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    Thermosetting resin compositions
    2.
    发明授权
    Thermosetting resin compositions 失效
    热固性树脂组合物

    公开(公告)号：US5340851A

    公开(公告)日：1994-08-23

    申请号：US17290

    申请日：1993-02-12

    申请人： Toshio Shiobara ,  Hisashi Shimizu ,  Minoru Takei

    发明人： Toshio Shiobara ,  Hisashi Shimizu ,  Minoru Takei

    IPC分类号： C08G59/00 ,  C08G59/40 ,  C08G59/62 ,  C08L63/00 ,  H01B3/40 ,  H01L23/29

    CPC分类号： H01L23/293 ,  C08G59/4042 ,  C08L63/00 ,  H01B3/40 ,  H01L2924/0002

    摘要： A thermosetting resin composition contains (A) a mixture of an imide compound having an allyl-free maleimide group and an imide compound having an allyl-containing imide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organo-polysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having a double bond conjugated with an aromatic ring. The composition is easily workable and well adhesive and cures to products having improved mechanical strength, hot-water resistance, low thermal expansion, and minimized water absorption.

    摘要翻译： 热固性树脂组合物包含（A）具有不含烯丙基的马来酰亚胺基的酰亚胺化合物和具有含烯丙基的酰亚胺基的酰亚胺化合物的混合物，（B）环氧树脂，（C）酚醛树脂， （D）芳族聚合物/有机聚硅氧烷共聚物。 组分（B）和/或（C）包括含有与芳环共轭的双键的萘环的化合物。 该组合物易于加工并且粘合性良好，并且可以改善机械强度，耐热水性，低热膨胀性和最小化吸水性的产品。

    Phosphonium borate compound, making method, curing catalyst, and epoxy resin composition
    3.
    发明授权
    Phosphonium borate compound, making method, curing catalyst, and epoxy resin composition 有权
    硼酸鏻化合物，制法，固化催化剂和环氧树脂组合物

    公开(公告)号：US06235865B1

    公开(公告)日：2001-05-22

    申请号：US09345390

    申请日：1999-06-30

    申请人： Hisashi Shimizu ,  Minoru Takei ,  Toshio Shiobara

    发明人： Hisashi Shimizu ,  Minoru Takei ,  Toshio Shiobara

    IPC分类号： B01J3122

    CPC分类号： C08K5/55 ,  B01J31/0268 ,  B01J31/146 ,  C07F9/54 ,  C08G59/688 ,  C08L63/00

    摘要： Phosphonium borate compounds of formula (1) are novel. R1, R2, R3 and R4 each are a monovalent organic group having an aromatic or heterocyclic ring or a monovalent aliphatic group, at least one of R1, R2, R3 and R4 which are bonded to phosphorus atom and at least one of R1, R2, R3 and R4 which are bonded to boron atom are each an organic group derived by releasing a proton from a proton donor selected from among an aromatic carboxylic acid having at least one carboxyl group, an aromatic carboxylic acid having at least one acid anhydride group and at least one carboxyl group, a phenol compound having at least one phenolic hydroxyl group, an aromatic compound having at least one carboxyl group and at least one phenolic hydroxyl group, and an aliphatic carboxylic acid having at least one carboxyl group. The phosphonium borate compounds are useful as a latent curing catalyst for epoxy resin compositions. The epoxy resin compositions are improved in shelf stability, fast-curing ability and flow and cure into products having moisture resistance and improved electrical properties.

    摘要翻译： 式（1）的硼酸鏻化合物是新颖的.R1，R2，R3和R4各自是具有芳族或杂环或一价脂族基的一价有机基团，R 1，R 2，R 3和R 4中的至少一个是键合的 磷原子和与硼原子键合的R 1，R 2，R 3和R 4中的至少一个各自是通过从质子供体中释放质子衍生的有机基团，所述质子供体选自具有至少一个羧基的芳族羧酸， 具有至少一个酸酐基和至少一个羧基的芳族羧酸，具有至少一个酚羟基的酚化合物，至少一个羧基和至少一个酚羟基的芳族化合物和脂族羧酸 具有至少一个羧基。 硼酸鏻化合物可用作环氧树脂组合物的潜在固化催化剂。 环氧树脂组合物在贮存稳定性，快速固化能力和流动性方面得到改进，并且固化成具有防潮性和改善的电性能的产品。