- 专利标题： Method and system for dicing wafers, and semiconductor structures incorporating the products thereof
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申请号： US09032151申请日： 1998-02-27
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公开(公告)号： US06271102B1公开(公告)日： 2001-08-07
- 发明人: Donald W. Brouillette , Robert F. Cook , Thomas G. Ference , Wayne J. Howell , Eric G. Liniger , Ronald L. Mendelson
- 申请人： Donald W. Brouillette , Robert F. Cook , Thomas G. Ference , Wayne J. Howell , Eric G. Liniger , Ronald L. Mendelson
- 主分类号： H01L21301
- IPC分类号： H01L21301
摘要：
A method and system for dicing a semiconductor wafer providing a structure with greatly reduced backside chipping and cracking, as well as increased die strength. Semiconductor chip structures obtained from wafers diced according to this invention are also encompassed.