发明授权
US6143668A KLXX technology with integrated passivation process, probe geometry and
probing process
失效
KLXX技术具有集成钝化过程，探头几何和探测过程
- 专利标题： KLXX technology with integrated passivation process, probe geometry and probing process
- 专利标题（中）： KLXX技术具有集成钝化过程，探头几何和探测过程
-
申请号： US941795申请日： 1997-09-30
-
公开(公告)号： US6143668A公开(公告)日： 2000-11-07
- 发明人: M. Lawrence A. Dass , Kenneth D. Karklin , Krishna Seshan , Amir Roggel
- 申请人： M. Lawrence A. Dass , Kenneth D. Karklin , Krishna Seshan , Amir Roggel
- 申请人地址： CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： CA Santa Clara
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/768 ; H01L23/485 ; H01L21/31
摘要：
A method of exposing a bond pad includes: providing an integrated circuit having a bond pad, a first passivation layer overlying an area portion of the bond pad, and a second passivation layer overlying the first passivation layer; removing a portion of the second passivation layer above the area portion of the bond pad exposing an area of the first passivation layer; curing the second passivation; and etching a portion of the exposed area of the first passivation layer to expose the top surface of the bond pad. A method of coupling an integrated circuit chip to a chip package is also disclosed as is a method of probing the bond pads of an integrated circuit. A probe card is further disclosed, including a probe assembly coupled to a printed circuit board, the probe assembly having a sloped sidewall portion with a plurality of probing beams extending from the sidewall portion.
公开/授权文献
- US5295647A Pipe support and hanger system and method of making 公开/授权日：1994-03-22
信息查询
IPC分类:
