发明授权
- 专利标题： Semiconductor device
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申请号： US166857申请日： 1998-10-06
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公开(公告)号： US6130112A公开(公告)日： 2000-10-10
- 发明人: Makoto Kitano , Ryuji Kohno , Naotaka Tanaka , Akihiro Yaguchi , Tetsuo Kumazawa , Ichiro Anjoh , Hideki Tanaka , Asao Nishimura , Shuji Eguchi , Akira Nagai , Mamoru Mita
- 申请人： Makoto Kitano , Ryuji Kohno , Naotaka Tanaka , Akihiro Yaguchi , Tetsuo Kumazawa , Ichiro Anjoh , Hideki Tanaka , Asao Nishimura , Shuji Eguchi , Akira Nagai , Mamoru Mita
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX8-062482 19960319
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/04 ; H01L23/12 ; H01L23/31 ; H01L23/495 ; H01L21/48
摘要：
A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.
公开/授权文献
- US5412288A Amalgam support in an electrodeless fluorescent lamp 公开/授权日：1995-05-02
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