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    Apparatus for forming a porous reaction injection molded chemical mechanical polishing pad
    1.
    发明授权
    Apparatus for forming a porous reaction injection molded chemical mechanical polishing pad 有权
    用于形成多孔反应注射成型的化学机械抛光垫的装置

    公开(公告)号：US07537446B2

    公开(公告)日：2009-05-26

    申请号：US11398260

    申请日：2006-04-04

    申请人： David B. James ,  John V. H. Roberts

    发明人： David B. James ,  John V. H. Roberts

    IPC分类号： B29C44/06 ,  B01F13/02

    CPC分类号： B01F3/1271 ,  B01F5/102 ,  B01F13/103 ,  B24B37/20 ,  B24D18/00 ,  B29B7/7461 ,  B29B7/748 ,  B29B7/7485 ,  B29B7/76 ,  B29B7/90 ,  B29C67/246 ,  B29K2075/00

    摘要： The present invention provides an apparatus for forming a chemical mechanical polishing pad, comprising a tank with polymeric materials, a storage silo with microspheres, a isocyanate storage tank with isocyanates and a premix prep tank for forming a pre-mixture of the polymeric materials and the microspheres. The invention further provides a premix run tank for storing the pre-mixture, a mixer for forming a mixture of the pre-mixture and the isocyanates, a closed mold for reaction-injection molding the mixture and a vacuum for degassing at least one of the tank, isocyanate storage tank or the mold.

    摘要翻译： 本发明提供了一种用于形成化学机械抛光垫的装置，包括具有聚合材料的罐，具有微球的储存仓，具有异氰酸酯的异氰酸酯储存罐和用于形成聚合物材料的预混合物的预混料制备罐 微球。 本发明还提供了一种用于储存预混合物的预混合运行罐，用于形成预混合物和异氰酸酯的混合物的混合器，用于反应注射成型混合物的封闭模具和用于将至少一种 罐，异氰酸盐储罐或模具。

    Method for forming a porous reaction injection molded chemical mechanical polishing pad
    3.
    发明授权
    Method for forming a porous reaction injection molded chemical mechanical polishing pad 有权
    形成多孔反应注塑化学机械抛光垫的方法

    公开(公告)号：US07399437B2

    公开(公告)日：2008-07-15

    申请号：US11398419

    申请日：2006-04-04

    申请人： David B. James ,  John V. H. Roberts

    发明人： David B. James ,  John V. H. Roberts

    IPC分类号： B29C44/06

    CPC分类号： C08G18/40 ,  B24D13/147 ,  B24D18/0009 ,  B29B7/726 ,  B29B7/749 ,  B29B7/90 ,  B29C67/246 ,  B29C70/66 ,  B29K2075/00 ,  C08G2120/00 ,  C08J9/0061 ,  C08J9/32 ,  C08J2375/04 ,  C08L75/04 ,  C08L2205/18 ,  C08L2666/04

    摘要： The present invention provides a method of forming a chemical mechanical polishing pad comprising, providing a tank with polymeric materials, providing a storage silo with microspheres and providing an isocyanate storage tank with isocyanates. The invention further provides delivering the polymeric materials and the microspheres to a premix prep tank, forming a pre-mixture of the polymeric materials and the microspheres, delivering the pre-mixture to a premix run tank and forming a mixture of the pre-mixture and the isocyanates. Further the invention provides injecting the mixture into a closed mold, curing the polishing pad in the mold and degassing at least one of the tank, isocyanate storage tank and the mold.

    摘要翻译： 本发明提供一种形成化学机械抛光垫的方法，其包括向罐提供聚合物材料，为储存仓提供微球，并向异氰酸酯储罐提供异氰酸酯。 本发明进一步提供了将聚合物材料和微球体递送到预混料制备罐，形成聚合物材料和微球体的预混合物，将预混合物输送到预混合槽中并形成预混合物和 异氰酸酯。 此外，本发明提供了将混合物注入封闭的模具中，固化模具中的抛光垫并且将罐，异氰酸酯储存罐和模具中的至少一个脱气。

    Methods for using polishing pads
    9.
    发明授权
    Methods for using polishing pads 失效
    使用抛光垫的方法

    公开(公告)号：US6017265A

    公开(公告)日：2000-01-25

    申请号：US782717

    申请日：1997-01-13

    申请人： Lee Melbourne Cook ,  David B. James ,  Charles William Jenkins ,  Heinz F. Reinhardt ,  John V. H. Roberts ,  Raj Raghav Pillai

    发明人： Lee Melbourne Cook ,  David B. James ,  Charles William Jenkins ,  Heinz F. Reinhardt ,  John V. H. Roberts ,  Raj Raghav Pillai

    IPC分类号： B24B37/04 ,  B24D3/26 ,  B24D3/28 ,  B24D13/14 ,  B24D18/00 ,  B29C43/00 ,  B24B1/00

    CPC分类号： B29C43/006 ,  B24B37/042 ,  B24B37/24 ,  B24D18/0009 ,  B24D3/26 ,  B24D3/28

    摘要： Polymer-based pads useful for polishing objects, particularly integrated circuits, having interconnected porosity which is uniform in all directions, and where the solid portion of said pad consists of a uniform continuously interconnected polymer material of greater than 50% of the gross volume of the article, are produced directly to final shape and dimension by pressure sintering powder compacts of thermoplastic polymer at a temperature above the glass transition temperature but not exceeding the melting point of the polymer and at a pressure in excess of 100 psi in a mold having the desired final pad dimensions. In a preferred version, a mixture of two polymer powders is used, where one polymer has a lower melting point than the other. When pressure sintered at a temperature not to exceed the melting point of the lower melting powder, the increased stiffness afforded by incorporation of the higher melting polymer component gives improved mechanical strength to the sintered product. Conditions for producing the pads of this invention are such that the polymer powder particles from which the pads are produced essentially retain their original shape and are point bonded to form the pad.

    摘要翻译： 用于抛光物体，特别是集成电路的聚合物基垫，具有在所有方向上均匀的相互连接的孔隙度，并且其中所述垫的固体部分由大于总体积的50％的均匀的连续相互连接的聚合物材料组成 制品通过在高于玻璃化转变温度但不超过聚合物的熔点并且在具有所需的模具的模具中的压力超过100psi的压力下加压烧结热塑性聚合物的粉末压块直接制成最终形状和尺寸 最终垫尺寸。 在优选的方案中，使用两种聚合物粉末的混合物，其中一种聚合物的熔点比另一种低。 当在不超过下熔融粉末的熔点的温度下进行压力烧结时，通过引入较高熔点的聚合物组分提供的增加的刚性使烧结产品具有改善的机械强度。 制造本发明的焊盘的条件使得制造焊盘的聚合物粉末颗粒基本上保持其原始形状并且被点焊以形成焊盘。

    Polishing pads
    10.
    发明授权
    Polishing pads 失效
    抛光垫

    公开(公告)号：US5605760A

    公开(公告)日：1997-02-25

    申请号：US517578

    申请日：1995-08-21

    申请人： John V. H. Roberts

    发明人： John V. H. Roberts

    IPC分类号： B24B37/20 ,  B24B37/26 ,  B24D7/12 ,  B24D13/12 ,  H01L21/304 ,  B24B1/00 ,  B24B3/60 ,  B24B29/00 ,  B32B33/00

    CPC分类号： B24B37/205 ,  B24B37/26 ,  Y10T428/31

    摘要： A pad is provided for use on a machine for the polishing of silicon wafers which allows the use of optical detection of the wafer surface condition as the wafer is being polished. This accomplished by constructing the entire pad or a portion thereof out of a solid uniform polymer sheet with no intrinsic ability to absorb or transport slurry particles and which is transparent to the light beam being used to detect the wafer surface condition by optical methods. Polymers which are transparent to light having a wavelength within the range of 190 to 3500 nanometers are suitable for the construction of these pads.

    摘要翻译： 提供了一种在机器上用于抛光硅晶片的焊盘，其允许当晶片被抛光时使用晶片表面状态的光学检测。 这通过将固体均匀的聚合物片材的整个垫片或其一部分构成，而不具有吸收或输送浆料颗粒的固有能力，并且通过光学方法用于检测晶片表面状态的光束是透明的。 对波长在190〜3500纳米范围内的光透明的聚合物适用于这些焊盘的构造。