发明授权
- 专利标题： Epoxy resin composition and semiconductor device
- 专利标题（中）： 环氧树脂组合物和半导体器件
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申请号： US993403申请日： 1997-12-18
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公开(公告)号： US6084037A公开(公告)日： 2000-07-04
- 发明人: Hisashi Shimizu , Minoru Takei , Masachika Yoshino , Toshio Shiobara
- 申请人： Hisashi Shimizu , Minoru Takei , Masachika Yoshino , Toshio Shiobara
- 申请人地址： JPX
- 专利权人： Shin -Etsu Chemical Co., Ltd.
- 当前专利权人： Shin -Etsu Chemical Co., Ltd.
- 当前专利权人地址： JPX
- 优先权： JPX8-354530 19961219
- 主分类号： C08K3/22
- IPC分类号： C08K3/22 ; C08F283/10 ; C08G59/40 ; C08G59/68 ; C08K3/36 ; C08K5/548 ; C08L63/00 ; H01L23/29 ; H01L23/31
摘要：
In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, there are blended a salt of trimellitic anhydride with 1,8-diazabicyclo(5.4.0)undecene-7 as a curing accelerator and a mercapto-containing silane coupling agent. The composition is shelf stable and smoothly flowing and cures into a product having improved adhesion, moisture resistance and electrical properties. The composition is suitable for the encapsulation of semiconductor devices.
公开/授权文献
- US5253837A Shelf bracket for use with conduit 公开/授权日：1993-10-19
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