公开(公告)号：US6094161A

公开(公告)日：2000-07-25

申请号：US456407

申请日：1999-12-08

申请人： John W. Cassen ,  Stephanie A. Parks ,  Edward L. Rich, III ,  Gary N. Bonadies ,  Gary L. Ferrell ,  John S. Fisher ,  John W. Gipprich ,  John D. Gornto ,  Daniel J. Heffernan ,  David A. Herlihy ,  Andrew J. Piloto ,  Patrick K. Richard ,  David W. Strack ,  Scott K. Suko

发明人： John W. Cassen ,  Stephanie A. Parks ,  Edward L. Rich, III ,  Gary N. Bonadies ,  Gary L. Ferrell ,  John S. Fisher ,  John W. Gipprich ,  John D. Gornto ,  Daniel J. Heffernan ,  David A. Herlihy ,  Andrew J. Piloto ,  Patrick K. Richard ,  David W. Strack ,  Scott K. Suko

IPC分类号： G01S7/28 ,  G01S7/03 ,  H01Q21/00 ,  H04B1/40 ,  H04B1/48

CPC分类号： G01S7/03 ,  G01S7/032 ,  H01Q21/0025

摘要： Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high temperature cofired ceramic (HTCC) layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. The MMICs which generate substantially all of the heat are located in multi-level cavities formed in the substrate and are bonded directly to a generally flat a heat sink plate which is secured to the bottom of the substrate and acts as a thermal interface to an external heat exchanger such as a cold plate. DC power conditioning is also provided by a capacitive bank type of energy storage subassembly externally attached to the rear of the module package for supplying supplementary power to the module during peak power operation. The T/R module is one module of an array of like T/R modules coupled to an active aperture of a radar system.

摘要翻译： 两个离散的发射/接收（T / R）信道在单个公共T / R模块封装中实现，其具有提供组合功能，控制和功率调节的能力，同时利用单个多腔多层衬底，其包括高温 共烧陶瓷（HTCC）层。 陶瓷层具有包括接地面和带状线导体的相应金属化图案以及形成在其中的馈通或垂直通孔的外表面，用于提供屏蔽RF和DC电力和逻辑控制信号两者的三维布线，以便除其他外， 一对RF歧管信号耦合器，其嵌入在衬底中并且转变到封装前端处的多引脚盲配合压接RF连接器组件。 DC和逻辑输入/输出控制信号通过封装后部的弹簧接触焊盘连接到包括专用集成电路（ASIC）和单片微波集成电路芯片（MMIC）的多个有源电路部件。 产生基本上所有热量的MMIC位于形成在基板中的多层空腔中，并且直接结合到大致平坦的散热板上，该散热板固定到基板的底部并用作与外部的热接口 换热器如冷板。 直流功率调节也由外部连接到模块封装后部的电容式储能型存储子组件提供，用于在峰值功率操作期间向模块提供补充功率。 T / R模块是耦合到雷达系统的有效孔径的类似T / R模块的阵列的一个模块。

公开(公告)号：US6114986A

公开(公告)日：2000-09-05

申请号：US158829

申请日：1998-09-23

申请人： John W. Cassen ,  Stephanie A. Parks ,  Edward L. Rich, III ,  Gary N. Bonadies ,  Gary L. Ferrell ,  John S. Fisher ,  John W. Gipprich ,  John D. Gornto ,  Daniel J. Heffernan ,  David A. Herlihy ,  Andrew J. Piloto ,  Patrick K. Richard ,  David W. Strack ,  Scott K. Suko

发明人： John W. Cassen ,  Stephanie A. Parks ,  Edward L. Rich, III ,  Gary N. Bonadies ,  Gary L. Ferrell ,  John S. Fisher ,  John W. Gipprich ,  John D. Gornto ,  Daniel J. Heffernan ,  David A. Herlihy ,  Andrew J. Piloto ,  Patrick K. Richard ,  David W. Strack ,  Scott K. Suko

IPC分类号： G01S7/28 ,  G01S7/03 ,  H01Q21/00 ,  H04B1/40 ,  H04B1/48

CPC分类号： G01S7/03 ,  G01S7/032 ,  H01Q21/0025

摘要： Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high temperature cofired ceramic (HTCC) layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. The T/R module is one module of an array of like T/R modules coupled to an active aperture of a radar system.

摘要翻译： 两个离散的发射/接收（T / R）信道在单个公共T / R模块封装中实现，其具有提供组合功能，控制和功率调节的能力，同时利用单个多腔多层衬底，其包括高温 共烧陶瓷（HTCC）层。 陶瓷层具有包括接地面和带状线导体的相应金属化图案以及形成在其中的馈通或垂直通孔的外表面，用于提供屏蔽RF和DC电力和逻辑控制信号两者的三维布线，以便除其他外， 一对RF歧管信号耦合器，其嵌入在衬底中并且转变到封装前端处的多引脚盲配合压接RF连接器组件。 DC和逻辑输入/输出控制信号通过封装后部的弹簧接触焊盘连接到包括专用集成电路（ASIC）和单片微波集成电路芯片（MMIC）的多个有源电路部件。 T / R模块是耦合到雷达系统的有效孔径的类似T / R模块的阵列的一个模块。

公开(公告)号：US6097335A

公开(公告)日：2000-08-01

申请号：US456330

申请日：1999-12-08

申请人： John W. Cassen ,  Stephanie A. Parks ,  Edward L. Rich, III ,  Gary N. Bonadies ,  Gary L. Ferrell ,  John S. Fisher ,  John W. Gipprich ,  John D. Gornto ,  Daniel J. Heffernan ,  David A. Herlihy ,  Patrick K. Richard ,  David W. Strack ,  Scott K. Suko

发明人： John W. Cassen ,  Stephanie A. Parks ,  Edward L. Rich, III ,  Gary N. Bonadies ,  Gary L. Ferrell ,  John S. Fisher ,  John W. Gipprich ,  John D. Gornto ,  Daniel J. Heffernan ,  David A. Herlihy ,  Patrick K. Richard ,  David W. Strack ,  Scott K. Suko

IPC分类号： G01S7/28 ,  G01S7/03 ,  H01Q21/00 ,  H04B1/40 ,  H04B1/48

CPC分类号： G01S7/03 ,  G01S7/032 ,  H01Q21/0025

摘要： A transmit/receive (T/R) module adapted for use in a radar system. The module has a unified structure including a layered substrate on and in which two T/R channel circuits are integrated. The channel circuits make use of power distribution, channel controller, and RF signal routing circuitry, partly on a channel shared basis. In the RF routing circuitry, respective coupler elements are employed to combine RF receive signals for output to an RF receive manifold and to split an RF transmit signal from a transmit manifold into separate RF transmit signals for input to the T/R channel circuits.

公开(公告)号：US06278400B1

公开(公告)日：2001-08-21

申请号：US09450905

申请日：1999-11-29

申请人： John W. Cassen ,  Edward L. Rich, III ,  Gary N. Bonadies ,  John S. Fisher ,  John W. Gipprich ,  John D. Gornto ,  Daniel J. Heffernan ,  David A. Herlihy ,  Scott C. Tolle ,  Patrick K. Richard ,  David W. Strack ,  Scott K. Suko ,  Timothy L. Eder ,  Chad E. Wilson ,  Gary L. Ferrell ,  Stephanie A. Parks

发明人： John W. Cassen ,  Edward L. Rich, III ,  Gary N. Bonadies ,  John S. Fisher ,  John W. Gipprich ,  John D. Gornto ,  Daniel J. Heffernan ,  David A. Herlihy ,  Scott C. Tolle ,  Patrick K. Richard ,  David W. Strack ,  Scott K. Suko ,  Timothy L. Eder ,  Chad E. Wilson ,  Gary L. Ferrell ,  Stephanie A. Parks

IPC分类号： G01S728

CPC分类号： G01S7/03 ,  G01S7/032 ,  H01Q21/0025

摘要： Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high or low temperature cofired ceramic layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. An RF connector assembly for coupling transmit and receive signals to and from the module is located at the front of the package. The RF transmit power amplifiers which generate most of the heat in the module package are located in a first pair of cavities formed in the substrate directly behind the RF connector assembly and are mounted directly on a pair of flat heat sink plates which are secured to the bottom of the substrate and acts as a thermal interface to an external heat exchanger such as a cold plate. A second pair of cavities in which are located the RF receive signal amplifiers and their respective receiver protector elements, is located beside the first pair of cavities directly behind the RF connector for reducing RF signal loss.

摘要翻译： 在单个公共T / R模块封装中实现两个离散的发送/接收（T / R）信道，其具有提供组合功能，控制和功率调节的能力，同时利用单个多腔多层衬底，其包括高或 低温共烧陶瓷层。 陶瓷层具有包括接地面和带状线导体的相应金属化图案以及形成在其中的馈通或垂直通孔的外表面，用于提供屏蔽RF和DC电力和逻辑控制信号两者的三维布线，以便除其他外， 一对RF歧管信号耦合器，其嵌入在衬底中并且转变到封装前端处的多引脚盲配合压接RF连接器组件。 DC和逻辑输入/输出控制信号通过封装后部的弹簧接触焊盘连接到包括专用集成电路（ASIC）和单片微波集成电路芯片（MMIC）的多个有源电路部件。 用于将模块的发送和接收信号耦合到RF模块的RF连接器组件位于封装的前部。 在模块封装中产生大部分热量的RF发射功率放大器位于直接位于RF连接器组件后面的衬底中形成的第一对空腔中，并直接安装在一对平坦的散热板上， 并且用作与诸如冷板之类的外部热交换器的热界面。 位于RF接收信号放大器及其各自的接收器保护器元件的第二对空腔位于RF连接器正后方的第一对空腔旁边，用于减少RF信号损失。

公开(公告)号：US6034633A

公开(公告)日：2000-03-07

申请号：US158832

申请日：1998-09-23

申请人： John W. Cassen ,  Stephanie A. Parks ,  Edward L. Rich, III ,  Gary N. Bonadies ,  Gary L. Ferrell ,  John S. Fisher ,  John W. Gipprich ,  John D. Gornto ,  Daniel J. Heffernan ,  David A. Herlihy ,  Patrick K. Richard ,  David W. Strack ,  Scott K. Suko

发明人： John W. Cassen ,  Stephanie A. Parks ,  Edward L. Rich, III ,  Gary N. Bonadies ,  Gary L. Ferrell ,  John S. Fisher ,  John W. Gipprich ,  John D. Gornto ,  Daniel J. Heffernan ,  David A. Herlihy ,  Patrick K. Richard ,  David W. Strack ,  Scott K. Suko

IPC分类号： G01S7/03 ,  H01Q21/00 ,  G01S7/28

CPC分类号： G01S7/03 ,  G01S7/032 ,  H01Q21/0025

摘要： A transmit/receive (T/R) module adapted for use in a radar system. The module has a unified structure including a layered substrate on and in which two T/R channel circuits are integrated. The channel circuits make use of power distribution, channel controller, and RF signal routing circuitry, partly on a channel shared basis. In the RF routing circuitry, respective coupler elements are employed to combine RF receive signals for output to an RF receive manifold and to split an RF transmit signal from a transmit manifold into separate RF transmit signals for input to the T/R channel circuits.

摘要翻译： 适用于雷达系统的发射/接收（T / R）模块。 该模块具有统一的结构，包括两个T / R通道电路集成在一起的层叠基板。 信道电路利用功率分配，信道控制器和RF信号路由电路，部分在信道共享的基础上。 在RF路由电路中，使用相应的耦合器元件将RF接收信号组合以输出到RF接收歧管，并将来自发射歧管的RF发射信号分离成用于输入到T / R信道电路的分离的RF发射信号。

公开(公告)号：US6005531A

公开(公告)日：1999-12-21

申请号：US158827

申请日：1998-09-23

申请人： John W. Cassen ,  Gary N. Bonadies ,  Patrick K. Richard ,  David A. Herlihy ,  Ayn U. Fuller ,  Daniel H. Wenzlick ,  Richard C. Kapraun ,  Mark R. Schrote ,  Kerry M. Yon ,  H. Halley Lisle, IV ,  Toby Hess ,  Edward L. Rich, III ,  George T. Hall ,  Brian T. Drude

发明人： John W. Cassen ,  Gary N. Bonadies ,  Patrick K. Richard ,  David A. Herlihy ,  Ayn U. Fuller ,  Daniel H. Wenzlick ,  Richard C. Kapraun ,  Mark R. Schrote ,  Kerry M. Yon ,  H. Halley Lisle, IV ,  Toby Hess ,  Edward L. Rich, III ,  George T. Hall ,  Brian T. Drude

IPC分类号： H01Q3/26 ,  G01S7/03 ,  H01Q21/00 ,  H01Q21/06

CPC分类号： H01Q21/064 ,  H01Q21/0025 ,  H01Q21/0087 ,  G01S7/032

摘要： An antenna assembly for an active electronically scanned array includes, among other things: an array of antenna elements; an RF signal feed and circulator assembly coupled to said antenna elements and forming thereby an array of radiating structures; a generally planar RF manifold assembly having regularly spaced openings therein located behind and normal to the radiating structures; an array of T/R modules connected to the array of radiating structures and having respective RF connector assemblies forming a portion of an RF interface at one end portion of each of the modules which project upwardly through said spaced openings in the RF manifold and wherein the respective connector assemblies thereof connect to at least one immediately adjacent circulator as well as to transmit and receive manifold portions of the RF manifold; each of the T/R modules further have a heat sink plate on the back side thereof which is positioned against one of a number of elongated liquid coolant circulating coldplates connected to a coolant distribution manifold encircling the array; a DC power and logic signal distribution manifold; and, a plurality of elongated DC/logic circuit board members connected to the DC power and logic signal distribution manifold and being respectively located adjacent and coextensive with a respective coldplate for supplying DC power and logic control signals to a DC/logic interface located at the other end portion of the respective modules.

摘要翻译： 用于有源电子扫描阵列的天线组件包括：天线元件阵列; 耦合到所述天线元件并由此形成辐射结构阵列的RF信号馈送和循环器组件; 大体上平面的RF歧管组件，其中具有规则间隔的开口，位于辐射结构的正后方; 连接到辐射结构阵列的T / R模块的阵列，并且具有相应的RF连接器组件，该RF连接器组件在每个模块的一个端部处形成RF接口的一部分，其通过RF歧管中的所述隔开的开口向上突出，并且其中 其相应的连接器组件连接到至少一个紧邻的循环器，以及传送和接收RF歧管的歧管部分; 每个T / R模块在其后侧还具有散热板，该散热板被定位成抵靠围绕阵列的冷却剂分配歧管连接的多个细长的液体冷却剂循环冷却板中的一个; 直流电源和逻辑信号分配歧管; 以及多个连接到DC电力和逻辑信号分配歧管的细长DC /逻辑电路板构件，并且分别位于与相应冷板相邻并共同延伸的用于将DC电力和逻辑控制信号提供给位于所述DC / 各个模块的另一端部。

公开(公告)号：US06979239B1

公开(公告)日：2005-12-27

申请号：US10879042

申请日：2004-06-30

申请人： Patrick K. Richard ,  Edward L. Rich, III ,  Kevin L. Ebersole ,  Angela J. Martin ,  Tapan K. Gupta ,  David W. Strack ,  John S. Fisher, III

发明人： Patrick K. Richard ,  Edward L. Rich, III ,  Kevin L. Ebersole ,  Angela J. Martin ,  Tapan K. Gupta ,  David W. Strack ,  John S. Fisher, III

IPC分类号： H01R4/02 ,  H01R13/00 ,  H01R13/03 ,  H01R13/646

CPC分类号： H01R24/50 ,  H01R13/03

摘要： Slots or apertures are formed in the connector shroud of a T/R module in a plane perpendicular to the axis of the connector so as to allow plating solution to flow freely through the entire inner portion of the connector, particularly the rear portion, during fabrication of the T/R module. The slots are formed prior to the shroud being brazed on to the module substrate. By allowing plating solution to flow through the connector, the interior of the connector can be more thoroughly plated, thereby improving the yield of the assembly while reducing cost.

摘要翻译： 在垂直于连接器的轴线的平面中，在T / R模块的连接器护罩中形成槽或孔，以便在制造过程中允许电镀液自由地流过连接器的整个内部，特别是后部 的T / R模块。 在将护罩钎焊到模块基板之前形成槽。 通过允许电镀溶液流过连接器，连接器的内部可以更彻底地镀覆，从而在降低成本的同时提高组件的产量。

公开(公告)号：US6055162A

公开(公告)日：2000-04-25

申请号：US41213

申请日：1998-03-12

申请人： Albert G. Tarrillo ,  Dennis Schaefer ,  Scott K. Suko ,  Edward L. Rich, III ,  Keith L. Rowe

发明人： Albert G. Tarrillo ,  Dennis Schaefer ,  Scott K. Suko ,  Edward L. Rich, III ,  Keith L. Rowe

IPC分类号： H02M3/335 ,  H02M7/538

CPC分类号： H02M3/33576

摘要： A DC-DC voltage converter 40, which is adaptable to VHF operation, has a power oscillator 52 to which a filtered input DC voltage 50 is applied for conversion to an output DC voltage. The power oscillator includes a push-pull amplifier 58, 60 and an impedance transformation circuit 62 to which the amplifier is connected. The power oscillator also includes a rectifier circuit 64 which is connected to the impedance transformation circuit. A feedback circuit 68 controls the frequency of the oscillator to regulate the output DC voltage. The oscillator frequency depends on the impedance values of oscillator circuit components and the values of a plurality of oscillator component intrinsic parameters.

摘要翻译： 适用于VHF操作的DC-DC电压转换器40具有电源振荡器52，经过滤波的输入DC电压50被施加到该功率振荡器52以转换为输出DC电压。 功率振荡器包括推挽放大器58,60和放大器连接到的阻抗变换电路62。 功率振荡器还包括连接到阻抗变换电路的整流电路64。 反馈电路68控制振荡器的频率来调节输出直流电压。 振荡器频率取决于振荡器电路组件的阻抗值和多个振荡器组件固有参数的值。

公开(公告)号：US4507640A

公开(公告)日：1985-03-26

申请号：US444637

申请日：1982-11-26

申请人： Edward L. Rich, III ,  Yucel Y. Yalim

发明人： Edward L. Rich, III ,  Yucel Y. Yalim

IPC分类号： H01F17/04 ,  H01F19/04 ,  H01F27/28

CPC分类号： H01F17/043 ,  H01F19/04

摘要： A high frequency, transformer capable of operating at high power levels is disclosed. Conductive ribbons including end (terminal) sections which permit the terminal leads of a plurality of windings to be extended from the windings in an overlapping relationship and in the selected order is utilized for the windings. Preferably, the core is formed of a material having low eddy current losses and characteristics permitting the core to be molded such that the windings are substantially surrounded by the core with the exception of small openings through which the leads extend.

摘要翻译： 公开了能够在高功率水平下工作的高频变压器。 用于绕组的导电带包括允许多个绕组的端子引线以重叠关系并以所选顺序从绕组延伸的端部（端子）部分。 优选地，芯由具有低涡流损耗和允许芯被模制的特性的材料形成，使得绕组基本上被芯围绕，除了引线延伸穿过的小开口。

公开(公告)号：US5945941A

公开(公告)日：1999-08-31

申请号：US41214

申请日：1998-03-12

申请人： Edward L. Rich, III ,  Albert G. Tarrillo

发明人： Edward L. Rich, III ,  Albert G. Tarrillo

IPC分类号： G01S7/282 ,  G01S13/02 ,  H02J1/00

CPC分类号： H02J1/00 ,  G01S7/282 ,  G01S2013/0254

摘要： A power distribution system (12) is provided in radar apparatus to distribute power from a 270 VDC source (60) through an intermediate power converter (70) and very high frequency (VHF) regulator/modulator units (80). Bus conductors (71,74) interconnect the source, the intermediate power converter, and the VHF units. Capacitors (71, 76) are connected to the bus conductors on the input and output sides of the intermediate power converter. Each VHF unit supplies modulating pulses to RF amplifiers (82) of an AESA array of the radar apparatus.

摘要翻译： 配电系统（12）设置在雷达装置中，以通过中间功率转换器（70）和非常高频（VHF）调节器/调制器单元（80）从270VDC源（60）分配功率。 总线导体（71,74）互连源，中间功率转换器和VHF单元。 电容器（71,76）连接到中间功率转换器的输入和输出侧的总线导体。 每个VHF单元将调制脉冲提供给雷达装置的AESA阵列的RF放大器（82）。