发明授权
- 专利标题： Embossed semiconductor fabrication parts
- 专利标题（中）： 浮雕半导体制造零件
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申请号： US924205申请日： 1997-09-05
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公开(公告)号： US6162297A公开(公告)日： 2000-12-19
- 发明人: Donald M. Mintz , Anantha Subramani , Lolita Sharp , David Datong Huo
- 申请人： Donald M. Mintz , Anantha Subramani , Lolita Sharp , David Datong Huo
- 申请人地址： CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： CA Santa Clara
- 主分类号： C23C14/56
- IPC分类号： C23C14/56 ; C23C16/44 ; C23C14/00 ; C23C16/00
摘要：
A semiconductor fabrication equipment component which is exposed to a film layer fabrication environment exhibits a surface which is embossed with a pattern to provide an enhanced surface area for particle retention. The component is fabricatable using numerous embossing techniques, including knurling. The embossed surface provides the enhanced surface area without imposing a particle load on the treated part.
公开/授权文献
- US5262096A Gas diffusion article 公开/授权日：1993-11-16
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