Ceramic package type electronic part which is high in connection strength to electrode

发明授权

US06249049B1 Ceramic package type electronic part which is high in connection strength to electrode 失效

标题翻译：与电极连接强度高的陶瓷封装型电子部件

请登陆查看更多内容

专利标题： Ceramic package type electronic part which is high in connection strength to electrode
专利标题（中）： 与电极连接强度高的陶瓷封装型电子部件
申请号： US09330967

申请日： 1999-06-11
公开(公告)号： US06249049B1

公开(公告)日： 2001-06-19
发明人: Hiroshi Kamada , Naoharu Fukuhara , Katuya Terai , Hiroshi Katoh
申请人： Hiroshi Kamada , Naoharu Fukuhara , Katuya Terai , Hiroshi Katoh
优先权： JP10-165205 19980612; JP10-173712 19980619
主分类号： H01L2306
IPC分类号： H01L2306

Ceramic package type electronic part which is high in connection strength to electrode

摘要：

A ceramic package type electronic part for accommodating an electronic device includes a ceramic package body, an electrode, and a conductive adhesive. The electrode is disposed for the ceramic package body and is to be bonded to the electronic device. The conductive adhesive bonds the electronic device and the electrode to each other. The conductive adhesive is provided to be extended to a specific surface portion of a surface portion of the ceramic package body, from a bonding portion of the electronic device and the electrode.

摘要（中）：

用于容纳电子器件的陶瓷封装型电子部件包括陶瓷封装体，电极和导电粘合剂。电极被设置用于陶瓷封装主体并且将被结合到电子设备。导电粘合剂将电子器件和电极彼此粘合。导电粘合剂被设置成从电子器件的接合部分和电极延伸到陶瓷封装主体的表面部分的特定表面部分。

信息查询

Espacenet