒装载站

    公开(公告)号：US6082951A

    公开(公告)日：2000-07-04

    申请号：US12323

    申请日：1998-01-23

    申请人： Eric A. Nering ,  Ilya Perlov ,  Eugene Gantvarg ,  Victor Belitsky

    发明人： Eric A. Nering ,  Ilya Perlov ,  Eugene Gantvarg ,  Victor Belitsky

    IPC分类号： B65G49/07 ,  H01L21/67 ,  H01L21/677

    CPC分类号： H01L21/67775 ,  H01L21/67772 ,  Y10S414/137 ,  Y10S414/139

    摘要： A pod loading station and method of operation are provided for enabling the transfer and introduction of wafers into a processing system from a wafer pod. The pod loading station generally includes a movable receiving platform for supporting a wafer pod and a movable pod door receiver having a pod door latch actuating mechanism disposed thereon. The movable platform supports a wafer pod, moves the wafer pod into engagement with the pod door receiver, and then retracts to enable the door supported by the door receiver to be removed from the opening of the pod. The pod door receiver then lowers the pod door below the pod to enable access to the pod opening.

    摘要翻译： 提供了一个荚装载站和操作方法，用于使得能够从晶片盒将晶片转移和引入处理系统。 荚果装载站通常包括用于支撑晶片盒的可移动接收平台和设置在其上的荚门闩锁致动机构的可移动荚门接收器。 可移动平台支撑晶片盒，将晶片盒移动到与荚门接收器接合，然后缩回以使得门接收器支撑的门能够从荚的开口移除。 荚门接收器然后降低荚壳下面的荚门，以便进入荚果开口。

    Washing transfer station in a system for chemical mechanical polishing
    4.
    发明授权
    Washing transfer station in a system for chemical mechanical polishing 有权
    清洗转运站在化学机械抛光系统中

    公开(公告)号：US6086457A

    公开(公告)日：2000-07-11

    申请号：US290042

    申请日：1999-04-12

    申请人： Ilya Perlov ,  Eugene Gantvarg

    发明人： Ilya Perlov ,  Eugene Gantvarg

    IPC分类号： B24B27/00 ,  B24B37/30 ,  B24B37/34 ,  B24B41/00 ,  B24B53/007 ,  B24B53/017 ,  B24B53/12 ,  B24B57/02 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306 ,  B24B1/00

    CPC分类号： H01L21/67057 ,  B08B1/007 ,  B24B27/0023 ,  B24B37/30 ,  B24B37/345 ,  B24B41/005 ,  B24B53/017 ,  B24B53/12 ,  B24B57/02 ,  H01L21/67051 ,  H01L21/30625

    摘要： An apparatus and method for polishing semiconductor wafers and other workpieces that includes a polishing pads mounted on respective platens at multiple polishing stations. A transfer and washing station is disposed similarly to the polishing pads. The carousel simultaneously positions one of the heads over the transfer and washing station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers and washing of wafers and wafer heads can be performed concurrently with wafer polishing. A robot positioned to the side of the polishing apparatus automatically moves cassettes filled with wafers into a holding tub, and transfers individual wafers vertically held in the cassettes between the holding tub and the transfer and washing station. The transfer and washing station operates to not only transfer the wafers between the robot and the polishing heads, but also to wash the wafer and the polishing heads, for example, by liquid nozzles locate to the side of the station.

    摘要翻译： 一种用于抛光半导体晶片和其它工件的装置和方法，其包括安装在多个抛光站的相应压板上的抛光垫。 传送和洗涤站的布置类似于抛光垫。 圆盘传送带同时将其中一个头放置在传送和洗涤台上，而其余的头位于用于晶片抛光的抛光站之上，从而可以与晶片抛光同时进行晶片的加载和卸载以及晶片和晶片头的清洗。 位于抛光装置一侧的机器人将自动地将装载有晶片的盒子移动到保持桶中，并且将保持在保持桶和转移和洗涤站之间的盒中的垂直保持的各个晶片传送。 转移和洗涤站不仅可以在机器人和抛光头之间传送晶片，而且还可以例如通过液体喷嘴来清洗晶片和抛光头，位于工位的侧面。

    Conditioner head in a substrate polisher and method
    5.
    发明授权
    Conditioner head in a substrate polisher and method 失效
    基材抛光机中的调节头和方法

    公开(公告)号：US6036583A

    公开(公告)日：2000-03-14

    申请号：US890781

    申请日：1997-07-11

    申请人： Ilya Perlov ,  Eugene Gantvarg

    发明人： Ilya Perlov ,  Eugene Gantvarg

    IPC分类号： B24B53/017 ,  B24B37/04 ,  B24B53/007 ,  B24B53/02 ,  H01L21/304 ,  B24B1/00

    CPC分类号： B24B53/017

    摘要： In one aspect, an apparatus and a method for use in substrate polishing are described wherein a conditioner head is provided for receiving an end effector for conditioning a polishing pad surface; the conditioner head is supported above the polishing pad surface to be conditioned; and the conditioner head is driven with an actuating force from a position that lies along a line that is substantially normal to the polishing pad surface to be conditioned so that an end effector attached to the conditioner head can condition the surface of the polishing pad. In another aspect, pneumatic pressure is supplied through the conditioner head support arm to apply actuating force to the conditioner head so that an end effector attached to the conditioner head can condition the surface of the polishing pad. In yet another aspect, the conditioner head support arm has a fluid channel extending therein and a fluid port, wherein the fluid channel is constructed to receive rinsing fluid and fluid port is constructed to direct rinsing fluid from the fluid channel toward the polishing pad surface to be conditioned.

    摘要翻译： 一方面，描述了一种用于衬底抛光的装置和方法，其中设置有用于接收用于调节抛光垫表面的末端执行器的调节头; 调节头被支撑在待调理的抛光垫表面上方; 并且调节头由来自位于基本上垂直于待调理的抛光垫表面的线的位置的致动力驱动，使得附接到调节头的末端执行器可调节抛光垫的表面。 另一方面，通过调节器头支撑臂供给气压，以向致动器头施加致动力，使得附接到调节头的末端执行器可调节抛光垫的表面。 在另一方面，调节器头支撑臂具有在其中延伸的流体通道和流体端口，其中流体通道被构造成接收冲洗流体，并且流体端口被构造成将冲洗流体从流体通道朝向抛光垫表面引导到 被调节。

    Carrier head with a flexible membrane for a chemical mechanical polishing system
    6.
    发明授权
    Carrier head with a flexible membrane for a chemical mechanical polishing system 失效
    带有柔性膜的载体头，用于化学机械抛光系统

    公开(公告)号：US5964653A

    公开(公告)日：1999-10-12

    申请号：US891548

    申请日：1997-07-11

    申请人： Ilya Perlov ,  Eugene Gantvarg ,  Sen-Hou Ko

    发明人： Ilya Perlov ,  Eugene Gantvarg ,  Sen-Hou Ko

    IPC分类号： B24B37/27 ,  B24B37/04 ,  B24B37/30 ,  B24B37/32 ,  B24B47/10 ,  B24B47/12 ,  B24B49/16 ,  H01L21/304 ,  B24B5/00 ,  B24B29/00

    CPC分类号： B24B37/30 ,  B24B37/32 ,  B24B47/10 ,  B24B47/12 ,  B24B49/16

    摘要： A carrier head with a flexible member connected to a base to define a first chamber, a second chamber and a third chamber. A lower surface of the flexible member provides a substrate receiving surface with an inner portion associated with the first chamber, a substantially annular middle portion surrounding the inner portion and associated with the second chamber, and a substantially annular outer portion surrounding the middle portion and associated with the third chamber. The width of the outer portion may be significantly less than the width of the middle portion. The carrier head may also include a flange connected to a drive shaft and a gimbal pivotally connecting the flange to the base.

    摘要翻译： 具有连接到基座以限定第一室，第二室和第三室的柔性构件的承载头。 柔性构件的下表面提供了具有与第一腔室相关联的内部部分的基底接收表面，围绕内部部分并与第二腔室相关联的基本上环形的中间部分，以及围绕中间部分和相关联的基本上环形的外部部分 与第三个房间。 外部部分的宽度可以明显小于中间部分的宽度。 承载头还可以包括连接到驱动轴的凸缘和将凸缘枢转地连接到基座的万向架。

    Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
    7.
    发明授权
    Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion 有权
    化学机械抛光系统具有多个抛光台并提供相对的线性抛光运动

    公开(公告)号：US07255632B2

    公开(公告)日：2007-08-14

    申请号：US11329648

    申请日：2006-01-10

    申请人： Robert D. Tolles ,  Norm Shendon ,  Sasson Somekh ,  Ilya Perlov ,  Eugene Gantvarg ,  Harry Q. Lee

    发明人： Robert D. Tolles ,  Norm Shendon ,  Sasson Somekh ,  Ilya Perlov ,  Eugene Gantvarg ,  Harry Q. Lee

    IPC分类号： B24B1/00

    CPC分类号： H01L21/67057 ,  B08B1/007 ,  B24B27/0023 ,  B24B37/30 ,  B24B37/345 ,  B24B41/005 ,  B24B53/017 ,  B24B57/02 ,  H01L21/30625 ,  H01L21/67051

    摘要： A polishing method usable in an apparatus including a rotatable member rotatable about a first axis, at least one substrate head assembly supported on said rotatable member, and at least two polishing surfaces arranged below said rotatable member at respective angular positions about said first axis is described. In one implementation, a substrate can be mounted onto a first one of said at least one substrate head assembly. The rotatable member can be rotated to a position so that the substrate overlies a selected one of the polishing surfaces. The substrate can be engaged with said selected polishing surface and relative linear movement imparted between the selected polishing surface and the first substrate head assembly, while the substrate is engaged with the selected polishing surface.

    摘要翻译： 描述了可用于包括可围绕第一轴可旋转的可旋转构件，支撑在所述可旋转构件上的至少一个基板头组件和在围绕所述第一轴线的各个角位置处布置在所述可旋转构件下方的至少两个抛光表面的设备的抛光方法， 。 在一个实施方案中，可以将衬底安装在所述至少一个衬底头组件中的第一个上。 可旋转构件可以旋转到一个位置，使得衬底覆盖所选择的一个抛光表面。 衬底可以与所选择的抛光表面接合并且在所选择的抛光表面和第一衬底头组件之间施加的相对线性运动，同时衬底与所选择的抛光表面接合。

    Carousel wafer transfer system
    9.
    发明授权
    Carousel wafer transfer system 失效
    旋转木片转印系统

    公开(公告)号：US06287386B1

    公开(公告)日：2001-09-11

    申请号：US09332207

    申请日：1999-06-12

    申请人： Ilya Perlov ,  Alexey Goder ,  Eugene Gantvarg

    发明人： Ilya Perlov ,  Alexey Goder ,  Eugene Gantvarg

    IPC分类号： C23C1600

    CPC分类号： H01L21/67196 ,  H01L21/67126 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/68764 ,  H01L21/68771 ,  H01L21/68792 ,  Y10S414/135 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/141

    摘要： The present invention generally provides a rotary wafer carousel and related wafer handler for moving wafers or other workpieces through a processing system, i.e., a semiconductor fabrication tool. Generally, the present invention includes a rotary wafer carousel having a plurality of wafer seats disposed thereon to support one or more wafers. The rotary carousel is preferably disposed through the lid in a transfer chamber opposite the robot which is preferably disposed through the bottom of the transfer chamber. The rotary carousel and the robot cooperate to locate wafers adjacent to process chambers and move wafers into and out of various chambers of the system. The invention improves the throughput of the system by positioning wafers adjacent to the appropriate chamber to reduce the amount of movement required of the robot for transporting wafers between chambers.

    摘要翻译： 本发明通常提供一种用于通过处理系统即半导体制造工具移动晶片或其他工件的旋转晶片转盘和相关晶片处理器。 通常，本发明包括旋转晶片转盘，其具有设置在其上的多个晶片座，以支撑一个或多个晶片。 旋转传送带优选地通过盖子设置在与机器人相对的传送室中，传送室优选地布置在传送室的底部。 旋转圆盘传送带和机器人协调定位与处理室相邻的晶片，并将晶片移入和移出系统的各个腔室。 本发明通过将晶片定位在适当的腔室附近来改善系统的生产量，以减少机器人在腔室之间传送晶片所需的移动量。

    Radially oscillating carousel processing system for chemical mechanical polishing
    10.
    发明授权
    Radially oscillating carousel processing system for chemical mechanical polishing 失效
    用于化学机械抛光的径向振荡转盘处理系统

    公开(公告)号：US5804507A

    公开(公告)日：1998-09-08

    申请号：US549001

    申请日：1995-10-27

    申请人： Ilya Perlov ,  Eugene Gantvarg ,  Harry Q. Lee ,  Sasson Somekh ,  Robert D. Tolles

    发明人： Ilya Perlov ,  Eugene Gantvarg ,  Harry Q. Lee ,  Sasson Somekh ,  Robert D. Tolles

    IPC分类号： B24B37/04 ,  B24B57/02 ,  H01L21/00

    CPC分类号： B24B57/02 ,  B24B37/04

    摘要： An apparatus for polishing semiconductor wafers and other workpieces that includes a polishing pads mounted on respective platens at multiple polishing stations. Multiple wafer heads, at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a carousel, which provides circumferential positioning of the heads relative to the polishing pads, and the wafer heads oscillate radially as supported by the carousel to sweep linearly across the respective pads in radial directions with respect to the rotatable carousel. Each polishing station includes a pad conditioner to recondition the polishing pad so that it retains a high polishing rate. Washing stations may be disposed between polishing stations and between the polishing stations and a transfer and washing station to wash the wafer as the carousel moves. A transfer and washing station is disposed similarly to the polishing pads. The carousel simultaneously positions one of the heads over the transfer and washing station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers and washing of wafers and wafer heads can be performed concurrently with wafer polishing. A robot positioned to the side of the polishing apparatus automatically moves cassettes filled with wafers into a holding tub, and transfers individual wafers vertically held in the cassettes between the holding tub and the transfer and washing station. The multiple polishing pads can be used to sequentially polish a wafer held in a wafer head in a step of multiple steps. The steps may be equivalent, may provide polishes of different finish, or may be directed to polishing different levels.

    摘要翻译： 一种用于抛光半导体晶片和其它工件的装置，其包括安装在多个抛光站的相应压板上的抛光垫。 与抛光台的数量相比，至少一个数量的多个晶片头可以装载单独的晶片。 晶片头从旋转盘悬挂，其提供头相对于抛光垫的圆周定位，并且晶片头在圆盘传送带支撑下径向摆动，以相对于可旋转圆盘传送器在径向上线性地扫过相应的垫。 每个抛光台包括用于修整抛光垫的垫调节器，使得其保持高抛光速率。 洗涤站可以设置在抛光站之间和抛光站之间，以及传送和洗涤站，以便随着传送带移动而洗涤晶片。 传送和洗涤站的布置类似于抛光垫。 圆盘传送带同时将其中一个头放置在传送和洗涤台上，而其余的头位于用于晶片抛光的抛光站之上，从而可以与晶片抛光同时进行晶片的加载和卸载以及晶片和晶片头的清洗。 位于抛光装置一侧的机器人将自动地将装载有晶片的盒子移动到保持桶中，并且将保持在保持桶和转移和洗涤站之间的盒中的垂直保持的各个晶片传送。 多个抛光垫可以用于在多个步骤的步骤中顺序抛光保持在晶片头中的晶片。 这些步骤可以是等效的，可以提供不同涂饰的抛光剂，或者可以指向抛光不同的水平。