A method of and apparatus for feeding electronic components are provided in which a group of electronic components joined to each other and stored in a stick are separated from each other before being supplied, regardless of the configuration at the joining ends of the electronic components as well as the presence of burrs developed during a molding process of the electronic components. In particular, a separating unit (6) comprises a step (20) which is dropped in level at the front end of a tilted chute (4) for receiving the forefront electronic component (2) and an arm (22) for holding down the succeeding electronic component (2) from above and causing the same to move backward along the tilted chute (4).