公开(公告)号：US06326555B1

公开(公告)日：2001-12-04

申请号：US09259126

申请日：1999-02-26

申请人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Thomas J. Massingill ,  Solomon I. Beilin

发明人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Thomas J. Massingill ,  Solomon I. Beilin

IPC分类号： H05K103

CPC分类号： H05K3/462 ,  H05K3/3484 ,  H05K2201/09536 ,  H05K2203/0191 ,  H05K2203/043 ,  H05K2203/0568 ,  Y10T29/49128

摘要： Structures, methods and materials for making multilayer circuit substrates are disclosed. The structures include bumped structures or microencapsulated conductive particles suitable for use in a lamination process to make a multilayer printed circuit substrate.

摘要翻译： 公开了用于制造多层电路基板的结构，方法和材料。 这些结构包括适于用于层压工艺以制造多层印刷电路基板的凸起结构或微胶囊化导电颗粒。

公开(公告)号：US06271107B1

公开(公告)日：2001-08-07

申请号：US09282788

申请日：1999-03-31

申请人： Thomas Massingill ,  Mark Thomas McCormack ,  Hunt Hang Jiang

发明人： Thomas Massingill ,  Mark Thomas McCormack ,  Hunt Hang Jiang

IPC分类号： H01L2144

CPC分类号： H01L24/12 ,  H01L21/563 ,  H01L23/3171 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05169 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/29111 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K3/0032 ,  H05K3/3484 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2924/00014

摘要： Bumped semiconductor substrates and methods for forming bumped semiconductor substrates are disclosed. The bumped semiconductor substrates have a polymeric layer, which can serve as a passivation layer for chips derived from the semiconductor substrate.

摘要翻译： 公开了凸起的半导体衬底和用于形成凸起的半导体衬底的方法。 凸起的半导体衬底具有聚合物层，其可以用作来自半导体衬底的芯片的钝化层。

公开(公告)号：US07513037B2

公开(公告)日：2009-04-07

申请号：US11060002

申请日：2005-02-17

申请人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Michael G. Peters ,  Yasuhito Takahashi

发明人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Michael G. Peters ,  Yasuhito Takahashi

IPC分类号： H01K3/10

CPC分类号： H01L24/82 ,  H01L23/5389 ,  H01L24/24 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K1/185 ,  H05K3/4602 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method for producing a circuit board having an integrated electronic component comprising providing a circuit board substrate having a first substrate surface and a second substrate surface, securing an integrated electronic component to the first substrate surface, and disposing a first dielectric layer on the first substrate surface and over the first integrated electronic component. The method additionally includes disposing a metallic layer on the first dielectric layer to produce an integrated electronic component assembly, producing in the integrated electronic component assembly at least one via having a metal lining in contact with the metallic layer, and disposing a second dielectric layer over the via and over the metallic layer. At least one metal-lined opening is formed in the second dielectric layer and in the first dielectric layer to expose at least part of the integrated electronic component, and to couple the metal lining of the opening to the first integrated electronic component to produce a circuit board having at least one integrated electronic component. A multi-layer printed circuit board having at least one prefabricated, integrated electronic component.

摘要翻译： 一种具有集成电子部件的电路板的制造方法，其特征在于，具备：提供具有第一基板表面和第二基板表面的电路板基板，将集成电子部件固定到所述第一基板表面，以及将第一电介质层设置在所述第一基板 表面和第一个集成电子部件。 该方法还包括在第一电介质层上设置金属层以产生集成的电子部件组件，在集成电子部件组件中产生具有与金属层接触的金属衬里的至少一个通孔，并且将第二电介质层设置在 通孔和金属层上。 在第二电介质层和第一电介质层中形成至少一个金属衬里的开口以暴露集成电子元件的至少一部分，并将开口的金属衬里连接到第一集成电子元件以产生电路 具有至少一个集成电子部件的板。 具有至少一个预制的集成电子部件的多层印刷电路板。

公开(公告)号：US6163957A

公开(公告)日：2000-12-26

申请号：US192003

申请日：1998-11-13

申请人： Hunt Hang Jiang ,  Thomas Massingill ,  Mark Thomas McCormack ,  Michael Guang-Tzong Lee

发明人： Hunt Hang Jiang ,  Thomas Massingill ,  Mark Thomas McCormack ,  Michael Guang-Tzong Lee

IPC分类号： H01R12/04 ,  H01L21/48 ,  H01L23/538 ,  H05K1/14 ,  H05K3/00 ,  H05K3/12 ,  H05K3/28 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46 ,  H01K3/10

CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L23/5385 ,  H01L2924/0002 ,  H05K3/0035 ,  H05K3/1216 ,  H05K3/28 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2203/0191 ,  H05K2203/1453 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T29/49167 ,  Y10T428/31678 ,  Y10T428/31681 ,  H01L2924/00

摘要： Multilayer circuit lamination methods and circuit layer structures are disclosed which enable one to manufacture high-density multichip module boards and the like at lower cost, with higher yield, with higher signal densities, and with fewer processing steps.

摘要翻译： 公开了多层电路层叠方法和电路层结构，其能够以更低的成本，更高的产量，更高的信号密度和更少的处理步骤来制造高密度多芯片模块板等。

公开(公告)号：US06882045B2

公开(公告)日：2005-04-19

申请号：US09997589

申请日：2001-11-29

申请人： Thomas J. Massingill ,  Mark Thomas McCormack ,  Wen-Chou Vincent Wang

发明人： Thomas J. Massingill ,  Mark Thomas McCormack ,  Wen-Chou Vincent Wang

IPC分类号： H01L21/48 ,  H05K3/00 ,  H05K3/10 ,  H05K3/24 ,  H05K3/46 ,  H01L23/34

CPC分类号： H01L21/486 ,  H01L24/96 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13023 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16237 ,  H01L2224/16501 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K3/0035 ,  H05K3/108 ,  H05K3/243 ,  H05K3/4602 ,  H05K3/4647 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1383 ,  H01L2924/01049 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： A method for deplating defective capacitors comprising forming a plurality of capacitors on a semiconductor substrate, forming a plurality of metal contacts on the plurality of capacitors, and depositing a layer of photoresist on the semiconductor substrate. The photoresist layer is patterned so that the plurality of metal contacts are exposed, which are then contacted with an electrically conductive solution. The metal contacts, which are disposed over defective capacitors, are subsequently deplated. A method for forming a multi-chip module comprising forming a thin-film polymeric interconnect structure having a pair of sides, one of which is disposed on a silicon substrate having active or passive devices and the other of which has a computer chip mounted thereon. A multi-chip module formed by the method.

摘要翻译： 一种用于去除有缺陷的电容器的方法，包括在半导体衬底上形成多个电容器，在多个电容器上形成多个金属触点，并在半导体衬底上沉积一层光致抗蚀剂。 图案化光致抗蚀剂层，使得多个金属触点暴露，然后与导电溶液接触。 随后将金属触点设置在不良电容器上，随后被去掉。 一种用于形成多芯片模块的方法，包括形成具有一对侧面的薄膜聚合物互连结构，其中一个侧面设置在具有有源或无源器件的硅衬底上，并且另一个具有安装在其上的计算机芯片。 通过该方法形成的多芯片模块。

公开(公告)号：US06866741B2

公开(公告)日：2005-03-15

申请号：US09757364

申请日：2001-01-08

申请人： Albert W. Chan ,  Michael G. Lee ,  Mark Thomas McCormack ,  Solomon I. Beilin

发明人： Albert W. Chan ,  Michael G. Lee ,  Mark Thomas McCormack ,  Solomon I. Beilin

IPC分类号： H01L21/60 ,  B32B7/12 ,  H01L21/58 ,  H01L21/68 ,  H05K3/34 ,  H05K3/46 ,  H01L21/46

CPC分类号： H01L21/6835 ,  B32B7/12 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73253 ,  H01L2224/8319 ,  H01L2224/83855 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3011 ,  H05K3/3489 ,  H05K3/4614 ,  H05K2203/0759 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/00012

摘要： A method for joining large area semiconductor substrates, a liquid thermoset polymer. Two large area substrates, such as wafers or circuit boards (e.g., rigid or flexible), can be joined together by dispensing a liquid polymer inwardly from the edges of the semiconductor substrates. The substrates can then be pressed together so that the liquid thermoset flows in an outwardly direction ward the edges of the semiconductor substrates. Conducting surfaces on the first and second substrates may contact each other after pressing the liquid thermoset polymer. The liquid thermoset polymer in the formed structure may then be cured to a hardened state. The liquid thermoset polymer preferable has a low viscosity, low levels of ionic contaminants, good adhesion to the substrates, low moisture absorbing properties and favorable thermal expansion properties.

摘要翻译： 一种用于连接大面积半导体衬底，液体热固性聚合物的方法。 通过从半导体衬底的边缘向内分配液体聚合物，可以将诸如晶片或电路板（例如刚性或柔性）的两个大面积衬底接合在一起。 然后可以将基板压在一起，使得液体热固性材料沿着朝向半导体基板边缘的向外方向流动。 在压制液态热固性聚合物之后，第一和第二基底上的导电表面可以彼此接触。 然后可以将所形成的结构中的液态热固性聚合物固化至硬化状态。 液体热固性聚合物优选具有低粘度，低水平的离子污染物，对基材的良好粘附性，低吸湿性和良好的热膨胀性能。

公开(公告)号：US06684007B2

公开(公告)日：2004-01-27

申请号：US09853449

申请日：2001-05-09

申请人： Tetsuzo Yoshimura ,  Yasuhito Takahashi ,  James Roman ,  Mark Thomas McCormack ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  Masaaki Inao

发明人： Tetsuzo Yoshimura ,  Yasuhito Takahashi ,  James Roman ,  Mark Thomas McCormack ,  Solomon I. Beilin ,  Wen-chou Vincent Wang ,  Masaaki Inao

IPC分类号： G02B626

CPC分类号： H01L24/82 ,  G02B6/06 ,  G02B6/10 ,  G02B6/12002 ,  G02B6/124 ,  G02B6/13 ,  G02B6/132 ,  G02B6/136 ,  G02B6/26 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/43 ,  G02B2006/12104 ,  G02B2006/12107 ,  G02B2006/12173 ,  H01L21/6835 ,  H01L23/48 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/96 ,  H01L25/167 ,  H01L2221/68345 ,  H01L2221/6835 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0274 ,  H05K1/14 ,  H01L2924/00 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05664

摘要： An optical apparatus including an optical substrate having an embedded waveguide and an optical device adapted to receive light transmitted from an end of the waveguide. The optical apparatus includes a coupling structure for coupling the optical device to the substrate. The coupling structure has a thin metallic layer with an aperture. At least a portion of the optical device is disposed in the aperture. A method for making an optical apparatus comprising forming an optical substrate having a waveguide embedded therein; depositing a metal layer over an end of the waveguide; and depositing a polymeric layer over the metal layer. An aperture is formed in the metal layer and in the polymeric layer by removing a portion of the metal layer and a portion of the polymeric layer disposed over the end of the waveguide. The method for making an optical apparatus also comprises inserting at least a portion of an optical device within the aperture so that the optical device is positioned to receive light from the first end of the waveguide.

摘要翻译： 一种光学装置，包括具有嵌入式波导的光学基板和适于接收从波导的端部传输的光的光学装置。 光学装置包括用于将光学装置耦合到基板的耦合结构。 耦合结构具有带孔的薄金属层。 光学装置的至少一部分设置在孔中。 一种制造光学装置的方法，包括：形成具有嵌入其中的波导的光学基板; 在所述波导的一端上沉积金属层; 以及在所述金属层上沉积聚合物层。 通过去除金属层的一部分和设置在波导端部上的聚合物层的一部分，在金属层和聚合物层中形成孔。 制造光学装置的方法还包括将光学装置的至少一部分插入孔内，使得光学装置被定位成接收来自波导的第一端的光。

公开(公告)号：US6054761A

公开(公告)日：2000-04-25

申请号：US203126

申请日：1998-12-01

申请人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Solomon I. Beilin ,  Albert Wong Chan ,  Yasuhito Takahashi

发明人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Solomon I. Beilin ,  Albert Wong Chan ,  Yasuhito Takahashi

IPC分类号： C08K3/00 ,  C08L63/00 ,  H01L23/498 ,  H05K3/40 ,  H05K3/46 ,  H01L23/04

CPC分类号： H05K3/363 ,  H01L23/49883 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H01L2224/16503 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10666 ,  H05K2203/0425 ,  H05K2203/0455 ,  H05K3/321 ,  H05K3/4623

摘要： Printed circuit substrates and electrical assemblies including a conductive composition are disclosed. The printed circuit substrate and the electrical assembly embodiments comprise a first conducting region and a second conducting region. A dielectric layer is disposed between the first and second conducting regions. An aperture is disposed in the dielectric layer and a via structure including the conductive composition is disposed in the aperture. The conductive composition is preferably in a cured state and electrically communicates with the first and second conducting regions. In preferred embodiments, the conductive composition comprises conductive particles in an amount of at least about 75 wt. % based on the weight of the composition. At least 50% by weight of the conductive particles have melting points of less than about 400.degree. C. The composition further includes a carrier including an epoxy-functional resin in an amount of at least about 50 wt. % based on the weight of the carrier, and a fluxing agent in an amount of at least about 0.1 wt % based on the weight of the carrier. The epoxy functional resin can have a viscosity of less than about 1000 centipoise at 25.degree. C.

摘要翻译： 公开了印刷电路基板和包括导电组合物的电气组件。 印刷电路基板和电组件实施例包括第一导电区域和第二导电区域。 电介质层设置在第一和第二导电区域之间。 在电介质层中设置孔，并且包括导电组合物的通孔结构设置在孔中。 导电组合物优选处于固化状态并与第一和第二导电区域电连通。 在优选的实施方案中，导电组合物包含至少约75wt。 基于组合物的重量％。 至少50重量％的导电颗粒具有小于约400℃的熔点。该组合物还包括载体，其包含至少约50重量％的量的环氧官能树脂。 基于载体的重量，以及基于载体重量的至少约0.1重量％的助熔剂。 环氧官能树脂在25℃下的粘度可以小于约1000厘泊

公开(公告)号：US5762866A

公开(公告)日：1998-06-09

申请号：US502941

申请日：1995-07-17

申请人： Sungho Jin ,  Mark Thomas McCormack

发明人： Sungho Jin ,  Mark Thomas McCormack

IPC分类号： B23K35/26 ,  C22C13/00 ,  C22C13/02

CPC分类号： C22C13/00 ,  B23K35/262

摘要： A high-strength Pb-free solder alloy, based on the Sn--Ag--Zn system, is disclosed. The Pb-free solder alloy contains, in weight percent, 0.2-0.6% Zn, 1-6% Ag, one or both 0.2-0.6% In and 0.2-0.6% Bi, and the balance Sn. The addition of Zn significantly improves the mechanical strength and creep resistance of e.g., Sn--3.5% Ag eutectic solder while maintaining substantially the same level of ductility. The increase in strength is as much as 48% over that of the Sn--3.5% Ag alloy. This strengthening from the Zn additions is attributed to a uniform solidification structure and a substantial refinement of the precipitates in the alloy. Essentially all of the added Zn resides in the more corrosion-resistant, Ag-based, intermetallic precipitates, leaving the Sn-rich matrix primarily free of Zn in solid solution.

摘要翻译： 公开了一种基于Sn-Ag-Zn系统的高强度无铅焊料合金。 无铅焊料合金以重量百分比含有0.2-0.6％的Zn，1-6％的Ag，一种或两种为0.2-0.6％的In和0.2-0.6％的Bi，余量为Sn。 Zn的添加显着提高例如Sn-3.5％Ag共晶焊料的机械强度和抗蠕变性，同时保持基本上相同的延展性水平。 强度比Sn-3.5％Ag合金高出48％。 Zn添加物的这种强化归因于合金中的均匀凝固结构和沉淀物的显着改进。 基本上所有添加的Zn都位于更耐腐蚀的Ag基金属间析出物中，使富含Sn的基体在固溶体中基本上不含Zn。

公开(公告)号：US06579474B2

公开(公告)日：2003-06-17

申请号：US09782384

申请日：2001-02-12

申请人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Solomon I. Beilin ,  Albert Wong Chan ,  Yasuhito Takahashi

发明人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Solomon I. Beilin ,  Albert Wong Chan ,  Yasuhito Takahashi

IPC分类号： H01B104

CPC分类号： H05K3/363 ,  H01L23/49883 ,  H01L2224/16503 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10666 ,  H05K2203/0425 ,  H05K2203/0455

摘要： A conductive composition, and articles and methods using the conductive composition are disclosed.

摘要翻译： 公开了导电组合物，以及使用导电组合物的制品和方法。