发明授权
- 专利标题: Polyamide resin composition
- 专利标题(中): 聚酰胺树脂组合物
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申请号: US259611申请日: 1999-03-01
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公开(公告)号: US6166171A公开(公告)日: 2000-12-26
- 发明人: Koji Yamamoto , Makoto Takahashi , Hisashi Shimazaki , Katsuya Maruyama
- 申请人: Koji Yamamoto , Makoto Takahashi , Hisashi Shimazaki , Katsuya Maruyama
- 申请人地址: JPX Tokyo
- 专利权人: Mitsubishi Gas Chemical Company, Inc.
- 当前专利权人: Mitsubishi Gas Chemical Company, Inc.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX10-055054 19980306
- 主分类号: C08G69/30
- IPC分类号: C08G69/30 ; C08G69/48 ; C08K5/098 ; C08K5/20 ; C08G73/10 ; B32B27/00 ; C08L77/00
摘要:
A polyamide resin composition comprising 100 parts by weight of a polyamide resin and 0.005 to 1.0 part by weight of at least one compound selected from the group consisting of a metal salt of a fatty acid, a diamide compound and a diester compound. The polyamide resin is obtained by solid phase-polymerizing a polyamide resin prepared by melt-polymerizing a diamine component containing 70 mol % or more of metaxylylenediamine and a dicarboxylic acid component containing 70 mol % or more of adipic acid, and preferably has a relative viscosity of 2.3 to 4.2 when measured at 25.degree. C. using a solution of 1 g polyamide resin in 100 ml of 96% sulfuric acid. By adding at least one compound selected from the group consisting of the specific metal salt of fatty acid, the diamide compound and the diester compound to a solid phase-polymerized polyamide resin, shaped articles such as films, sheets and hollow containers made of the solid phase-polymerized polyamide are improved in the resistance to whitening during storage tinder a high humid condition, upon contacting with water or boiling water, or upon heating to a glass transition temperature or higher.
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