公开(公告)号：US6107678A

公开(公告)日：2000-08-22

申请号：US909814

申请日：1997-08-12

申请人： Hiroyuki Shigeta ,  Kenji Osawa ,  Kazuhiro Sato ,  Haruhiko Makino ,  Makoto Ito

发明人： Hiroyuki Shigeta ,  Kenji Osawa ,  Kazuhiro Sato ,  Haruhiko Makino ,  Makoto Ito

IPC分类号： H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3107 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15184 ,  H01L2924/181

摘要： In a lead frame with a reinforcing ring surrounding a semiconductor element which are electrically connected to leads through electrodes is integrally formed through suspending portions, reinforcing portions for reinforcing the suspending portions are provided on the suspending portiones. Upon application of a lead frame forming technique in which a laminate plate of three or more layers is used as a base, and inner leads are formed at one side while outer leads are formed by the surface layer at the other side, the lead frame is formed by forming a ring in place of outer leads, for example. A semiconductor package is formed by mounting the lead frame on a semiconductor chip.

摘要翻译： 在具有电连接到引线通过电极的半导体元件周围的加强环的引线框架通过悬挂部分一体地形成，用于加强悬挂部分的加强部分设置在悬挂部分上。 在使用三层以上的层叠板作为基底的引线框架成形技术的应用中，并且在一侧形成内部引线，而在另一侧由表面层形成外部引线，引线框架 例如，通过形成环代替外引线形成。 通过将引线框架安装在半导体芯片上来形成半导体封装。

公开(公告)号：US06319749B1

公开(公告)日：2001-11-20

申请号：US09562750

申请日：2000-05-02

申请人： Hiroyuki Shigeta ,  Kenji Osawa ,  Kazuhiro Sato ,  Haruhiko Makino ,  Makoto Ito

发明人： Hiroyuki Shigeta ,  Kenji Osawa ,  Kazuhiro Sato ,  Haruhiko Makino ,  Makoto Ito

IPC分类号： H01L2144

CPC分类号： H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15184 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： In a lead frame with a reinforcing ring surrounding a semiconductor element which are electrically connected to leads through electrodes is integrally formed through suspending portions, reinforcing portions for reinforcing the suspending portions are provided on the suspending portions. Upon application of a lead frame forming technique in which a laminate plate of three or more layers is used as a base, and inner leads are formed at one side while outer leads are formed by the surface layer at the other side, the lead frame is formed by forming a ring in place of outer leads, for example. A semiconductor package is formed by mounting the lead frame on a semiconductor chip.

摘要翻译： 在具有电连接到引线通过电极的半导体元件周围的加强环的引线框架通过悬挂部分一体地形成，用于加强悬挂部分的加强部分设置在悬挂部分上。 在使用三层以上的层叠板作为基底的引线框架成形技术的应用中，并且在一侧形成内部引线，而在另一侧由表面层形成外部引线，引线框架 例如，通过形成环代替外引线形成。 通过将引线框架安装在半导体芯片上来形成半导体封装。

公开(公告)号：US06492199B2

公开(公告)日：2002-12-10

申请号：US09773653

申请日：2001-01-31

申请人： Kenji Osawa ,  Kazuhiro Sato ,  Makoto Ito

发明人： Kenji Osawa ,  Kazuhiro Sato ,  Makoto Ito

IPC分类号： H01L2148

CPC分类号： H01L23/24 ,  H01L23/495 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor chip that has electrode pads on the chip front surface and disposed inside a conductive outer ring. A film circuit is disposed on the chip front surface side. External connection thermals are formed on the film circuit so as to project there from. First leads electrically connect part of the electrode pads to part of the external connection terminals. A second lead electrically connects a grounding or power supply electrode pad to the outer ring, and a third lead electrically connects a grounding or power supply external connection terminal to the outer ring.

摘要翻译： 一种制造半导体芯片的方法，该半导体芯片在芯片前表面上具有设置在导电外圈内部的电极焊盘。 薄片电路设置在芯片正面侧。 在薄膜电路上形成外部连接热量，从而在其上突出。 第一引线将电极焊盘的一部分电连接到外部连接端子的一部分。 第二引线将接地或电源电极焊盘电连接到外环，而第三引线将接地或电源外部连接端子电连接到外环。

公开(公告)号：US6077727A

公开(公告)日：2000-06-20

申请号：US786285

申请日：1997-01-22

申请人： Kenji Osawa ,  Makoto Ito

发明人： Kenji Osawa ,  Makoto Ito

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/495 ,  H01L23/50 ,  H01L21/44

CPC分类号： H01L24/50 ,  H01L21/4828 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082

摘要： There is provided a method for manufacturing a lead frame which can easily manufacture a high quality lead frame.A pattern layer is selectively formed on a copper plate and the surface of the substrate having formed this pattern layer is then plated with gold to form a gold layer using the pattern layer as the mask. Next, the gold layer is then plated with copper to form a copper layer, thereby forming a fine lead consisting of two layers of gold layer and copper layer. Thereafter, the pattern layer is selectively removed, an insulated resist film is formed and the copper plate is etched. In this case, the gold layer is used as the etching stop layer. Thereby, the lead frame having the fine lead of double-layer structure can be formed.

摘要翻译： 提供一种可以容易地制造高品质引线框的引线框的制造方法。 在铜板上选择性地形成图案层，并且使用图案层作为掩模，将形成该图案层的基板的表面镀金以形成金层。 接着，用铜镀金层形成铜层，由此形成由两层金层和铜层构成的细小导线。 此后，选择性地去除图案层，形成绝缘抗蚀剂膜，并蚀刻铜板。 在这种情况下，金层用作蚀刻停止层。 由此，可以形成具有双层结构的细导线的引线框架。

公开(公告)号：US06194778B1

公开(公告)日：2001-02-27

申请号：US08910711

申请日：1997-08-13

申请人： Kenji Ohsawa ,  Kazuhiro Sato ,  Makoto Ito

发明人： Kenji Ohsawa ,  Kazuhiro Sato ,  Makoto Ito

IPC分类号： H01L23495

CPC分类号： H01L23/24 ,  H01L23/495 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： In a semiconductor chip, electrode pads are formed in a peripheral portion of the chip front surface and the inside of the pad forming region is made an effective device region. An insulating, thick-film protective layer is laminated on the effective device region of the semiconductor chip. Leads are constituted of outer leads that are protected by an insulating film and inner leads that are integral with and extend from the outer leads. External connection terminals are formed on the outer leads, and the tips of the inner leads are connected to the electrode pads of the semiconductor chip. A reinforcement plate is provided so as to surround the semiconductor chip. A peripheral space of the semiconductor chip is charged with a sealing resin. According to a second aspect of the invention, a semiconductor chip has electrode pads on the chip front surface and disposed inside a conductive outer ring. A film circuit is disposed on the chip front surface side. External connection terminals are formed on the film circuit so as to project therefrom. First leads electrically connect part of the electrode pads to part of the external connection terminals. A second lead electrically connects a grounding or power supply electrode pad to the outer ring, and a third lead electrically connects a grounding or power supply external connection terminal to the outer ring. A conductive stage is bonded to the chip back surface and the outer ring through respective conductive bonding layers.

公开(公告)号：US6093970A

公开(公告)日：2000-07-25

申请号：US361955

申请日：1999-07-27

申请人： Kenji Ohsawa ,  Makoto Ito ,  Yasushi Otsuka ,  Kazuhiro Sato

发明人： Kenji Ohsawa ,  Makoto Ito ,  Yasushi Otsuka ,  Kazuhiro Sato

IPC分类号： H01L23/24 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/48

CPC分类号： H01L24/50 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49572 ,  H01L23/4985 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/3025 ,  H01L2924/351

摘要： An improved semiconductor device and method of manufacturing employs interconnecting films on film circuit as ground lines which extend to the periphery of the film circuit where there is a further connection to a conductive reinforcing plate 25. Advantageously, the conductive reinforcing plate reduces electrical noise from interfering with the semiconductor device and prevents the semiconductor device from radiating undesired signals. The interconnecting films also reduce cross-talk between signal lines of the semiconductor device.

摘要翻译： 改进的半导体器件和制造方法在薄膜电路上使用互连膜作为接地线，其延伸到膜电路的外围，其中进一步连接到导电加强板25.有利地，导电加强板减少电噪声干扰 与半导体器件并且防止半导体器件辐射不期望的信号。 互连膜还减少了半导体器件的信号线之间的串扰。

公开(公告)号：US5945741A

公开(公告)日：1999-08-31

申请号：US812358

申请日：1997-03-05

申请人： Kenji Ohsawa ,  Makoto Ito ,  Yasushi Otsuka ,  Kazuhiro Sato

发明人： Kenji Ohsawa ,  Makoto Ito ,  Yasushi Otsuka ,  Kazuhiro Sato

IPC分类号： H01L23/24 ,  H01L23/495 ,  H01L23/48

CPC分类号： H01L24/50 ,  H01L23/24 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/351

摘要： A semiconductor device employs interconnecting films on film circuit as ground lines which extend to the periphery of the film circuit where there is a further connection to a conductive reinforcing plate. Advantageously the conductive reinforcing plate reduces electrical noise from interfering with the semiconductor device and prevents the semiconductor device from radiating undesired signals. The interconnecting films also reduce cross-talk between signal lines of the semiconductor device.

摘要翻译： 半导体器件在薄膜电路上使用互连膜作为延伸到薄膜电路的周边的接地线，其中进一步连接到导电加强板。 有利的是，导电加强板可降低干扰半导体器件的电噪声，并防止半导体器件辐射不期望的信号。 互连膜还减少了半导体器件的信号线之间的串扰。

公开(公告)号：US09139276B2

公开(公告)日：2015-09-22

申请号：US14368810

申请日：2012-05-09

申请人： Makoto Ito

发明人： Makoto Ito

IPC分类号： B63H21/22 ,  B63H20/12 ,  B63H5/08 ,  B63H21/21 ,  B63H25/02 ,  B63H20/00 ,  B63H25/42

CPC分类号： B63H20/12 ,  B63H5/08 ,  B63H21/21 ,  B63H21/265 ,  B63H25/02 ,  B63H25/42 ,  B63H2020/003

摘要： A plurality of outboard motors are mounted to a stern of a watercraft and configured to be steered independently. A target steering angle setting section is configured to set a target steering angle for each of the outboard motors. Actuators are configured to steer the outboard motors such that the steering angle of each of the outboard motors is equal or substantially equal to a target steering angle. An actual steering angle detecting section is configured to detect an actual steering angle of each of the outboard motors. A control section is programmed and configured to control the steering operation of the outboard motors such that, when a steering angle difference defining a difference between the actual steering angles of adjacently arranged outboard motors becomes equal to or larger than a prescribed value, an increase of the steering angle difference is prevented.

摘要翻译： 多个舷外马达安装在船舶船尾，并被配置成独立转向。 目标转向角设定部被配置为对每个舷外马达设定目标转向角。 致动器构造成转向舷外马达，使得每个舷外马达的转向角等于或基本上等于目标转向角。 实际的转向角检测部被配置为检测每个舷外马达的实际转向角。 控制部被编程和配置为控制舷外马达的转向操作，使得当定义相邻排列的外侧马达的实际转向角之间的差异的转向角差异等于或大于规定值时，增加 防止转向角差。

公开(公告)号：US09062315B2

公开(公告)日：2015-06-23

申请号：US13877225

申请日：2011-09-30

申请人： Keishi Sakaguchi ,  Rie Hamaguchi ,  Takanori Matsuda ,  Makoto Ito ,  Naoki Nagano ,  Masahiro Hayashi ,  Daisuke Honda ,  Yuji Okita ,  Shinichi Sugimoto

发明人： Keishi Sakaguchi ,  Rie Hamaguchi ,  Takanori Matsuda ,  Makoto Ito ,  Naoki Nagano ,  Masahiro Hayashi ,  Daisuke Honda ,  Yuji Okita ,  Shinichi Sugimoto

IPC分类号： C12N15/79 ,  C12N15/89 ,  C12N9/02 ,  C12N9/10 ,  C12P7/64 ,  C12N15/52

CPC分类号： C12N15/79 ,  C12N9/0071 ,  C12N9/0083 ,  C12N9/1029 ,  C12N15/113 ,  C12N15/52 ,  C12N15/895 ,  C12N2310/11 ,  C12N2310/14 ,  C12P7/6409 ,  C12P7/6427 ,  C12P7/6472 ,  C12Y114/19001 ,  C12Y114/19006 ,  C12Y203/01119

摘要： To provide a transformation method for producing a stramenopile organism having an improved unsaturated fatty acid production capability by disrupting a gene of the stramenopile organism or inhibiting the expression of the gene in a genetically engineering manner. [Solution] A method for transforming a stramenopile organism, which comprises disrupting a gene of the stramenopile organism or inhibiting the expression of the gene in a genetically engineering manner, and which is characterized in that the stramenopile organism is selected from Thraustochytrium aureum, Parietichytrium sarkarianum, Thraustochytrium roseum and Parietichytrium sp. and the gene to be disrupted or of which the expression is to be inhibited is a gene associated with the biosynthesis of a fatty acid.

摘要翻译： 提供通过以遗传工程方式破坏该层状生物体的基因或抑制该基因的表达来生产具有改善的不饱和脂肪酸生产能力的前烧石生物的转化方法。 [解决方案]一种转基因生物的方法，其包括以基因工程方式破坏所述地精生物体的基因或抑制所述基因的表达，其特征在于，所述前列腺生物体选自甲状腺破囊壶菌（Salisochytrium aureum），，鱼（Parietichytrium sarkarianum） ，玫瑰色胸，和Parietichytrium sp。 并且待破坏的基因或其表达被抑制的基因是与脂肪酸的生物合成相关的基因。

公开(公告)号：US08608242B2

公开(公告)日：2013-12-17

申请号：US13547962

申请日：2012-07-12

申请人： Masayuki Yamada ,  Hideki Kobayashi ,  Takeshi Tokai ,  Masaki Mori ,  Keisuke Onoda ,  Makoto Ito

发明人： Masayuki Yamada ,  Hideki Kobayashi ,  Takeshi Tokai ,  Masaki Mori ,  Keisuke Onoda ,  Makoto Ito

IPC分类号： A47C7/14 ,  B60N2/02

CPC分类号： B60N2/02 ,  B60N2/3011 ,  B60N2/3013 ,  B60N2/3031 ,  B60N2/305 ,  B60N2/3065 ,  B60N2/309 ,  B60N2/986

摘要： In a seat, in a state in which tilting of a back main frame around a tilting center is locked by a reclining mechanism, a lower end of a back joint link is turnably joined to a vehicle side. Thus, turning of a first link, a back sub frame and the back joint link is locked, and operation of a back link mechanism is locked. Therefore, a supporting rigidity from rear side of a back side portion can be enhanced by the back link mechanism (the back sub frame), and a crew sitting in the seat can be thoroughly retained.

摘要翻译： 在座椅中，在倾斜中心的背部主框架的倾斜由倾斜机构锁定的状态下，后部接头连杆的下端可转动地接合到车辆侧。 因此，第一连杆，后副车架和后关节链节的转动被锁定，并且后连杆机构的操作被锁定。 因此，通过后连杆机构（后副车架）可以提高从后侧部的后侧的支撑刚性，能够充分地保持坐在座椅中的乘员。