发明授权
- 专利标题： Methods of making microelectronic components having electrophoretically deposited layers
- 专利标题（中）： 制造具有电泳沉积层的微电子部件的方法
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申请号： US09118735申请日： 1998-07-17
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公开(公告)号： US06266874B1公开(公告)日： 2001-07-31
- 发明人: Thomas H. DiStefano , John W. Smith , Konstantine N. Karavakis , Zlata Kovac , Joseph Fjelstad
- 申请人： Thomas H. DiStefano , John W. Smith , Konstantine N. Karavakis , Zlata Kovac , Joseph Fjelstad
- 主分类号： H05K310
- IPC分类号： H05K310
摘要：
A method of making a microelectronic component by providing a conductive element, providing a resist at selected locations on said conductive element and electrophoretically depositing an uncured dielectric material on the conductive element, wherein the uncured material will be deposited on the conductive element except at locations covered by the resist. The deposited material is cured to form a dielectric layer and the resist is removed so that the dielectric layer has openings extending to the conductive element at locations the locations which were covered by the resist.
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