发明授权
- 专利标题: Thermal management system and method for a solid-state energy storing device
- 专利标题(中): 固态储能装置的热管理系统和方法
-
申请号: US900566申请日: 1997-07-25
-
公开(公告)号: US6087036A公开(公告)日: 2000-07-11
- 发明人: Roger Rouillard , Michael K. Domroese , Michel Gauthier , Joseph A. Hoffman , David D. Lindeman , Joseph-Robert-Gaetan Noel , Vern E. Radewald , Michel Ranger , Jean Rouillard , Toshimi Shiota , Philippe St-Germain , Anthony Sudano , Jennifer L. Trice , Thomas A. Turgeon
- 申请人: Roger Rouillard , Michael K. Domroese , Michel Gauthier , Joseph A. Hoffman , David D. Lindeman , Joseph-Robert-Gaetan Noel , Vern E. Radewald , Michel Ranger , Jean Rouillard , Toshimi Shiota , Philippe St-Germain , Anthony Sudano , Jennifer L. Trice , Thomas A. Turgeon
- 申请人地址: MN St. Paul CAX Montreal
- 专利权人: 3M Innovative Properties Company,Hydro-Quebec Corporation
- 当前专利权人: 3M Innovative Properties Company,Hydro-Quebec Corporation
- 当前专利权人地址: MN St. Paul CAX Montreal
- 主分类号: H01M2/20
- IPC分类号: H01M2/20 ; H01M6/18 ; H01M6/50 ; H01M10/04 ; H01M10/052 ; H01M10/50
摘要:
An improved electrochemical energy storing device includes a number of thin-film electrochemical cells which are maintained in a state of compression through use of an internal or an external pressure apparatus. A thermal conductor, which is connected to at least one of the positive or negative contacts of each electrochemical cell, conducts current into and out of the electrochemical cells and also conducts thermal energy between the electrochemical cells and thermally conductive material disposed on a wall structure adjacent the conductors. The wall structure includes electrically resistive material, such as an anodized coating or a thin film of plastic. The thermal conductors are fabricated to include a spring mechanism which expands and contacts to maintain mechanical contact between the electrochemical cells and the thermally conductive material in the presence of relative movement between the electrochemical cells and the wall structure. An active cooling apparatus may be employed external to a hermetically sealed housing containing the electrochemical cells to enhance the transfer of thermal energy into and out of the electrochemical cells. An integrated interconnect board may be disposed within the housing onto which a number of electrical and electro-mechanical components are mounted. Heat generated by the components is conducted from the interconnect board to the housing using the thermal conductors.
公开/授权文献
- US5224430A Security enclosures 公开/授权日:1993-07-06
信息查询