发明授权
US6122177A Semiconductor device-mounted on a printed circuit board having solder
bumps with excellent connection reliability
失效
半导体器件安装在具有焊料凸块的印刷电路板上，具有优异的连接可靠性
- 专利标题： Semiconductor device-mounted on a printed circuit board having solder bumps with excellent connection reliability
- 专利标题（中）： 半导体器件安装在具有焊料凸块的印刷电路板上，具有优异的连接可靠性
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申请号： US48856申请日： 1998-03-27
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公开(公告)号： US6122177A公开(公告)日： 2000-09-19
- 发明人: Makoto Kitano , Michiharu Honda
- 申请人： Makoto Kitano , Michiharu Honda
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX9-079569 19970331
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/66 ; H01L23/498 ; H05K1/02 ; H05K3/34 ; H01L21/58 ; G01R31/27
摘要：
In order to reduce a strain, developing in solder bumps in a BGA-type semiconductor device-mounting construction, so as to enhance a thermal fatigue life, voids, present in each solder bump joint portion of a BGA-type semiconductor device, are limited to a predetermined size, and a void of a large size, which would increase a strain to be produced, is eliminated.
公开/授权文献
- USD394339S Bib 公开/授权日：1998-05-19
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