发明授权
US6127227A Thin ONO thickness control and gradual gate oxidation suppression by b.
N.su2 treatment in flash memory
有权
闪存中通过N2处理对ONO厚度进行薄膜控制和逐步门极氧化抑制
- 专利标题: Thin ONO thickness control and gradual gate oxidation suppression by b. N.su2 treatment in flash memory
- 专利标题(中): 闪存中通过N2处理对ONO厚度进行薄膜控制和逐步门极氧化抑制
-
申请号: US236491申请日: 1999-01-25
-
公开(公告)号: US6127227A公开(公告)日: 2000-10-03
- 发明人: Chrong Jung Lin , Jong Chen , Hung-Der Su , Di-Son Kuo
- 申请人: Chrong Jung Lin , Jong Chen , Hung-Der Su , Di-Son Kuo
- 申请人地址: TWX Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company
- 当前专利权人: Taiwan Semiconductor Manufacturing Company
- 当前专利权人地址: TWX Hsin-Chu
- 主分类号: H01L21/28
- IPC分类号: H01L21/28 ; H01L29/51 ; H01L21/8247
摘要:
A method of forming a flash memory cell is disclosed where nitrogen treatment or implantation is employed. Nitrogen introduced into the upper layers of the polysilicon of the floating gate is instrumental in forming an unusually thin layer comprising nitrogen-oxygen-silicon. This N--O--Si layer is formed while growing the bottom oxide layer of the oxide-nitride-oxide, or ONO, the intergate layer between the floating gate and the control gate of the flash memory cell. Nitrogen in the first polysilicon layer provides control for the thickness of the bottom oxide while at the same time suppressing the gradual gate oxidation (GGO) effect in the floating gate. The now augmented ONO composite through the N--O--Si layer provides an enhanced intergate dielectric and hence, a flash memory cell with more precise coupling ratio and better performance.
公开/授权文献
- US5486397A Protected reflection image 公开/授权日:1996-01-23
信息查询
IPC分类: