公开(公告)号：US06759858B2

公开(公告)日：2004-07-06

申请号：US09421210

申请日：1999-10-20

申请人： Amir Roggel

发明人： Amir Roggel

IPC分类号： G01R3102

CPC分类号： G01R1/06738 ,  G01R31/2886

摘要： An integrated circuit die test probe has a non-flat tip. In one embodiment, the tip has an elongated pyramid shape that provides a cutting action while probing solder covered conductive pads. The tip shape helps maintain a uniform tip to pad resistance during testing by penetrating the solder layer and avoiding solder residue build up. The test probes significantly reduce the need for cleaning the probe tips to remove residue.

摘要翻译： 集成电路模具测试探头具有非平坦的尖端。 在一个实施例中，尖端具有细长金字塔形状，其在探测焊料覆盖的导电焊盘的同时提供切割动作。 尖端形状有助于通过穿透焊料层并避免焊料残留物积聚而在测试期间保持均匀的尖端到焊盘电阻。 测试探针显着降低了清洁探针尖端以除去残留物的需要。

公开(公告)号：US06515358B1

公开(公告)日：2003-02-04

申请号：US09651388

申请日：2000-08-29

申请人： M. Lawrence A. Dass ,  Kenneth D. Karklin ,  Krishna Seshan ,  Amir Roggel

发明人： M. Lawrence A. Dass ,  Kenneth D. Karklin ,  Krishna Seshan ,  Amir Roggel

IPC分类号： H01L2306

CPC分类号： H01L24/03 ,  H01L21/76802 ,  H01L24/02 ,  H01L24/11 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/13099 ,  H01L2224/48227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10S438/958

摘要： A method of exposing a bond pad includes: providing an integrated circuit having a bond pad, a first passivation layer overlying an area portion of the bond pad, and a second passivation layer overlying the first passivation layer; removing a portion of the second passivation layer above the area portion of the bond pad exposing an area of the first passivation layer; curing the second passivation; and etching a portion of the exposed area of the first passivation layer to expose the top surface of the bond pad. A method of coupling an integrated circuit chip to a chip package is also disclosed as is a method of probing the bond pads of an integrated circuit. A probe card is further disclosed, including a probe assembly coupled to a printed circuit board, the probe assembly having a sloped sidewall portion with a plurality of probing beams extending from the sidewall portion.

摘要翻译： 暴露接合焊盘的方法包括：提供具有接合焊盘，覆盖接合焊盘的区域部分的第一钝化层和覆盖第一钝化层的第二钝化层的集成电路; 去除接合焊盘的区域部分上方的第二钝化层的暴露第一钝化层的区域的部分; 固化第二次钝化; 以及蚀刻所述第一钝化层的所述暴露区域的一部分以暴露所述接合焊盘的顶表面。 还公开了将集成电路芯片耦合到芯片封装的方法，这是一种探测集成电路的焊盘的方法。 还公开了一种探针卡，包括耦合到印刷电路板的探针组件，探针组件具有倾斜的侧壁部分，其具有从侧壁部分延伸的多个探测光束。

公开(公告)号：US06162652A

公开(公告)日：2000-12-19

申请号：US1969

申请日：1997-12-31

申请人： M. Lawrence A. Dass ,  Amir Roggel ,  Krishna Seshan

发明人： M. Lawrence A. Dass ,  Amir Roggel ,  Krishna Seshan

IPC分类号： G01R1/067 ,  G01R31/28 ,  H01L21/60 ,  H01L21/66 ,  H01L21/44

CPC分类号： H01L24/05 ,  G01R1/06733 ,  G01R31/2884 ,  G01R31/2886 ,  H01L24/02 ,  H01L24/03 ,  H01L24/11 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05027 ,  H01L2224/05554 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of testing an integrated circuit device including depositing a solder bump on a surface of a bond pad on an integrated circuit device, heat treating the solder bump, and testing the integrated circuit device by probing the solder bump.

摘要翻译： 一种测试集成电路器件的方法，包括在集成电路器件上的接合焊盘的表面上沉积焊料凸块，热处理焊料凸块，以及通过探测焊料凸块来测试集成电路器件。

公开(公告)号：US6143668A

公开(公告)日：2000-11-07

申请号：US941795

申请日：1997-09-30

申请人： M. Lawrence A. Dass ,  Kenneth D. Karklin ,  Krishna Seshan ,  Amir Roggel

发明人： M. Lawrence A. Dass ,  Kenneth D. Karklin ,  Krishna Seshan ,  Amir Roggel

IPC分类号： H01L21/60 ,  H01L21/768 ,  H01L23/485 ,  H01L21/31

CPC分类号： H01L24/03 ,  H01L24/11 ,  H01L21/76802 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/13099 ,  H01L2224/48227 ,  H01L24/02 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10S438/958

摘要： A method of exposing a bond pad includes: providing an integrated circuit having a bond pad, a first passivation layer overlying an area portion of the bond pad, and a second passivation layer overlying the first passivation layer; removing a portion of the second passivation layer above the area portion of the bond pad exposing an area of the first passivation layer; curing the second passivation; and etching a portion of the exposed area of the first passivation layer to expose the top surface of the bond pad. A method of coupling an integrated circuit chip to a chip package is also disclosed as is a method of probing the bond pads of an integrated circuit. A probe card is further disclosed, including a probe assembly coupled to a printed circuit board, the probe assembly having a sloped sidewall portion with a plurality of probing beams extending from the sidewall portion.

摘要翻译： 暴露接合焊盘的方法包括：提供具有接合焊盘的集成电路，覆盖接合焊盘的区域部分的第一钝化层和覆盖第一钝化层的第二钝化层; 去除接合焊盘的区域部分上方的第二钝化层的暴露第一钝化层的区域的部分; 固化第二次钝化; 以及蚀刻所述第一钝化层的所述暴露区域的一部分以暴露所述接合焊盘的顶表面。 还公开了将集成电路芯片耦合到芯片封装的方法，这是一种探测集成电路的焊盘的方法。 还公开了一种探针卡，包括耦合到印刷电路板的探针组件，探针组件具有倾斜的侧壁部分，其具有从侧壁部分延伸的多个探测光束。