公开(公告)号：US6122177A

公开(公告)日：2000-09-19

申请号：US48856

申请日：1998-03-27

申请人： Makoto Kitano ,  Michiharu Honda

发明人： Makoto Kitano ,  Michiharu Honda

IPC分类号： H01L21/60 ,  H01L21/66 ,  H01L23/498 ,  H05K1/02 ,  H05K3/34 ,  H01L21/58 ,  G01R31/27

CPC分类号： H01L23/49816 ,  H05K3/3436 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/15311 ,  H05K1/0269 ,  H05K2201/0116 ,  H05K2201/10734 ,  Y02P70/613

摘要： In order to reduce a strain, developing in solder bumps in a BGA-type semiconductor device-mounting construction, so as to enhance a thermal fatigue life, voids, present in each solder bump joint portion of a BGA-type semiconductor device, are limited to a predetermined size, and a void of a large size, which would increase a strain to be produced, is eliminated.

摘要翻译： 为了降低应变，在BGA型半导体器件安装结构中的焊料凸块中显影，以提高热疲劳寿命，存在于BGA型半导体器件的每个焊料凸块接合部分中的空隙受到限制 达到预定尺寸，并且消除了增加产生应变的大尺寸空隙。

公开(公告)号：US6114192A

公开(公告)日：2000-09-05

申请号：US114997

申请日：1998-07-14

申请人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

发明人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

IPC分类号： H01L21/50 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/04 ,  H01L23/31 ,  H01L21/44 ,  H01L21/48

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181

摘要： A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

摘要翻译： 一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。 树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模构成的模具，下半模具有多个突起，一个在 对应于每个外部端子的位置。 模具具有在其分割元件之间具有通风口的分隔结构。

公开(公告)号：US06686226B1

公开(公告)日：2004-02-03

申请号：US09562758

申请日：2000-05-02

申请人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

发明人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

IPC分类号： H01L2144

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold, which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

摘要翻译： 一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。 树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模组成的模具，下半模具有多个突起，一个在 与每个外部端子对应的位置。 模具具有在其分割元件之间具有通风口的分隔结构。

公开(公告)号：US06861294B2

公开(公告)日：2005-03-01

申请号：US10673459

申请日：2003-09-30

申请人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

发明人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L21/44

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

摘要翻译： 一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。 树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模组成的模具，下半模具有多个突起，一个在 对应于每个外部端子的位置。 模具具有在其分割元件之间具有通风口的分隔结构。

公开(公告)号：US06448646B1

公开(公告)日：2002-09-10

申请号：US09656762

申请日：2000-09-07

申请人： Makoto Kitano ,  Michiharu Honda

发明人： Makoto Kitano ,  Michiharu Honda

IPC分类号： H01L2158

CPC分类号： H01L23/49816 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/15311 ,  H05K1/0269 ,  H05K3/3436 ,  H05K2201/0116 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device-mounting construction including a semiconductor device having a plurality of electrodes formed on one main surface thereof. A printed circuit board having a writing pattern formed on one main surface thereof and a plurality of solder bumps interposed between the plurality of electrodes and the writing pattern to electrically connect the semiconductor device and the printed circuit board together. All of the voids, which are present in an interface of each of those of the plurality of solder bumps which are disposed closest to an outer peripheral edge of the semiconductor device, joined to the semiconductor device, are fine, and generally uniform in size.

摘要翻译： 一种半导体器件安装结构，包括在其一个主表面上形成有多个电极的半导体器件。 一种具有形成在其一个主表面上的书写图案的印刷电路板和插在所述多个电极之间的多个焊料凸块和所述书写图案，以将所述半导体器件和所述印刷电路板电连接在一起。 存在于与半导体器件最靠近半导体器件的外周边缘配置的多个焊料凸块中的每一个的界面中的所有空隙均良好，并且尺寸基本一致。

公开(公告)号：US5914531A

公开(公告)日：1999-06-22

申请号：US805737

申请日：1997-02-25

申请人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

发明人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

IPC分类号： H01L21/50 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/04 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181

摘要： A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

摘要翻译： 一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。 树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模构成的模具，下半模具有多个突起，一个在 对应于每个外部端子的位置。 模具具有在其分割元件之间具有通风口的分隔结构。

公开(公告)号：US07236158B2

公开(公告)日：2007-06-26

申请号：US10667502

申请日：2003-09-23

申请人： Atsushi Iisaka ,  Kiyomi Sakamoto ,  Atsushi Yamashita ,  Michiharu Honda ,  Takatoshi Ono ,  Takefumi Inoue ,  Kiyotaka Sasanouchi

发明人： Atsushi Iisaka ,  Kiyomi Sakamoto ,  Atsushi Yamashita ,  Michiharu Honda ,  Takatoshi Ono ,  Takefumi Inoue ,  Kiyotaka Sasanouchi

IPC分类号： G09G5/08

CPC分类号： G06F3/03549

摘要： The present invention provides a trackball and an in-vehicle device controller using the trackball. The trackball provides a stable operational feel and is easy to operate even in an environment in a vehicle where vibration and movement are present. The trackball includes a ball made of a non-magnetic material and having embedded therein bar members made of a magnetic material and arranged on three axes orthogonal to one another, a case enclosing the ball such that at least an upper portion of the ball is exposed, magnetic members fixed to the case on two axes penetrating through the center of the ball and orthogonal to each other so as to allow magnetic coupling to ends of the bar members, and another magnetic member fixed to the case on an axis penetrating through the center of the ball and orthogonal to the two axes so as to allow magnetic coupling to an end of one of the bar members.

摘要翻译： 本发明提供一种使用轨迹球的轨迹球和车载装置控制器。 轨迹球提供稳定的操作感觉，并且即使在存在振动和运动的车辆的环境中也容易操作。 轨迹球包括由非磁性材料制成的球，并且其中嵌入有由磁性材料制成的棒构件并且布置在彼此正交的三个轴上，壳体包围球，使得至少球的上部暴露 磁性部件固定在壳体上，穿过球的中心并且彼此正交的两个轴线，以允许磁耦合到杆件的端部，另一个磁性部件固定在穿过中心的轴线上的壳体上 并且与两个轴正交，以允许磁耦合到一个杆构件的端部。

公开(公告)号：US06460755B1

公开(公告)日：2002-10-08

申请号：US08813577

申请日：1997-03-07

申请人： Kosuke Inoue ,  Takamichi Suzuki ,  Hitoshi Odashima ,  Katsuhiro Iwashita ,  Tatsuya Yoneda ,  Michiharu Honda ,  Katuhisa Tanaka ,  Tsuyoshi Yamaguchi ,  Tetsuo Murakami ,  Asahi Tsuchiya ,  Yoshitatsu Naito ,  Mitsuhiro Suzuki ,  Izumi Hata ,  Kouji Sajiki

发明人： Kosuke Inoue ,  Takamichi Suzuki ,  Hitoshi Odashima ,  Katsuhiro Iwashita ,  Tatsuya Yoneda ,  Michiharu Honda ,  Katuhisa Tanaka ,  Tsuyoshi Yamaguchi ,  Tetsuo Murakami ,  Asahi Tsuchiya ,  Yoshitatsu Naito ,  Mitsuhiro Suzuki ,  Izumi Hata ,  Kouji Sajiki

IPC分类号： B23K500

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/4853 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11334 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0269 ,  H05K3/3489 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/082 ,  H01L2924/00014 ,  H01L2924/00012

摘要： There are disclosed a solder bump forming method and an apparatus therefor, which achieve a high reliability, and an electronic part, produced by this method and this apparatus, is also disclosed. For each of the step of arraying solder balls, the step of supplying a flux, and the step of mounting the solder balls on a board, it is checked whether or not any solder ball is omitted, and the process is conducted while confirming the condition of the operation, thereby enhancing the reliability and also preventing defective products from being produced.

摘要翻译： 公开了一种实现高可靠性的焊料凸块形成方法及其装置，并且还公开了通过该方法和该装置制造的电子部件。 对于排列焊球的步骤，供给焊剂的步骤以及将焊球安装在板上的步骤，检查是否省略任何焊球，并且在确认条件的同时进行处理 的操作，从而提高可靠性并且还防止不良产品的生产。

公开(公告)号：US5390079A

公开(公告)日：1995-02-14

申请号：US942706

申请日：1992-09-09

申请人： Kokichi Aomori ,  Michiharu Honda ,  Toshihiro Okabe

发明人： Kokichi Aomori ,  Michiharu Honda ,  Toshihiro Okabe

IPC分类号： B23K1/002 ,  H01L21/48 ,  H01L23/495 ,  H01L23/50 ,  H05K1/18 ,  H05K3/34 ,  H05K13/04 ,  H05K1/00

CPC分类号： H01L23/49572 ,  B23K1/002 ,  H01L21/4853 ,  H05K13/0465 ,  H05K3/3421 ,  H01L2924/0002 ,  H05K2201/10424 ,  H05K2201/10681 ,  H05K2201/10689 ,  H05K2203/0195 ,  H05K2203/101 ,  Y02P70/613

摘要： A tape carrier package has a base film and leads formed on one side of the base film. The base film defines a device hole therein, while the leads have outer portions to be bonded to a substrate and inner lead portions extending into the device hole. The tape carrier package can be mounted on a substrate by applying a high-frequency electromagnetic field to a portion of each lead which is to be bonded to the substrate, whereby solder applied to the lead or substrate in advance is heated and melted to bond the package to the substrate.

摘要翻译： 带状载体封装具有基膜和形成在基膜的一侧上的引线。 基膜在其中限定了一个器件孔，而引线具有要接合到基板的外部部分和延伸到器件孔中的内部引线部分。 通过将高频电磁场施加到要接合到基板的每个引线的一部分，可以将载带封装安装在基板上，由此将预先施加到引线或基板的焊料加热熔化以将 包装到基材。

公开(公告)号：US5198888A

公开(公告)日：1993-03-30

申请号：US631154

申请日：1990-12-20

申请人： Toshio Sugano ,  Kohji Nagaoka ,  Seiichiro Tsukui ,  Yoshiaki Wakashima ,  Michio Tanimoto ,  Masayuki Watanabe ,  Suguru Sakaguchi ,  Kunihiko Nishi ,  Aizo Kaneda ,  Kohji Serizawa ,  Michiharu Honda ,  Tohru Yoshida ,  Takeshi Komaru ,  Atsushi Nakamura

发明人： Toshio Sugano ,  Kohji Nagaoka ,  Seiichiro Tsukui ,  Yoshiaki Wakashima ,  Michio Tanimoto ,  Masayuki Watanabe ,  Suguru Sakaguchi ,  Kunihiko Nishi ,  Aizo Kaneda ,  Kohji Serizawa ,  Michiharu Honda ,  Tohru Yoshida ,  Takeshi Komaru ,  Atsushi Nakamura

IPC分类号： G11C5/00 ,  H01L23/498 ,  H01L25/065 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36

CPC分类号： G11C5/06 ,  G11C5/02 ,  H01L23/49805 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06596 ,  H01L2924/07811 ,  H01L2924/09701 ,  H05K1/144 ,  H05K1/182 ,  H05K3/3421 ,  H05K3/363

摘要： There is a trend to increase that area of a device requiring a memory of large capacity, which is occupied by a semiconductor memory. This trend obstructs reduction of the size of the device. The present invention contemplates to provide a memory which can have a high integration, a high density and a large capacity while minimizing the mounting area. In order to achieve this memory, the TAB (Tape Automated Bonding) of the prior art is mounted on an electrically conductive connector, and a plurality of structures composed of the TAB and the connector are stacked. Moreover, the connector mounting the TAB thereon is constructed such that the independent terminals of the stacked TABs may not be shorted.

摘要翻译： 存在增加需要大容量存储器的器件的面积的趋势，其由半导体存储器占据。 这种趋势阻碍了设备尺寸的减小。 本发明旨在提供一种能够在最小化安装面积的同时具有高集成度，高密度和大容量的存储器。 为了实现这种记忆，现有技术的TAB（磁带自动接合）被安装在导电连接器上，并且由TAB和连接器组成的多个结构被堆叠。 此外，将TAB安装在其上的连接器构造成使得堆叠的TAB的独立端子可能不会短路。