发明授权
US6090658A Method of forming a capacitor including a bottom silicon diffusion barrier layer and a top oxygen diffusion barrier layer 失效
形成包括底部硅扩散阻挡层和顶部氧扩散阻挡层的电容器的方法

  • 专利标题: Method of forming a capacitor including a bottom silicon diffusion barrier layer and a top oxygen diffusion barrier layer
  • 专利标题(中): 形成包括底部硅扩散阻挡层和顶部氧扩散阻挡层的电容器的方法
  • 申请号: US911374
    申请日: 1997-08-07
  • 公开(公告)号: US6090658A
    公开(公告)日: 2000-07-18
  • 发明人: Jae Hyun Joo
  • 申请人: Jae Hyun Joo
  • 申请人地址: KRX Cheongju-si
  • 专利权人: LG Semicon Co., Ltd.
  • 当前专利权人: LG Semicon Co., Ltd.
  • 当前专利权人地址: KRX Cheongju-si
  • 优先权: KRX96-61253 19961203
  • 主分类号: H01L27/108
  • IPC分类号: H01L27/108 H01L21/02 H01L21/8242 H01L29/92
Method of forming a capacitor including a bottom silicon diffusion
barrier layer and a top oxygen diffusion barrier layer
摘要:
Capacitor in a semiconductor device suitable for diffusion prevention between a lower electrode and a polysilicon and oxidation prevention of a barrier metal layer and a method for manufacturing the same are disclosed. The capacitor in a semiconductor device includes a semiconductor substrate, an insulating layer having a contact hole on the substrate, a plug formed in the contact hole, a first barrier layer on the plug, a second barrier layer on the first barrier layer, a lower electrode on the second barrier layer, a dielectric layer on the lower electrode, and an upper electrode on the dielectric layer.
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