公开(公告)号：US6049128A

公开(公告)日：2000-04-11

申请号：US820631

申请日：1997-03-19

申请人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

发明人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/12 ,  H01L23/31 ,  H01L23/495 ,  H01L23/48 ,  H01L23/34 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15787

摘要： A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.

摘要翻译： 提供一种半导体器件，具有多个用于外部连接的电极的半导体芯片，除弹性体树脂形成的弹性体树脂部分，其除了多个电极中的至少一些外部结合到半导体芯片，包括树脂的带层，包括 表面上的带状布线图案，用于将印刷布线图案接合到带布线图案的多个焊料凸块，用于将半导体芯片的多个电极连接到带布线图案的引线，以及密封用于覆盖引线的树脂， 由引线连接的多个电极。 弹性体树脂的横向弹性模量不小于50MPa且不大于750MPa。

公开(公告)号：US6130112A

公开(公告)日：2000-10-10

申请号：US166857

申请日：1998-10-06

申请人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

发明人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/12 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15787

摘要： A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.

公开(公告)号：US06297073B1

公开(公告)日：2001-10-02

申请号：US09547937

申请日：2000-04-11

申请人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

发明人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

IPC分类号： H01L21283

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15787 ,  H01L2924/00

摘要： A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.

摘要翻译： 提供一种半导体器件，具有多个用于外部连接的电极的半导体芯片，除弹性体树脂形成的弹性体树脂部分，其除了多个电极中的至少一些外部结合到半导体芯片，包括树脂的带层，包括 表面上的带状布线图案，用于将印刷布线图案接合到带布线图案的多个焊料凸块，用于将半导体芯片的多个电极连接到带布线图案的引线，以及密封用于覆盖引线的树脂， 由引线连接的多个电极。 弹性体树脂的横向弹性模量不小于50MPa且不大于750MPa。

公开(公告)号：US5569960A

公开(公告)日：1996-10-29

申请号：US438466

申请日：1995-05-10

申请人： Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiro Yaguchi ,  Ryuji Kohno ,  Naotaka Tanaka ,  Nae Yoneda ,  Ichiro Anjoh

发明人： Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiro Yaguchi ,  Ryuji Kohno ,  Naotaka Tanaka ,  Nae Yoneda ,  Ichiro Anjoh

IPC分类号： H05K1/18 ,  H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/50 ,  H05K1/11 ,  H05K3/34 ,  H01L23/48

CPC分类号： H01L24/11 ,  H01L23/3128 ,  H05K3/3436 ,  H01L2224/13099 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/20752 ,  H05K1/11 ,  H05K1/111 ,  H05K2201/094 ,  H05K2203/0465 ,  H05K3/3431 ,  Y02P70/613

摘要： An electronic component unit is provided with two electronic components which are disposed in parallel with each other and each of which has an internal electric circuit therein. Electrode pads are provided on the opposed surfaces of the two electronic components and are electrically connected to the internal electric circuits. The pads on one of the electronic components are respectively electrically and mechanically connected to the corresponding pads on the other electronic component by solder bumps. The areas of the pads increase or decrease stepwise in the direction from the central portions toward the outer peripheral edges of the two electronic components, while the volumes of the solder bumps are constant. Alternatively, the volumes of the solder bumps decrease or increase in the direction from the central portions toward the outer peripheral edges of the two electronic components, while the areas of all pads are constant. Each of the pads of the two electronic components is bonded to an associated solder bump over the whole area of the pad, whereby the shapes of the solder bumps respectively connected to the pads of the two electronic components change in the direction from the central portions toward the outer peripheral edges of the two electronic components to provide the solder bumps with different durabilities to stress, thereby assuring high reliability of the connection between the two electronic components.

摘要翻译： 电子部件单元设置有彼此并联布置的两个电子部件，每个电子部件在其中具有内部电路。 电极焊盘设置在两个电子部件的相对表面上并与内部电路电连接。 其中一个电子部件上的焊盘通过焊料凸块分别电连接和机械连接到另一电子部件上的对应的焊盘。 焊盘的面积在从两个电子部件的中心部分朝向外周边缘的方向上逐渐增加或减小，而焊料凸块的体积是恒定的。 或者，焊料凸块的体积在从两个电子部件的中心部分朝向外周边缘的方向上减小或增加，而所有焊盘的面积是恒定的。 两个电子部件的每个焊盘在焊盘的整个区域上结合到相关联的焊料凸块，由此分别连接到两个电子部件的焊盘的焊料凸块的形状在从中心部分朝向 两个电子部件的外周边缘，以使焊料凸块具有不同的应力耐久性，从而确保两个电子部件之间的连接的高可靠性。

公开(公告)号：US5608265A

公开(公告)日：1997-03-04

申请号：US207697

申请日：1994-03-09

申请人： Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Ryuji Kohno ,  Naotaka Tanaka ,  Tetsuo Kumazawa

发明人： Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Ryuji Kohno ,  Naotaka Tanaka ,  Tetsuo Kumazawa

IPC分类号： H01L21/56 ,  H01L23/12 ,  H01L23/13 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L25/11 ,  H01L25/16 ,  H01L25/18 ,  H05K1/18 ,  H05K3/34 ,  H01L23/48 ,  H01L23/02 ,  H01L29/40

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/13 ,  H01L23/4951 ,  H01L23/49541 ,  H01L25/105 ,  H01L25/16 ,  H05K1/181 ,  H05K3/3436 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K2201/09472 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10818 ,  H05K2201/10931 ,  H05K3/3426 ,  H05K3/3431 ,  Y02P70/611 ,  Y02P70/613

摘要： A semiconductor device, provided in a plastic encapsulated package, having a semiconductor chip, a lead and a member for electrically connecting them together. The semiconductor device has one or more first holes respectively extending from one surface of the package to a first side of the lead which is provided inside of the package, and has one or more second holes formed which are aligned with the first holes, respectively, in a manner such that each second hole is extended from the opposing surface of the package to a corresponding location on a second side of the lead and is aligned with a corresponding, opposing first hole, in the package, extending to the first side of the lead. These holes are provided as a plurality of sets of individual pairs of aligned holes respectively extending inwardly, from opposing surfaces of the package, to opposite sides of the corresponding leads. In the device the leads or the leads with resin act as partitions thereby effecting isolation between the first and second holes of each pair aligned holes.

摘要翻译： 设置在塑料封装封装中的半导体器件具有半导体芯片，引线和用于将它们电连接在一起的部件。 半导体器件具有分别从封装的一个表面延伸到设置在封装内部的引线的第一侧的一个或多个第一孔，并且分别具有与第一孔对准的一个或多个第二孔， 以使得每个第二孔从包装的相对表面延伸到引线的第二侧上的对应位置并且与包装中的相应的相对的第一孔对准，延伸到包装的第一侧 铅。 这些孔被设置为多组对齐的对齐的孔，分别从包装的相对表面向内延伸到相应引线的相对侧。 在装置中，引线或具有树脂的引线作为隔板，从而实现每对对齐的孔的第一和第二孔之间的隔离。

公开(公告)号：US5895965A

公开(公告)日：1999-04-20

申请号：US933056

申请日：1997-09-18

申请人： Naotaka Tanaka ,  Makoto Kitano ,  Akihiro Yaguchi ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura

发明人： Naotaka Tanaka ,  Makoto Kitano ,  Akihiro Yaguchi ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura

IPC分类号： H01L21/60 ,  H01L23/12 ,  H01L23/16 ,  H01L23/495

CPC分类号： H01L23/16 ,  H01L2224/50 ,  H01L2924/3511

摘要： In order to provide a semiconductor device of high reliability which suppresses a degradation of the fatigue strength of solder connection portions and warping of a tape-type wiring substrate forming the cause of the inferior contact between solder bumps and an external substrate, and a method of manufacturing the semiconductor device, a frame-like member is disposed on the inner peripheral part of the tape-type wiring substrate so as to relax constraint on the thermal deformation of the tape-type semiconductor substrate.

摘要翻译： 为了提供高可靠性的半导体器件，其抑制焊料连接部的疲劳强度的劣化和形成焊料凸块与外部基板之间的不良接触的原因的带状布线基板的翘曲，以及 制造半导体器件时，框带状部件设置在带状布线基板的内周部上，以便放松对带状半导体基板的热变形的约束。

公开(公告)号：US5357139A

公开(公告)日：1994-10-18

申请号：US117639

申请日：1993-09-08

申请人： Akihiro Yaguchi ,  Asao Nishimura ,  Makoto Kitano ,  Ryuji Kohno ,  Nae Yoneda ,  Ichiro Anjoh ,  Gen Murakami

发明人： Akihiro Yaguchi ,  Asao Nishimura ,  Makoto Kitano ,  Ryuji Kohno ,  Nae Yoneda ,  Ichiro Anjoh ,  Gen Murakami

IPC分类号： H01L23/50 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/48

CPC分类号： H01L21/56 ,  H01L23/3142 ,  H01L23/49506 ,  H01L23/4951 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1815

摘要： In a package for DRAM, plastic is included between the common signal inner leads (bus bar inner leads) and insulating films arranged in the central part of a semiconductor chip. Thus, the deformation of plastic at the upper edge of the common signal inner leads is reduced and no great stress is generated at this portion. Accordingly, plastic cracking can be prevented.

摘要翻译： 在用于DRAM的封装中，在公共信号内引线（母线内引线）和布置在半导体芯片的中心部分的绝缘膜之间包括塑料。 因此，在公共信号内引线的上边缘处的塑料变形减小，并且在该部分处不产生大的应力。 因此，可以防止塑性开裂。

公开(公告)号：US5296737A

公开(公告)日：1994-03-22

申请号：US755655

申请日：1991-09-06

申请人： Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Nae Yoneda ,  Ryuji Kohno ,  Gen Murakami ,  Ichiro Anjoh

发明人： Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Nae Yoneda ,  Ryuji Kohno ,  Gen Murakami ,  Ichiro Anjoh

IPC分类号： H01L23/495 ,  H01L23/28

CPC分类号： H01L23/49575 ,  H01L23/49524 ,  H01L24/50

摘要： A semiconductor device comprises a plurality of semiconductor chips; electrodes formed on circuit surfaces of said plurality of semiconductor chips; inner leads made of a metal foil and bonded at first ends thereof to the electrodes, outer leads each having a predetermined surface at a first end thereof bonded to a second end of at least one of the inner leads, and a sealing material sealing said plurality of semiconductor chips, the electrodes, the inner leads, and part of each of the outer leads. The semiconductor chips are laminated in such a manner that those surfaces of the semiconductor chips on which their respective circuits are formed are disposed in facing relation to each other. This provides a semiconductor device which is excellent in assembling efficiency.

摘要翻译： 半导体器件包括多个半导体芯片; 形成在所述多个半导体芯片的电路表面上的电极; 内部引线由金属箔制成并在其第一端连接到电极，外部引线在其第一端处具有预定的表面，其结合至少一个内部引线的第二端;以及密封材料，密封所述多个 半导体芯片，电极，内引线和每个外引线的一部分。 半导体芯片以这样的方式层压，使得形成有各自电路的半导体芯片的那些表面彼此面对地设置。 这提供了组装效率优异的半导体器件。

公开(公告)号：US5256903A

公开(公告)日：1993-10-26

申请号：US797964

申请日：1991-11-26

申请人： Maya Obata ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Ryuji Kohno ,  Nae Yoneda ,  Ichiro Anjoh ,  Gen Murakami

发明人： Maya Obata ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Ryuji Kohno ,  Nae Yoneda ,  Ichiro Anjoh ,  Gen Murakami

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/30

CPC分类号： H01L23/49506 ,  H01L21/56 ,  H01L23/3142 ,  H01L23/4951 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01057 ,  H01L2924/181

摘要： A plastic encapsulated semiconductor device containing one or more of insulating films. Uneven surfaces, such as recesses and roughened surfaces, are strategically provided on peripheral side (edge) surfaces of the insulating films. As a result, therefore, an interface separation does not easily occur between the side surfaces of the insulating films and the encapsulating resin. If such an interface separation should occur, it cannot develop easily. Thus, it is possible to obtain a plastic encapsulated semiconductor device of a high level of reliability even when the largest possible semiconductor element is mounted therein within limited outside dimensions.

摘要翻译： 一种包含一种或多种绝缘膜的塑料封装半导体器件。 在绝缘膜的周边（边缘）表面上策略性地提供不均匀的表面，例如凹槽和粗糙表面。 因此，绝缘膜和封装树脂的侧面之间不容易发生界面分离。 如果这样的界面分离应该发生，就不容易开发。 因此，即使在有限的外部尺寸下将最大可能的半导体元件安装在其中，也可以获得高可靠性的塑料封装的半导体器件。

公开(公告)号：US06844219B2

公开(公告)日：2005-01-18

申请号：US10136409

申请日：2002-05-02

申请人： Makoto Kitano ,  Akihiro Yaguchi ,  Naotaka Tanaka ,  Takeshi Terasaki ,  Ichiro Anjoh ,  Ryo Haruta ,  Asao Nishimura ,  Junichi Saeki

发明人： Makoto Kitano ,  Akihiro Yaguchi ,  Naotaka Tanaka ,  Takeshi Terasaki ,  Ichiro Anjoh ,  Ryo Haruta ,  Asao Nishimura ,  Junichi Saeki

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/00 ,  H01L23/02 ,  H01L23/16 ,  H01L23/31 ,  H01L23/488 ,  H01L23/495 ,  H01L23/498 ,  H05K3/34 ,  H01L21/44

CPC分类号： H01L23/16 ,  H01L23/3128 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K3/3426 ,  H05K3/3436 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor device which can improve the connection reliability of solder bumps and productivity in manufacturing. Insulating tape having wiring patterns on its surface is bonded to a lead frame. Semiconductor elements are loaded and circuit formed surfaces and sides of the semiconductor elements are sealed with sealing resin. After arrangements of individual semiconductor devices are formed, the lead frame is separated into individual metal plates to form individual semiconductor devices. Such simultaneous production of a plurality of semiconductor devices enhances productivity, and improves flatness of the insulating tape, whereby the connection reliability of solder bumps is improved.

摘要翻译： 可以提高焊料凸块的连接可靠性和制造生产率的半导体器件。 在其表面具有布线图案的绝缘带被粘合到引线框架上。 半导体元件被加载并且电路形成的表面和半导体元件的侧面被密封树脂​​密封。 在形成各个半导体器件的布置之后，将引线框架分离成单独的金属板以形成单独的半导体器件。 这种同时生产多个半导体器件提高了生产率，并且提高了绝缘带的平坦度，从而提高了焊料凸块的连接可靠性。