发明授权
- 专利标题： Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
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申请号： US09498267申请日： 2000-02-03
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公开(公告)号： US06245679B1公开(公告)日： 2001-06-12
- 发明人: Lee Melbourne Cook , David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr.
- 申请人： Lee Melbourne Cook , David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr.
- 主分类号： H01L2100
- IPC分类号： H01L2100
摘要：
An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which are particles having an imputed radius (of curvature) of about 0.5 to about 0.1 microns and sufficient resiliency to permanently deform by less than 10% which contact the wafer surface in combination with a reactive liquid solution.
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