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公开(公告)号：US5759737A
公开(公告)日：1998-06-02
申请号：US709375
申请日：1996-09-06
申请人： Natalie Barbara Feilchenfeld , Stephen Joseph Fuerniss , Michael Anthony Gaynes , Mark Vincent Pierson , Pat Hoontrakul
发明人： Natalie Barbara Feilchenfeld , Stephen Joseph Fuerniss , Michael Anthony Gaynes , Mark Vincent Pierson , Pat Hoontrakul
IPC分类号： G03F7/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L23/498 , H05K3/12 , H05K3/28 , H05K3/32 , H05K3/34 , G03C5/00
CPC分类号： H01L24/16 , G03F7/00 , G03F7/0035 , H01L21/4853 , H01L21/4857 , H01L21/4867 , H01L21/563 , H01L23/49816 , H01L24/12 , H01L24/29 , H01L24/83 , H05K3/321 , H05K3/3484 , H01L2224/13099 , H01L2224/16225 , H01L2224/16238 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/29298 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/8319 , H01L2224/838 , H01L24/45 , H01L24/48 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/181 , H01L2924/3025 , H05K2201/0218 , H05K2201/0245 , H05K2201/10674 , H05K2201/10984 , H05K2203/0568 , H05K2203/0577 , H05K2203/0769 , H05K3/1216 , H05K3/28 , H05K3/3463
摘要： Chip carrier packages, integrated circuits, wiring boards, and assemblies in computer systems are made having conductive adhesive interconnections. Electrically conductive polymer paste with metal particles and powders are used with photoimagable polymer films to form the interconnection structure. These articles are produced with screening and printing processes using a screening head and printing machine.
摘要翻译： 计算机系统中的芯片载体封装，集成电路，布线板和组件被制成具有导电粘合剂互连。 具有金属颗粒和粉末的导电聚合物浆料与光可塑聚合物膜一起使用以形成互连结构。 这些物品使用筛选头和印刷机进行筛选和印刷。
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公开(公告)号：US6150726A
公开(公告)日：2000-11-21
申请号：US88834
申请日：1998-06-02
申请人： Natalie Barbara Feilchenfeld , Stephen Joseph Fuerniss , Michael Anthony Gaynes , Mark Vincent Pierson , Pat Hoontrakul
发明人： Natalie Barbara Feilchenfeld , Stephen Joseph Fuerniss , Michael Anthony Gaynes , Mark Vincent Pierson , Pat Hoontrakul
IPC分类号： G03F7/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L23/498 , H05K3/12 , H05K3/28 , H05K3/32 , H05K3/34 , H05K1/11 , H01L23/48 , H01L23/52 , H01L29/40 , H01L29/62
CPC分类号： H01L24/16 , G03F7/00 , G03F7/0035 , H01L21/4853 , H01L21/4857 , H01L21/4867 , H01L21/563 , H01L23/49816 , H01L24/12 , H01L24/29 , H01L24/83 , H05K3/321 , H05K3/3484 , H01L2224/13099 , H01L2224/16225 , H01L2224/16238 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/29298 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/8319 , H01L2224/838 , H01L24/45 , H01L24/48 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/181 , H01L2924/3025 , H05K2201/0218 , H05K2201/0245 , H05K2201/10674 , H05K2201/10984 , H05K2203/0568 , H05K2203/0577 , H05K2203/0769 , H05K3/1216 , H05K3/28 , H05K3/3463
摘要： Chip carrier packages, integrated circuits, wiring boards, and assemblies in computer systems are made having conductive adhesive interconnections. Electrically conductive polymer paste with metal particles and powders are used with photoimagable polymer films to form the interconnection structure. These articles are produced with screening and printing processes using a screening head and printing machine.
摘要翻译： 计算机系统中的芯片载体封装，集成电路，布线板和组件被制成具有导电粘合剂互连。 具有金属颗粒和粉末的导电聚合物浆料与光可塑聚合物膜一起使用以形成互连结构。 这些物品使用筛选头和印刷机进行筛选和印刷。
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公开(公告)号：US06492724B2
公开(公告)日：2002-12-10
申请号：US09798829
申请日：2001-03-02
IPC分类号： H01L2334
CPC分类号： H01L23/3135 , H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01046 , H01L2924/01078 , H01L2924/12044 , H01L2924/15311 , H01L2924/00
摘要： A structure and methods for reinforcing a semiconductor device to prevent cracking is provided. The device may take the form of a semiconductor chip or a semiconductor chip package. When a semiconductor chip is provided, an adhesion layer is applied over its top surface, followed by the application of a reinforcing layer over the adhesion layer. When a semiconductor chip package is provided, the package first undergoes a cleaning process, followed by the application of an adhesion layer over its top surface and, lastly, the application of a reinforcing layer over the adhesion layer.
摘要翻译： 提供了用于加强半导体器件以防止开裂的结构和方法。 该器件可以采取半导体芯片或半导体芯片封装的形式。 当提供半导体芯片时，在其顶表面上施加粘合层，随后在粘合层上施加增强层。 当提供半导体芯片封装时，封装首先进行清洁处理，然后在其顶表面上施加粘合层，最后在粘合层上施加增强层。
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公开(公告)号：US06255208B1
公开(公告)日：2001-07-03
申请号：US09236927
申请日：1999-01-25
申请人： William Emmett Bernier , Claude Louis Bertin , Anilkumar Chinuprasad Bhatt , Michael Anthony Gaynes , Erik Leigh Hedberg , Nikhil M. Murdeshwar , Mark Vincent Pierson , William R. Tonti , Paul A. Totta , Joseph John Van Horn , Jerzy Maria Zalesinski
发明人： William Emmett Bernier , Claude Louis Bertin , Anilkumar Chinuprasad Bhatt , Michael Anthony Gaynes , Erik Leigh Hedberg , Nikhil M. Murdeshwar , Mark Vincent Pierson , William R. Tonti , Paul A. Totta , Joseph John Van Horn , Jerzy Maria Zalesinski
IPC分类号： H01L2144
CPC分类号： H01L24/12 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13164 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0781 , H01L2924/09701 , H01L2924/14 , H01L2924/15747 , H01L2924/30107 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/3512
摘要： Selective electrical connections between an electronic component and a test substrate are made using an electrical conductive material. The conductive material of the present invention is a dissolvable material, allowing for rework and repair of a wafer at the wafer-level, and retesting at the wafer-level. In addition, the conductive material may also be used in a permanent package, since the conductive material of the present invention provides complete electrical conductivity and connection between the electronic component and the substrate.
摘要翻译： 使用导电材料制成电子部件和测试基板之间的选择性电连接。 本发明的导电材料是可溶解的材料，允许在晶片级对晶片进行返修和修复，并且在晶片级重新测试。 此外，由于本发明的导电材料提供完整的导电性和电子元件与基片之间的连接，导电材料也可用于永久性封装。
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公开(公告)号：US06252779B1
公开(公告)日：2001-06-26
申请号：US09237598
申请日：1999-01-25
IPC分类号： H05K702
CPC分类号： H05K3/3436 , H05K1/113 , H05K3/0094 , H05K3/3463 , H05K3/3484 , H05K2201/0959 , H05K2201/10992 , H05K2203/041 , Y02P70/613 , Y10T29/49144 , Y10T428/24273
摘要： A method for joining electronic devices such as integrated circuits to vias in a substrate. A solder ball attached to an electronic device is joined to a contact pad of a via by a low melting temperature solder. An opening of a via is plugged to prevent wicking of the low melting temperature solder into the via hole. The opening of the via is plugged using a solder ball or a compressed length of a wire material.
摘要翻译： 将诸如集成电路的电子器件连接到衬底中的通孔的方法。 附着在电子器件上的焊球通过低熔点焊料与通孔的接触焊盘接合。 堵塞通孔的开口以防止低熔点焊料芯线进入通孔。 通孔的开口使用焊球或线材的压缩长度进行堵塞。
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公开(公告)号：US06197619B1
公开(公告)日：2001-03-06
申请号：US09239382
申请日：1999-01-28
IPC分类号： H01L2144
CPC分类号： H01L23/3135 , H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01046 , H01L2924/01078 , H01L2924/12044 , H01L2924/15311 , H01L2924/00
摘要： A structure and methods for reinforcing a semiconductor device to prevent cracking is provided. The device may take the form of a semiconductor chip or a semiconductor chip package. When a semiconductor chip is provided, an adhesion layer is applied over its top surface, followed by the application of a reinforcing layer over the adhesion layer. When a semiconductor chip package is provided, the package first undergoes a cleaning process, followed by the application of an adhesion layer over its top surface and, lastly, the application of a reinforcing layer over the adhesion layer.
摘要翻译： 提供了用于加强半导体器件以防止开裂的结构和方法。 该器件可以采取半导体芯片或半导体芯片封装的形式。 当提供半导体芯片时，在其顶表面上施加粘合层，随后在粘合层上施加增强层。 当提供半导体芯片封装时，封装首先进行清洁处理，然后在其顶表面上施加粘合层，最后在粘合层上施加增强层。
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公开(公告)号：US6165885A
公开(公告)日：2000-12-26
申请号：US115130
申请日：1998-07-14
IPC分类号： B23K1/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L23/485 , H01L23/498 , H05K3/32 , H05K3/34 , H01L21/44
CPC分类号： H01L24/12 , B23K1/0016 , B23K2101/40 , H01L21/4867 , H01L21/563 , H01L23/49805 , H01L23/49811 , H01L23/49827 , H01L24/11 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L2224/05001 , H01L2224/05027 , H01L2224/05184 , H01L2224/05572 , H01L2224/11003 , H01L2224/1132 , H01L2224/11334 , H01L2224/1182 , H01L2224/1184 , H01L2224/13006 , H01L2224/13011 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/16237 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/742 , H01L2224/81136 , H01L2224/81191 , H01L2224/81193 , H01L2224/81801 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/04941 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19043 , H01L2924/3511 , H01L2924/3841 , H05K3/321 , H05K3/3436 , H05K3/3463 , H05K3/3484 , H05K2201/035 , H05K2201/10734 , H05K2201/10992 , H05K2203/0113 , H05K2203/0338 , H05K2203/043 , H05K2203/0557 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2224/29099 , H01L2224/05624 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2924/01004
摘要： An electronic component with solder ball connections is provided. A stencil is produced with holes passing through it in an arrangement corresponding to an arrangement of conductive pads on a substrate or integrated circuit. The stencil is made of a solder reflow compatible material. A layer of adhesive is applied to the stencil which is then positioned with the layer of adhesive adjacent the substrate or integrated circuit with the holes aligned with the conductive pads. Solder paste is deposited in the holes and is heated along with the conductive pads to form solder balls on the conductive pads.
摘要翻译： 提供了具有焊球连接的电子部件。 制造出一种模板，其孔穿过其中，其布置对应于衬底或集成电路上的导电焊盘的布置。 模板由回流焊料兼容的材料制成。 将一层粘合剂施加到模板，然后将其与粘合剂层邻近基板或集成电路定位，其中孔与导电垫对准。 将焊膏沉积在孔中并与导电焊盘一起加热，以在导电焊盘上形成焊球。
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公开(公告)号：US5875011A
公开(公告)日：1999-02-23
申请号：US834861
申请日：1997-04-10
IPC分类号： G02F1/13 , G02F1/1333 , H05K3/34 , H05K3/36 , H05K3/40 , G02F1/133 , G02F1/1345
CPC分类号： G02F1/13452 , G02F1/13336 , H05K3/3442 , H05K3/368 , H05K3/403
摘要： A liquid crystal display is provided wherein a plurality of liquid crystal display tiles are arranged in a matrix and are electrically interconnected to a tile carrier by depositing an electrically conductive metal on a sidewall edge of the liquid crystal display such as by plating, evaporation, or sputtering. Also provided is the method for forming the liquid crystal display.
摘要翻译： 提供了一种液晶显示器，其中多个液晶显示瓦片以矩阵形式布置并且通过在液晶显示器的侧壁边缘上沉积导电金属而电瓷互连到瓦片载体，例如通过电镀，蒸发或 溅射。 还提供了形成液晶显示器的方法。
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公开(公告)号：US5777705A
公开(公告)日：1998-07-07
申请号：US865713
申请日：1997-05-30
申请人： Mark Vincent Pierson , Steven F. Arndt , Michael Anthony Gaynes , Lawrence Richard Cutting , David Brian Stone
发明人： Mark Vincent Pierson , Steven F. Arndt , Michael Anthony Gaynes , Lawrence Richard Cutting , David Brian Stone
IPC分类号： G02F1/1333 , G02F1/1345
CPC分类号： G02F1/13336 , G02F1/1345 , H01L2224/45124 , H01L2224/45144 , H01L2224/48472 , H01L2924/01322
摘要： A plurality of liquid crystal display tiles arranged in a matrix are electrically interconnected to a tile carrier by wire bonds.
摘要翻译： 以矩阵形式布置的多个液晶显示瓦片通过引线接合与瓷砖载体电互连。
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公开(公告)号：US06740959B2
公开(公告)日：2004-05-25
申请号：US09921062
申请日：2001-08-01
申请人： David James Alcoe , Jeffrey Thomas Coffin , Michael Anthony Gaynes , Harvey Charles Hamel , Mario J. Interrante , Brenda Lee Peterson , Megan J. Shannon , William Edward Sablinski , Christopher Todd Spring , Randall Joseph Stutzman , Renee L. Weisman , Jeffrey Allen Zitz
发明人： David James Alcoe , Jeffrey Thomas Coffin , Michael Anthony Gaynes , Harvey Charles Hamel , Mario J. Interrante , Brenda Lee Peterson , Megan J. Shannon , William Edward Sablinski , Christopher Todd Spring , Randall Joseph Stutzman , Renee L. Weisman , Jeffrey Allen Zitz
IPC分类号： H01L23552
CPC分类号： H01L23/552 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/01087 , H01L2924/12044 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/16195 , H01L2924/3025 , H01L2924/00
摘要： Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.
摘要翻译： 包括EMI屏蔽的电子封装，特别是包含嵌入其中具有接地带的半导体芯片 - 载体结构的半导体器件，其适于减少高速开关电子封装的输出和入射EMI发射。
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