发明授权
- 专利标题： Metal material bonding method
- 专利标题（中）： 金属材料接合方法
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申请号： US246709申请日： 1999-02-09
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公开(公告)号： US6135345A公开(公告)日： 2000-10-24
- 发明人: Takao Shimizu , Noboru Yamamoto , Shigeyuki Inagaki , Hiroaki Suzuki
- 申请人： Takao Shimizu , Noboru Yamamoto , Shigeyuki Inagaki , Hiroaki Suzuki
- 申请人地址： JPX
- 专利权人： Daido Tokushuko Kabushiki Kaisha
- 当前专利权人： Daido Tokushuko Kabushiki Kaisha
- 当前专利权人地址： JPX
- 优先权： JPX10-044452 19980210
- 主分类号： H05B3/00
- IPC分类号： H05B3/00 ; B23K1/00 ; B23K13/00 ; B23K13/01 ; B23K20/00 ; B23K20/16 ; B23K31/02 ; B23K35/14 ; H05B6/10 ; B23K35/12
摘要：
In a metal material bonding method, an insertion material, which has a lower melting point than that of metal materials to be bonded, is interposed between bonding end surfaces of the metal materials to be bonded. The metal materials to be bonded is heated and held to a temperature not lower than the melting point of the insertion material and not higher than the melting point of the metal materials to be bonded while applying pressure to bonding surfaces of the metal materials to be bonded. The insertion material is formed to have a size which is smaller than each of the bonding surfaces of the metal materials to be bonded.
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