发明授权
- 专利标题： Component carrier with raised bonding sites
- 专利标题（中）： 具有凸起粘结位置的组分载体
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申请号： US88834申请日： 1998-06-02
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公开(公告)号： US6150726A公开(公告)日： 2000-11-21
- 发明人: Natalie Barbara Feilchenfeld , Stephen Joseph Fuerniss , Michael Anthony Gaynes , Mark Vincent Pierson , Pat Hoontrakul
- 申请人： Natalie Barbara Feilchenfeld , Stephen Joseph Fuerniss , Michael Anthony Gaynes , Mark Vincent Pierson , Pat Hoontrakul
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corp.
- 当前专利权人： International Business Machines Corp.
- 当前专利权人地址： NY Armonk
- 主分类号： G03F7/00
- IPC分类号： G03F7/00 ; H01L21/48 ; H01L21/56 ; H01L21/60 ; H01L23/498 ; H05K3/12 ; H05K3/28 ; H05K3/32 ; H05K3/34 ; H05K1/11 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L29/62
摘要：
Chip carrier packages, integrated circuits, wiring boards, and assemblies in computer systems are made having conductive adhesive interconnections. Electrically conductive polymer paste with metal particles and powders are used with photoimagable polymer films to form the interconnection structure. These articles are produced with screening and printing processes using a screening head and printing machine.
公开/授权文献
- USD418426S Alarm clock 公开/授权日：2000-01-04
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