发明授权
- 专利标题： Semiconductor encapsulating epoxy resin composition and semiconductor device
- 专利标题（中）： 半导体封装环氧树脂组合物和半导体器件
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申请号： US09003517申请日： 1998-01-06
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公开(公告)号： US06177489B1公开(公告)日： 2001-01-23
- 发明人: Satoshi Okuse , Kazutoshi Tomiyoshi , Toshio Shiobara , Takayuki Aoki , Eiichi Asano , Shigeki Ino
- 申请人： Satoshi Okuse , Kazutoshi Tomiyoshi , Toshio Shiobara , Takayuki Aoki , Eiichi Asano , Shigeki Ino
- 优先权： JP9-013133 19970108
- 主分类号： C08L6302
- IPC分类号： C08L6302
摘要：
A flame retardant epoxy resin composition suitable for semiconductor encapsulation contains (A) a crystalline epoxy resin whose 30 wt % m-cresol solution has a viscosity of lower than 80 centipoise at 25° C., (B) a curing agent having at least two phenolic hydroxyl groups, and (C) silica. The composition optionally contains (D) an organopolysiloxane, (E) an organic phosphine oxide, (F) an amide group-containing release agent, and/or (G) a silane coupling agent. The cured composition achieves flame retardance rating UL-94 V-0 without a need for flame retardants and remains stable at high temperature.