公开(公告)号：US06239386B1

公开(公告)日：2001-05-29

申请号：US08695642

申请日：1996-08-12

申请人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

发明人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

IPC分类号： H01R909

CPC分类号： H01R13/2414 ,  H01R12/714 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/445 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0382 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts expand radially and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material carried on the contacts themselves.

公开(公告)号：US5590460A

公开(公告)日：1997-01-07

申请号：US277336

申请日：1994-07-19

申请人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

发明人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

IPC分类号： H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H05K3/36

CPC分类号： H01R13/2414 ,  H01R12/714 ,  H05K3/445 ,  H05K3/462 ,  H05K3/4641 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K2201/0382 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  H05K3/0032 ,  H05K3/4623 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts expand radially and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material carried on the contacts themselves.

摘要翻译： 用于微电子电路板之间的互连的插入件在其表面具有接触。 每个接触件具有垂直于表面的中心轴线和适于根据由接合电路板上的焊盘施加的力而从中心轴线径向向外扩张的外围部分。 因此，当电路板被内插件压缩时，触头径向膨胀并擦过焊盘。 擦拭动作有助于将接触件接合到焊盘，如通过接触件本身上承载的导电接合材料。

公开(公告)号：US06274820B1

公开(公告)日：2001-08-14

申请号：US09653930

申请日：2000-09-01

申请人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

发明人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

IPC分类号： H01R909

CPC分类号： H01R13/2414 ,  H01R12/714 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/445 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0382 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts expand radially and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material carried on the contacts themselves.

摘要翻译： 用于微电子电路板之间的互连的插入件在其表面具有接触。 每个接触件具有垂直于表面的中心轴线和适于根据由接合电路板上的焊盘施加的力而从中心轴线径向向外扩张的外围部分。 因此，当电路板被内插件压缩时，触头径向膨胀并擦过焊盘。 擦拭动作有助于将接触件接合到焊盘，如通过接触件本身上承载的导电接合材料。

公开(公告)号：US06266874B1

公开(公告)日：2001-07-31

申请号：US09118735

申请日：1998-07-17

申请人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

发明人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

IPC分类号： H05K310

CPC分类号： H01R13/2414 ,  H01R12/714 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/445 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0382 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method of making a microelectronic component by providing a conductive element, providing a resist at selected locations on said conductive element and electrophoretically depositing an uncured dielectric material on the conductive element, wherein the uncured material will be deposited on the conductive element except at locations covered by the resist. The deposited material is cured to form a dielectric layer and the resist is removed so that the dielectric layer has openings extending to the conductive element at locations the locations which were covered by the resist.

摘要翻译： 一种通过提供导电元件制造微电子元件的方法，在所述导电元件上的选定位置提供抗蚀剂并在导电元件上电泳沉积未固化的介电材料，其中未固化的材料将沉积在导电元件上，除了覆盖的位置 由抗蚀剂。 固化沉积的材料以形成电介质层，并且去除抗蚀剂，使得电介质层具有在被抗蚀剂覆盖的位置的位置处延伸到导电元件的开口。

公开(公告)号：US07067742B2

公开(公告)日：2006-06-27

申请号：US10033988

申请日：2001-12-28

申请人： Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

发明人： Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H05K3/4092 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00

摘要： A connection component for use in making microelectronic element assemblies which has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.

公开(公告)号：US06357112B1

公开(公告)日：2002-03-19

申请号：US09200100

申请日：1998-11-25

申请人： Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

发明人： Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

IPC分类号： H01R906

CPC分类号： H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H05K3/4092 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00

摘要： A connection component for use in making microelectronic element assemblies, has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.

摘要翻译： 用于制造微电子元件组件的连接部件具有形成在电介质支撑结构上的可剥离引线。 每个引线的一端永久地连接到支撑结构，并且引线的相对端可释放地连接到支撑结构。 当引线的可释放端接合到半导体芯片上的触点时，引线的可释放端可以从支撑结构剥离，使得芯片可以从支撑结构移开。 柔性层可以设置在芯片和支撑结构之间。 如果柔性材料在芯片和支撑结构之间注入以形成顺应性层，柔性材料将使芯片从支撑结构上提升，并促进引线从支撑结构的剥离。

公开(公告)号：US06265759B1

公开(公告)日：2001-07-24

申请号：US09120006

申请日：1998-07-21

申请人： Thomas H. DiStefano ,  Joseph Fjelstad ,  John W. Smith

发明人： Thomas H. DiStefano ,  Joseph Fjelstad ,  John W. Smith

IPC分类号： H01L23495

CPC分类号： H01L24/48 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

摘要： A semiconductor chip package having an internal laterally curved lead in order to compensate for the CTE mismatch between a semiconductor chip and a supporting substrate, such as a PWB.

摘要翻译： 一种具有内部横向弯曲引线的半导体芯片封装，以补偿半导体芯片和诸如PWB的支撑基板之间的CTE失配。

公开(公告)号：US5802699A

公开(公告)日：1998-09-08

申请号：US254991

申请日：1994-06-07

申请人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  A. Christian Walton

发明人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  A. Christian Walton

IPC分类号： G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10

CPC分类号： H05K7/1084 ,  G01R1/0466 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/72 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2485 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1069 ,  G01R1/06733 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  H01R4/028 ,  H05K1/118 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/3431 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A connector for microelectronic elements includes a sheet-like body having a plurality of holes, desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact such as a ring of a sheet metal having a plurality of projections extending inwardly over the hole of a first major surface of the body. Terminals on a second surface of the connector body are electrically connected to the contacts. The connector can be attached to a substrate such a multi-layer circuit panel so that the terminals on the connector are electrically connected to the leads within the substrate. Microelectronic elements having bump leads thereon may be engaged with the connector and hence connected to the substrate, by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

摘要翻译： 用于微电子元件的连接器包括具有多个孔的片状体，期望地布置成规则的格子图案。 每个孔设置有弹性层状接触，例如金属板的环，其具有在主体的第一主表面的孔的内部向内延伸的多个突起。 连接器主体的第二表面上的端子电连接到触点。 连接器可以附接到诸如多层电路板的基板，使得连接器上的端子电连接到基板内的引线。 具有凸起引线的微电子元件可以与连接器接合并且因此连接到基板，通过将凸块引线推进到连接器的孔中以与触点接合凸起引线。 可以测试组件，如果发现可接受，则凸块引线可以永久地粘合到触点上。

公开(公告)号：US06938338B2

公开(公告)日：2005-09-06

申请号：US10417746

申请日：2003-04-17

申请人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  James Zaccardi ,  A. Christian Walton

发明人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  James Zaccardi ,  A. Christian Walton

IPC分类号： B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H01R43/16 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10

CPC分类号： H05K7/1084 ,  G01R1/0466 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/06744 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/8114 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R12/7076 ,  H01R13/2485 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3431 ,  H05K3/3436 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

摘要： Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

摘要翻译： 诸如柔性的，片状的悬臂触点之类的微电子触点具有以规则图案设置的凹凸。 每个粗糙部分的尖端具有远离接触表面的尖端特征。 当配合的微电子元件与触点接合时，擦拭动作导致粗糙的尖锐特征刮擦配合元件，以便在触发和配合元件激活时提供有效的电互连以及可选的有效的冶金结合 接合材料。

公开(公告)号：US06205660B1

公开(公告)日：2001-03-27

申请号：US08845014

申请日：1997-04-22

申请人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

发明人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

IPC分类号： H01R4300

CPC分类号： H05K7/1084 ,  G01R1/0466 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/06744 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/8114 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R12/7076 ,  H01R13/2485 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3431 ,  H05K3/3436 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

摘要： Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

摘要翻译： 诸如柔性的，片状的悬臂触点之类的微电子触点具有以规则图案设置的凹凸。 每个粗糙部分的尖端具有远离接触表面的尖端特征。 当配合的微电子元件与触点接合时，擦拭动作导致粗糙的尖锐特征刮擦配合元件，以便在触发和配合元件激活时提供有效的电互连和任选的有效的冶金结合 接合材料。