公开(公告)号：US6107678A

公开(公告)日：2000-08-22

申请号：US909814

申请日：1997-08-12

申请人： Hiroyuki Shigeta ,  Kenji Osawa ,  Kazuhiro Sato ,  Haruhiko Makino ,  Makoto Ito

发明人： Hiroyuki Shigeta ,  Kenji Osawa ,  Kazuhiro Sato ,  Haruhiko Makino ,  Makoto Ito

IPC分类号： H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3107 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15184 ,  H01L2924/181

摘要： In a lead frame with a reinforcing ring surrounding a semiconductor element which are electrically connected to leads through electrodes is integrally formed through suspending portions, reinforcing portions for reinforcing the suspending portions are provided on the suspending portiones. Upon application of a lead frame forming technique in which a laminate plate of three or more layers is used as a base, and inner leads are formed at one side while outer leads are formed by the surface layer at the other side, the lead frame is formed by forming a ring in place of outer leads, for example. A semiconductor package is formed by mounting the lead frame on a semiconductor chip.

摘要翻译： 在具有电连接到引线通过电极的半导体元件周围的加强环的引线框架通过悬挂部分一体地形成，用于加强悬挂部分的加强部分设置在悬挂部分上。 在使用三层以上的层叠板作为基底的引线框架成形技术的应用中，并且在一侧形成内部引线，而在另一侧由表面层形成外部引线，引线框架 例如，通过形成环代替外引线形成。 通过将引线框架安装在半导体芯片上来形成半导体封装。

公开(公告)号：US06319749B1

公开(公告)日：2001-11-20

申请号：US09562750

申请日：2000-05-02

申请人： Hiroyuki Shigeta ,  Kenji Osawa ,  Kazuhiro Sato ,  Haruhiko Makino ,  Makoto Ito

发明人： Hiroyuki Shigeta ,  Kenji Osawa ,  Kazuhiro Sato ,  Haruhiko Makino ,  Makoto Ito

IPC分类号： H01L2144

CPC分类号： H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15184 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： In a lead frame with a reinforcing ring surrounding a semiconductor element which are electrically connected to leads through electrodes is integrally formed through suspending portions, reinforcing portions for reinforcing the suspending portions are provided on the suspending portions. Upon application of a lead frame forming technique in which a laminate plate of three or more layers is used as a base, and inner leads are formed at one side while outer leads are formed by the surface layer at the other side, the lead frame is formed by forming a ring in place of outer leads, for example. A semiconductor package is formed by mounting the lead frame on a semiconductor chip.

摘要翻译： 在具有电连接到引线通过电极的半导体元件周围的加强环的引线框架通过悬挂部分一体地形成，用于加强悬挂部分的加强部分设置在悬挂部分上。 在使用三层以上的层叠板作为基底的引线框架成形技术的应用中，并且在一侧形成内部引线，而在另一侧由表面层形成外部引线，引线框架 例如，通过形成环代替外引线形成。 通过将引线框架安装在半导体芯片上来形成半导体封装。

公开(公告)号：US6054773A

公开(公告)日：2000-04-25

申请号：US48843

申请日：1998-03-27

申请人： Kenji Ohsawa ,  Kazuhiro Sato ,  Hiroyuki Shigeta

发明人： Kenji Ohsawa ,  Kazuhiro Sato ,  Hiroyuki Shigeta

IPC分类号： H01L21/52 ,  H01L23/31 ,  H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/50 ,  H01L23/3107 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3025

摘要： An adhesive sheet which has rigidity and a portion which adheres to the back surface of the outside portion of the film circuit is used. Specifically, there is used the adhesive sheet which is obtained by forming cushioning adhesive sheet layers on both the surfaces of the rigid sheet layer formed of stainless or the like. Further, the rigid sheet layer is also used for electrostatic shield. The co-planarity of external terminals (soldering balls) is enhanced without vainly increasing the weight of a semiconductor device, and further the resistance to high-frequency noses in the semiconductor device is enhanced.

摘要翻译： 使用具有刚性的粘合片和粘附到胶片电路的外部的后表面的部分。 具体地说，使用通过在由不锈钢等形成的刚性片层的两个表面上形成缓冲粘合片层而获得的粘合片。 此外，刚性片层也用于静电屏蔽。 外部端子（焊接球）的共面性增强，而不会增加半导体器件的重量，并且还增强了半导体器件中对高频率的阻力。

公开(公告)号：US5812381A

公开(公告)日：1998-09-22

申请号：US694214

申请日：1996-08-08

申请人： Hiroyuki Shigeta ,  Mutsumi Nagano

发明人： Hiroyuki Shigeta ,  Mutsumi Nagano

IPC分类号： H01L23/50 ,  H01L23/495 ,  H05K7/02

CPC分类号： H01L23/49558 ,  H01L23/49541 ,  H01L2924/0002

摘要： A lead frame includes a base member having a device hole for accommodating a semiconductor chip therein, a plurality of inner lead portions extended outward from respective sides of the device hole, outer lead portions electrically connected to the inner lead portions, respectively, an adhesion area to which the inner lead portions formed on the base member are adhered, and a plurality of dummy leads disposed on a portion of the adhesion area where a density of the inner lead portions is low.

摘要翻译： 引线框架包括具有用于容纳其中的半导体芯片的器件孔的基底构件，从器件孔的相应侧向外延伸的多个内部引线部分，分别与内部引线部分电连接的外部引线部分， 粘附有形成在基材上的内引线部分的多个虚设引线，以及设置在内引线部分的密度低的粘合区域的一部分上的多个虚设引线。