发明授权
US6114986A Dual channel microwave transmit/receive module for an active aperture of
a radar system
失效
双通道微波发射/接收模块,用于雷达系统的主动孔径
- 专利标题: Dual channel microwave transmit/receive module for an active aperture of a radar system
- 专利标题(中): 双通道微波发射/接收模块,用于雷达系统的主动孔径
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申请号: US158829申请日: 1998-09-23
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公开(公告)号: US6114986A公开(公告)日: 2000-09-05
- 发明人: John W. Cassen , Stephanie A. Parks , Edward L. Rich, III , Gary N. Bonadies , Gary L. Ferrell , John S. Fisher , John W. Gipprich , John D. Gornto , Daniel J. Heffernan , David A. Herlihy , Andrew J. Piloto , Patrick K. Richard , David W. Strack , Scott K. Suko
- 申请人: John W. Cassen , Stephanie A. Parks , Edward L. Rich, III , Gary N. Bonadies , Gary L. Ferrell , John S. Fisher , John W. Gipprich , John D. Gornto , Daniel J. Heffernan , David A. Herlihy , Andrew J. Piloto , Patrick K. Richard , David W. Strack , Scott K. Suko
- 申请人地址: CA Los Angeles
- 专利权人: Northrop Grumman Corporation
- 当前专利权人: Northrop Grumman Corporation
- 当前专利权人地址: CA Los Angeles
- 主分类号: G01S7/28
- IPC分类号: G01S7/28 ; G01S7/03 ; H01Q21/00 ; H04B1/40 ; H04B1/48
摘要:
Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high temperature cofired ceramic (HTCC) layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. The T/R module is one module of an array of like T/R modules coupled to an active aperture of a radar system.