发明授权
- 专利标题： Methods for making circuit substrates and electrical assemblies
- 专利标题（中）： 制造电路基板和电气组件的方法
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申请号： US09397614申请日： 1999-09-16
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公开(公告)号： US06281040B1公开(公告)日： 2001-08-28
- 发明人: Mark Thomas McCormack , Hunt Hang Jiang , Solomon I. Beilin , Albert Wong Chan , Yasuhito Takahashi
- 申请人： Mark Thomas McCormack , Hunt Hang Jiang , Solomon I. Beilin , Albert Wong Chan , Yasuhito Takahashi
- 主分类号： H01L2144
- IPC分类号： H01L2144
摘要：
Methods for making circuit substrates and electrical assemblies are disclosed. A conductive composition is disposed between confronting conductive regions and can be cured to form a via structure. The conductive composition includes conductive particles and a carrier. The carrier can include a fluxing agent and an epoxy-functional resin having a viscosity of less than about 1000 centipoise at 25° C.
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