发明授权
- 专利标题： Lead frame and semiconductor package having a lead frame
- 专利标题（中）： 引线框架和具有引线框架的半导体封装
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申请号： US909814申请日： 1997-08-12
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公开(公告)号： US6107678A公开(公告)日： 2000-08-22
- 发明人: Hiroyuki Shigeta , Kenji Osawa , Kazuhiro Sato , Haruhiko Makino , Makoto Ito
- 申请人： Hiroyuki Shigeta , Kenji Osawa , Kazuhiro Sato , Haruhiko Makino , Makoto Ito
- 申请人地址： JPX Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX8-213843 19960813; JPX8-222033 19960823; JPX8-231538 19960902; JPX8-235102 19960905
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/48 ; H01L23/495 ; H01L23/52 ; H01L29/40
摘要：
In a lead frame with a reinforcing ring surrounding a semiconductor element which are electrically connected to leads through electrodes is integrally formed through suspending portions, reinforcing portions for reinforcing the suspending portions are provided on the suspending portiones. Upon application of a lead frame forming technique in which a laminate plate of three or more layers is used as a base, and inner leads are formed at one side while outer leads are formed by the surface layer at the other side, the lead frame is formed by forming a ring in place of outer leads, for example. A semiconductor package is formed by mounting the lead frame on a semiconductor chip.
公开/授权文献
- USD252434S Combined dispensing and display case 公开/授权日：1979-07-24